High density cabled midplanes and backplanes

US9413097B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9413097-B2
Application numberUS-201414578707-A
CountryUS
Kind codeB2
Filing dateDec 22, 2014
Priority dateDec 22, 2014
Publication dateAug 9, 2016
Grant dateAug 9, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A cabled midplane includes a first support plate along a plane between a first connector set and a second connector set that connect to line cards on either side of the cabled midplane. The first connector set and the second connector set include connector slices. A wiring sub-layer includes cable slices to provide a connection between the first connector slice of a connector of the first connector set to the first connector slice of a connector of the second connector set, such that the first wiring sub-layer connects each connector of the first connector set, through one cable slice, to a connector of the second connector set. Additional wiring sub-layers are added, and a second support plate, parallel to the first support plate, is provided to encase and support the wiring sub-layers between the first support plate and the second support plate. Other apparatuses and methods are described.

First claim

Opening claim text (preview).

What is claimed is: 1. A cabled midplane comprising: a first support plate along a plane between a first connector set and a second connector set, the first connector set including a plurality of connectors to connect to respective line cards on a first side of the cabled midplane, the second connector set including a plurality of connectors to connect to respective line cards on a second side of the cabled midplane, connectors of the first connector set and the second connector set including a plurality of connector slices, the plurality of connector slices including at least a first connector slice that is a first distance along a first axis from the first support plate and a second connector slice that is a second distance, further than the first distance, along the first axis from the first support plate; a first wiring sub-layer including a first plurality of cable slices mounted on the first support plate, each cable slice of the first plurality of cable slices to provide a connection between the first connector slice of a connector of the first connector set to the first connector slice of a connector of the second connector set, such that the first wiring sub-layer connects each connector of the first connector set, through one cable slice, to a connector of the second connector set; at least a second wiring sub-layer including a second plurality of cable slices, each cable slice of the second plurality of cable slices to provide a connection between the second connector slice of a connector of the first connector set to the second connector slice of a connector of the second connector set, such that the second wiring sub-layer connects each connector of the first connector set, through one cable slice, to a connector of the second connector set; and a second support plate, parallel to the first support plate, to encase the first wiring sub-layer and the second wiring sub-layer between the second support plate and the first support plate and to form a first wiring layer of the cabled midplane. 2. The cabled midplane of claim 1 , further including a power layer. 3. The cabled midplane of claim 2 , wherein the power layer is not connected to conductors of either the first wiring sub-layer or the second wiring sub-layer. 4. The cabled midplane of claim 1 , wherein a connector of the first connector set is connected to a different connector of the second connector set in the second wiring sub-layer than the respective connector of the first connector set is connected to in the first wiring sub-layer. 5. The cabled midplane of claim 1 , wherein each cable slice includes a plurality of conductors, and wherein, cable slices are mounted such that a conductor crosses over other conductors of the plurality of conductors at no more than one point in the plane between the first connector set and the second connector set. 6. A communication device including: a cabled midplane including a first connector set and a second connector set, the first connector set including a plurality of connectors to connect to respective line cards on a first side of the cabled midplane, the second connector set including a plurality of connectors to connect to respective line cards on a second side of the cabled midplane, connectors of the first connector set and the second connector set including a plurality of connector slices; a first support plate positioned along a plane between the first connector set and the second connector set, wherein the plurality of connector slices include at least a first connector slice that is a first distance along a first axis from the first support plate and a second connector slice that is a second distance, further than the first distance, along the first axis from the first support plate; a first wiring sub-layer including a first plurality of cable slices mounted on the first support plate, each cable slice of the first plurality of cable slices to provide a connection between the first connector slice of a connector of the first connector set to the first connector slice of a connector of the second connector set, such that the first wiring sub-layer connects each connector of the first connector set, through one cable slice, to a connector of the second connector set; at least a second wiring sub-layer including a second plurality of cable slices, each cable slice of the second plurality of cable slices to provide a connection between the second connector slice of a connector of the first connector set to the second connector slice of a connector of the second connector set, such that the second wiring sub-layer connects each connector of the first connector set, through one cable slice, to a connector of the second connector set; and a second support plate, parallel to the first support plate, to encase the first wiring sub-layer and the second wiring sub-layer between the second support plate and the first support plate and to form a first wiring layer of the cabled midplane; a first line card coupled to a connector on the first side of the cabled midplane; and a second line card coupled to a connector on the second side of the cabled midplane. 7. The communication device of claim 6 , wherein the communication device includes a switching system with at least one communication port.

Assignees

Inventors

Classifications

  • H04L49/40Primary

    Constructional details, e.g. power supply, mechanical construction or backplane · CPC title

  • Backplane arrangements · CPC title

  • having a supporting carrier or a mounting substrate or a mounting plate (G02B6/3648 takes precedence) · CPC title

  • G02B6/4285Primary

    Optical modules characterised by a connectorised pigtail · CPC title

  • for assembling or disassembling contact members with insulating base, case or sleeve · CPC title

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Frequently asked questions

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What does patent US9413097B2 cover?
A cabled midplane includes a first support plate along a plane between a first connector set and a second connector set that connect to line cards on either side of the cabled midplane. The first connector set and the second connector set include connector slices. A wiring sub-layer includes cable slices to provide a connection between the first connector slice of a connector of the first conne…
Who is the assignee on this patent?
Intel Corp
What technology area does this patent fall under?
Primary CPC classification H04L49/40. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 09 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).