Metal earpad

US9414966B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9414966-B2
Application numberUS-201314655623-A
CountryUS
Kind codeB2
Filing dateDec 20, 2013
Priority dateDec 28, 2012
Publication dateAug 16, 2016
Grant dateAug 16, 2016

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

An earpad ( 1 ) to provide an interface between an earcup ( 4 ) of a headset ( 7 ), a headphone ( 8 ) or an ear defender ( 9 ). The earpad ( 1 ) comprises a contact surface ( 2 ) contacting the skin ( 10 ) of the ear ( 11 ) or ear surroundings of the user. The earpad ( 1 ) comprises one or more metal members ( 3, 6, 12, 13, 33 ) to transfer heat away from the contact surface ( 2 ).

First claim

Opening claim text (preview).

The invention claimed is: 1. A heat sinking earpad to provide an interface between an earcup of a headset or an ear defender, wherein the earpad comprises a contact surface contacting the skin of the ear or ear surrounding, wherein the earpad includes at least one heat conductive metal element, a metal heat conductor; and wherein at least one of the metal elements is in contact with the metal heat conductor so that heat is conducted away from the metal elements; and wherein the metal elements comprise a plurality of displaceable heat conducting metal balls. 2. The earpad according to claim 1 further including a flexible cover layer having a flexible heat conductive metal mesh therein. 3. The earpad according to claim 2 , wherein the flexible cover layer includes a pliable metal foil. 4. The earpad according to claim 1 , wherein the earpad body comprise metal wool. 5. The earpad according to claim 1 , wherein the metal elements include a plurality of discrete freely displaceable elements confined by the flexible cover layer. 6. The earpad according to claim 2 , wherein the flexible cover layer comprises a metal foil. 7. An earpad to provide an interface between an earcup of a headset or an ear defender, wherein the earpad comprises a contact surface contacting the skin of the ear or ear surrounding, wherein the earpad includes at least one metal element, a metal heat conductor; and wherein at least one of the metal elements is in contact with the metal heat conductor so that heat is conducted away from the metal elements, wherein the metal heat conductors include springs. 8. An earpad to provide an interface between an earcup of a headset or an ear defender, wherein the earpad comprises a contact surface contacting the skin of the ear, wherein the earpad includes at least one metal elements, a metal heat conductor; and wherein at least one of the metal elements comprises a plurality of displaceable metal balls and wherein at least one of said elements is in contact with the metal heat conductor so that heat is conducted away from the metal elements. 9. The earpad of claim 8 wherein said metal balls are generally immersed in a liquid. 10. An earpad to provide an interface between an earcup of a headset or an ear defender, wherein the earpad comprises a contact surface contacting the skin of the ear, wherein the earpad includes at least one metal elements, a metal heat conductor; and wherein at least one of the metal elements is in contact with the metal heat conductor so that heat is conducted away from the metal elements, and further including a flexible cover layer having a flexible heat conductive metal mesh therein. 11. The earpad according to claim 6 , wherein the flexible cover layer includes said pliable metal mesh. 12. An earpad to provide an interface between an earcup of a headset or an ear defender, wherein the earpad comprises a contact surface contacting the skin of the ear or ear surrounding, wherein the earpad includes at least one metal elements, a metal heat conductor; and wherein at least one of the metal elements is in contact with the metal heat conductor so that heat is conducted away from the metal elements, and further including a flexible cover layer having a flexible heat conductive metal mesh therein; and wherein the metal mesh on the contact surface is covered with a thin layer of material. 13. The earpad according to claim 10 , wherein the earpad body comprise metal wool. 14. The earpad according to claim 9 , wherein the flexible cover layer includes a liquid. 15. The earpad according to claim 9 , wherein the earpad body includes a liquid. 16. An earpad according to claim 1 , wherein the metal heat conductors include springs, which can be shortened, when a compressive force is added to the metal element. 17. An earpad according to claim 16 , wherein the metal heat conductors are in contact with a metal heat sink, which dissipates heat into the surrounding air.

Assignees

Inventors

Classifications

  • Earpieces of the supra-aural or circum-aural type · CPC title

  • A61F11/14Primary

    external, e.g. earcaps or earmuffs · CPC title

Patent family

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External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9414966B2 cover?
An earpad ( 1 ) to provide an interface between an earcup ( 4 ) of a headset ( 7 ), a headphone ( 8 ) or an ear defender ( 9 ). The earpad ( 1 ) comprises a contact surface ( 2 ) contacting the skin ( 10 ) of the ear ( 11 ) or ear surroundings of the user. The earpad ( 1 ) comprises one or more metal members ( 3, 6, 12, 13, 33 ) to transfer heat away from the contact surface ( 2 ).
Who is the assignee on this patent?
Gn Netcom As
What technology area does this patent fall under?
Primary CPC classification A61F11/14. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Aug 16 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).