Electronic power module arrangement

Patent metadata

Field	Value
Publication number	US-9414532-B2
Application number	US-201314401416-A
Country	US
Kind code	B2
Filing date	May 13, 2013
Priority date	May 16, 2012
Publication date	Aug 9, 2016
Grant date	Aug 9, 2016

Abstract

The invention provides an electrical power module, including power transistors, and control components for controlling said power transistors, said module being cooled, in particular, by heat conduction. The module of the invention further includes a main substrate of the AMB/Si3N4 type carrying the power transistors, this main substrate itself constituting a heat-dissipating baseplate for dissipating the heat generated by the power transistors by being arranged in the module to be directly in contact with the carrier structure that provides cooling by conduction when said module is in place, and a ceramic substrate carrying the control components, this ceramic substrate itself being carried by the main substrate.

First claim

The invention claimed is:

1. An electrical power module, including power transistors, and control components for controlling said power transistors, said module being cooled by heat conduction, and said electrical power module further including:
a main substrate of the AMB/Si 3 N 4 type carrying the power transistors, this main substrate itself constituting a heat-dissipating baseplate for dissipating the heat generated by the power transistors by being arranged in the module to be directly in contact with the carrier structure that provides cooling by conduction when said module is in place; and
a ceramic substrate carrying the control components, this ceramic substrate itself being carried by the main substrate.

2. The module according to claim 1 , wherein the tracks of the main substrate and the tracks of the ceramic substrate carried by said main substrate are interconnected by wires, each of which has one end bonded to a track of the main substrate and another end bonded to a track of the ceramic substrate.

3. The module according to claim 1 , wherein the ceramic substrate is of the thick-layer alumina type.

4. The module according to claim 1 , further including power connection pads, each of which is in the form of a strip of conductive metal sheet cut out and folded to hold a clamping nut captive, each pad being fastened to the main substrate by bonding one or more ends of the folded strip of metal sheet of which it is made to a track of said substrate, each nut being arranged to receive a fastening bolt for fastening a power supply member to the pad.

5. The module according to claim 4 , further including a power bus in the form of a laminated part made up of layers of copper and of Kapton and having terminals in the form of holes, this bus being fastened to the remainder of the module by means of fastening bolts passing through the module while being screwed into the pads.

6. The module according to claim 5 , including a metal chassis, and wherein the power bus has a layer of copper that is in abutment against the chassis when the bus is in place, in such a manner as to co-operate with the chassis to constitute a Faraday cage.

Assignees

• Sagem Defense Securite

Inventors

• Roche Olivier

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W76/15

  Containers comprising an insulating or insulated base · CPC title

• H10W40/255 Primary

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title