Molding and overmolding compositions for electronic devices

Patent metadata

Field	Value
Publication number	US-9415532-B2
Application number	US-201514816809-A
Country	US
Kind code	B2
Filing date	Aug 3, 2015
Priority date	Nov 2, 2012
Publication date	Aug 16, 2016
Grant date	Aug 16, 2016

Abstract

The present invention relates to molding and overmolding compositions for delicate components. More particularly the invention relates to compositions for low pressure molding and overmolding, making these compositions particularly well suited for electronic devices. The molding and overmolding composition is suitable for low pressure injection molding processes, particularly at 0.5 to 200 bars at 70° C. to 240° C.

First claim

We claim:

1. A method of forming an overmold over an electronic component comprising the steps of:
(a) preparing an overmolding composition comprising:
1) an [A]-[B]-[A] copolymer, wherein [A] is a hard-block monomer with a Tg greater than about 30° C. and [B] is a soft-block monomer with a Tg less than about 20° C., and the copolymer comprises greater than 35 wt % of the [A] monomer;
2) a tackifying resin;
3) about 0.05 to about 5 wt % of a UV absorber selected from the group consisting of benzotriazoles, triazines and benzophenones; and

wherein the wt % is based on the total weight of the composition;
(b) applying the overmolding composition on the electronic component at a pressure less than 150 bars; and
(c) cooling the overmolding composition.

2. The method of claim 1 , wherein the overmolding composition is applied with pressure less than 120 bars.

3. The method of claim 2 , wherein the overmolding composition is applied with pressure less than 60 bars.

Assignees

• Henkel IP & Holding GmbH
• Henkel IP Holding GmbH

Inventors

• Cain Cynthia L
• Paul Charles W
• Dejesus Maria Cristina Barbosa

Classifications

• B29C45/0001

  characterised by the choice of material · CPC title

• B29C33/12

  with incorporated means for positioning inserts, e.g. labels {(positioning reinforcements B29C70/541)} · CPC title

• B29C45/14065

  Positioning or centering articles in the mould · CPC title

• Y10T428/23

  Sheet including cover or casing · CPC title

• B29K2033/08

  Polymers of acrylic acid esters, e.g. PMA, i.e. polymethylacrylate · CPC title