Metal paste composition

Patent metadata

Field	Value
Publication number	US-9414487-B2
Application number	US-201214005618-A
Country	US
Kind code	B2
Filing date	Mar 6, 2012
Priority date	Mar 18, 2011
Publication date	Aug 9, 2016
Grant date	Aug 9, 2016

Abstract

The present invention provides a metal paste composition which can obtain the calcined bodies having low volume resistivity in a wiring substrate after calcining. More specifically, the present invention provides a metal paste composition comprising a metal, an aliphatic polycarbonate, and an organic solvent.

First claim

The invention claimed is:

1. A metal paste composition comprising a metal, an aliphatic polycarbonate, and an organic solvent,
wherein the aliphatic polycarbonate is an aliphatic polycarbonate in which an epoxide and carbon dioxide are polymerized, and
the metal is at least one selected from the group consisting of gold, silver, copper, nickel, platinum, palladium, lead, titanium, barium, boron, and an alloy of two or more kinds thereof.

2. The metal paste composition according to claim 1 , wherein the aliphatic polycarbonate is at least one selected from the group consisting of polyethylene carbonate and polypropylene carbonate.

3. The metal paste composition according to claim 1 , wherein the amount of the aliphatic polycarbonate used is 0.001 to 10 parts by mass based on 100 parts by mass of the metal.

4. The metal paste composition according to claim 1 , wherein the metal is at least one selected from the group consisting of gold, silver, platinum, and an alloy thereof.

5. The metal paste composition according to claim 1 , wherein the organic solvent is at least one selected from the group consisting of α-terpineol, N-methyl-2-pyrrolidone, and propylene carbonate.

6. The metal paste composition according to claim 1 , wherein the amount of organic solvent used is 0.001 to 50 parts by mass based on 100 parts by mass of the metal.

Assignees

• Fujimoto Nobutaka
• Kawakita Tomoki
• Miyabara Ryou
• Nakamoto Masami
• Ohno Toshinobu
• Yamamoto Mari
• Kashiwagi Yukiyasu
• Sumitomo Seika Chemicals
• Osaka Municipal Tech Res Inst

Inventors

• Fujimoto Nobutaka
• Kawakita Tomoki
• Miyabara Ryou
• Nakamoto Masami
• Ohno Toshinobu
• Yamamoto Mari
• Kashiwagi Yukiyasu

Classifications

• C08K5/3415

  Five-membered rings · CPC title

• H05K1/095

  for polymer thick films, i.e. having a permanent organic polymeric binder · CPC title

• H05K1/092 Primary

  Dispersed materials, e.g. conductive pastes or inks · CPC title

• C08K5/109

  of carbonic acid {, e.g. R-O-C(=O)-O-R} · CPC title

• H01B1/22 Primary

  the conductive material comprising metals or alloys · CPC title