Sputtering target, method of fabricating the same, and method of fabricating an organic light emitting display apparatus

Patent metadata

Field	Value
Publication number	US-9416439-B2
Application number	US-201414223605-A
Country	US
Kind code	B2
Filing date	Mar 24, 2014
Priority date	Jul 29, 2013
Publication date	Aug 16, 2016
Grant date	Aug 16, 2016

Abstract

A method of fabricating a sputtering target is provided. The method includes preparing a first powder material, wherein the first powder material includes tin oxide; preparing a mixture by mixing the first powder material and a second powder material, wherein the second powder material includes carbon; and fabricating the sputtering target by compressing and sintering the mixture simultaneously in a reducing atmosphere.

First claim

What is claimed is:

1. A method of manufacturing an organic light-emitting display apparatus, the method comprising:
forming an organic light-emitting unit on a substrate, wherein the organic light-emitting unit includes a lower electrode, an organic light-emitting layer, and an upper electrode; and
forming a thin film encapsulation layer on the organic light-emitting unit by a sputtering process using a sputtering target,
wherein the sputtering target comprises a first powder material including tin oxide and a second powder material including carbon, wherein the first powder material and the second powder material are homogeneously mixed in the sputtering target, and wherein the sputtering target is formed from a preliminary sputtering target that is rich of tin cations,
wherein the carbon included in the second powder material is oxidized and depleted during the sputtering process, and
wherein the thin film encapsulation layer includes the first powder material, and the carbon included in the second powder material is omitted from the thin film encapsulation layer.

2. The method of claim 1 , wherein the sputtering target further comprises at least one of phosphor oxide, boron phosphate, tin fluoride, niobium oxide, silicon oxide, lead fluoride, tungsten oxide, zinc oxide, and boron oxide,
and the thin film encapsulation layer further comprises at least one of the phosphor oxide, boron phosphate, tin fluoride, niobium oxide, silicon oxide, lead fluoride, tungsten oxide, zinc oxide, and boron oxide that is included in the sputtering target.

3. The method of claim 1 , wherein the second powder material includes at least one of carbon black powder and carbon nanotubes.

4. The method of claim 1 , wherein the second powder material includes carbon black powder, and wherein the sputtering target includes about 1 wt % to about 20 wt % of the carbon black powder and about 80 wt % to about 99 wt % of the first powder material.

5. The method of claim 1 , wherein the second powder material includes carbon nanotubes, and wherein the sputtering target includes about 0.1 wt % to about 10 wt % of the carbon nanotubes and about 90 wt % to about 99.9 wt % of the first powder material.

6. The method of claim 1 , further comprising:
mixing and melting a first raw material and a second raw material;
solidifying the first raw material and the second raw material by rapid cooling;
pulverizing the first raw material and the second raw material to form the first power material;
mixing the first power material and the second power material to form a mixture;
compressing and sintering the mixture to form the preliminary sputtering target; and
polishing and post-treating the preliminary sputtering target to form the sputtering target.

7. The method of claim 6 , further comprising fabricating the preliminary sputtering target using a target fabrication apparatus, wherein the target fabrication apparatus comprises a container for holding the mixture, a heating unit for heating the mixture; and one or more plates for pressuring the mixture.

8. The method of claim 7 , further comprising: forming the preliminary target in a reducing atmosphere to eliminate oxygen from the mixture.

9. The method of claim 8 , further comprising:
including second carbon in the container;
exposing the mixture with the second carbon on an inner surface portion of the container; and
heating the mixture to sinter, causing the second carbon in the container to combine with oxygen from the mixture.

10. The method of claim 9 , further comprising eliminating the oxygen from the mixture by the reducing atmosphere and forming the tin cations in the mixture.

11. The method of claim 10 , further comprising forming a layer of the tin cations.

12. The method of claim 11 , further comprising simultaneously compressing and sintering the mixture to form the preliminary target that is rich of the tin cations and free of a binder material.

Assignees

• Samsung Display Co Ltd

Inventors

• Sin Sang-Wook
• Jung Sun-Young
• Lee Il-Sang
• Park Jin-Woo
• Kim Dong-Jin

Classifications

• H10K59/873

  Encapsulations · CPC title

• B29K2105/251

  Particles, powder or granules (expandable particles B29K2105/046) · CPC title

• C23C14/3414 Primary

  Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy · CPC title

• C23C14/08

  Oxides (C23C14/10 takes precedence) · CPC title

• C23C24/10

  with intermediate formation of a liquid phase in the layer · CPC title