High power solid-state lamp

Patent metadata

Field	Value
Publication number	US-9412926-B2
Application number	US-14999905-A
Country	US
Kind code	B2
Filing date	Jun 10, 2005
Priority date	Jun 10, 2005
Publication date	Aug 9, 2016
Grant date	Aug 9, 2016

Abstract

A high power semiconductor component structure having a semiconductor device arranged to operate in response to an electrical signal, with the device heating up during operation in response to the electrical signal. A heat sink is positioned in thermal contact with the semiconductor device such that heat from the device transmits into the first heat sink. The heat sink has at least partially a porous material region of a thermally conductive material in a 3-dimensional pore structure with the surfaces of the pore structure providing surface area for heat to dissipate into the ambient air.

First claim

We claim:

1. An optical device, comprising:
a solid state light source;
a reflector positioned to reflect light from said light source into directional light emission, heat from said light source at least partially transmitting into said reflector; and
a first heat sink mounted to said reflector positioned in thermal contact with said light source such that heat from said light source transmits into said first heat sink, said first heat sink comprising a thermally conductive conformable porous material layer adjacent said light source, said porous material layer comprising a 3-dimensional pore structure comprising interconnected pores, with the surfaces of said pore structure providing increased surface area for heat to dissipate into the ambient compared to bulk heat sinks, said porous material layer further comprising a graded porous material region wherein part of said porous material region comprises a higher density pore structure than the remainder of said region, said first heat sink shaped to fit around said reflector, wherein said reflector is configured to spread heat from said light source throughout said first heat sink;
wherein said reflector comprises a reflective metal and wherein said reflector is affixed to said first heat sink.

2. The device of claim 1 , further comprising a circuit board, said light source mounted to said circuit board, and said first heat sink mounted to said circuit board such that heat from said light source transmits at least partially into said first heat sink.

3. The device of claim 1 , further comprising a circuit board and a reflector, said light source and reflector mounted to said circuit board such that said reflector reflects at least some of said light from said emitter into directional light emission, and said first heat sink mounted to said circuit board such that heat from said light source transmits into said first heat sink.

4. The device of claim 3 , further comprising a second heat sink mounted to said circuit board such that the light source at least partially transmits heat through said circuit board into said second heat sink.

5. The device of claim 1 , wherein said porous material region further comprises a dark coating to increase radiation of heat into the ambient.

6. The device of claim 1 , wherein any higher density porous region of said heat sink comprises a thermal paste infused into a portion of the porous material.

7. The device of claim 1 , wherein the porous material layer comprises dimensions and porosity that provide for an optimum conductive heat transfer.

8. The device of claim 1 , wherein the first heat sink is provided on an outside surface of the reflector.

9. The device of claim 1 , wherein the first heat sink is bonded to an outside surface of the reflector.

10. The device of claim 9 , wherein the first heat sink is bonded to the outside surface of the reflector by a conductive adhesive.

11. The device of claim 1 , further comprising a heat conductive path between the first heat sink and the reflector.

12. The device of claim 1 , wherein the reflector is affixed to the first heat sink by a thermally conductive adhesive.

13. An optical device, comprising:
a solid state light source; and
a first heat sink positioned in thermal contact with said light source such that heat from said light source transmits into said first heat sink, said first heat sink comprising a porous material layer adjacent said light source, said porous material comprising a thermally conductive material with a 3-dimensional pore structure comprising interconnected pores, with the surfaces of said pore structure providing increased surface area for heat to dissipate into the ambient compared to bulk heat sinks, said heat sink comprising a graded porous material region wherein part of said porous material region comprises a higher density pore structure than the remainder of said region.

14. The device of claim 13 , wherein any higher density porous region of said heat sink comprises a solid metal.

15. A lamp, comprising:
a solid state light source mounted to a circuit board;
a reflector mounted to said circuit board to reflect at least some of the light from said light source into directional light emission;
contacts for providing electrical power to said solid state light source; and
first and second heat sinks, each of which comprises a layer of thermally conductive conformable porous material in a 3-dimensional pore structure comprising interconnected pores, said porous material layer comprising a graded porous material region wherein part of said porous material region comprises a higher density pore structure than the remainder of said region, said first heat sink shaped to fit around said reflector and said second heat sink affixed to and covering said circuit board, wherein said reflector is configured to spread heat from said light source throughout said first heat sink, wherein said first and second heat sinks are on opposite sides of said circuit board;
wherein said reflector comprises a reflective metal and wherein said reflector is affixed to said first heat sink.

16. The lamp of claim 15 , wherein said reflector is made of a metal.

17. The lamp of claim 15 , wherein at least a portion of the circuit board is between the first heat sink and the second heat sink.

18. The lamp of claim 15 , wherein the porous material comprises dimensions and porosity that provide for an optimum conductive heat transfer.

19. The lamp of claim 15 , wherein the first heat sink is provided on an outside surface of the reflector.

20. The lamp of claim 15 , wherein the first heat sink is bonded to an outside surface of the reflector.

21. The lamp of claim 20 , wherein the first heat sink is bonded to the outside surface of the reflector by a conductive adhesive.

22. The lamp of claim 15 , further comprising a heat conductive path between the first heat sink and the reflector.

23. The lamp of claim 15 , wherein the reflector is affixed to the first heat sink by a thermally conductive adhesive.

24. A lamp, comprising:
a solid state light source mounted to a circuit board;
a reflector mounted to said circuit board to reflect at least some of the light from said light source into directional light emission;
contacts for providing electrical power to said solid state light source; and
first and second heat sinks, each comprising a conformable porous material region made of a thermally conductive material in a 3-dimensional pore structure, wherein part of said porous material region comprises a graded region, part of said graded region comprising a higher density pore structure than the remainder of said graded region, said first heat sink shaped to fit around said reflector and said second heat sink affixed to said circuit board, said reflector comprising reflectively coated plastic and a heat conductive path comprising a heat conductive layer between said reflector and said first heat sink for heat to transmit from said light source and spread into and throughout said first heat sink through said heat conductive path, wherein said first and second heat sinks are on opposite sides of said circuit board.

25. The lamp of claim 24 , wherein heat from said light source transmits into said second heat sink through said circuit board.

26. The lamp of claim 24 , further comprising one or more heat conductive vias through said circuit board, said vias conducting heat

Assignees

• Keller Bernd
• Ibbetson James
• Cree Inc

Inventors

• Keller Bernd
• Ibbetson James

Classifications

• H10H20/8582

  characterised by their shape · CPC title

• H10H20/856

  Reflecting means · CPC title

• H10H20/8581 Primary

  characterised by their material · CPC title

• H01L33/60

  Electricity · mapped topic

• H01L33/641 Primary

  Electricity · mapped topic