Cooled pin lifter paddle for semiconductor substrate processing apparatus
US-2015024594-A1 · Jan 22, 2015 · US
US9412619B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9412619-B2 |
| Application number | US-201414458220-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 12, 2014 |
| Priority date | Aug 12, 2014 |
| Publication date | Aug 9, 2016 |
| Grant date | Aug 9, 2016 |
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Embodiments of the invention include methods and apparatuses for outgassing a workpiece prior to a plasma processing operation. An embodiment of the invention may comprise transferring a workpiece having a mask to an outgassing station that has one or more heating elements. The workpiece may then be heated to an outgassing temperature that causes moisture from the mask layer to be outgassed. After outgassing the workpiece, the workpiece may be transferred to a plasma processing chamber. In an additional embodiment, one or more outgassing stations may be located within a process tool that has a factory interface, a load lock coupled to the factory interface, a transfer chamber coupled to the load lock, and a plasma processing chamber coupled to the transfer chamber. According to an embodiment, an outgassing station may be located within any of the components of the process tool.
Opening claim text (preview).
What is claimed is: 1. A method for outgassing a workpiece, comprising: transferring a workpiece having a mask to an outgassing station having one or more heating elements; heating the workpiece to an outgassing temperature that causes moisture from the mask layer to be outgassed; and transferring the workpiece to a plasma processing chamber after the mask layer has been outgassed, wherein the outgassing station is within a transfer chamber that is coupled to the plasma processing chamber. 2. The method of claim 1 , wherein the transfer chamber and the plasma processing chamber are in a process tool that further comprises a factory interface and a load lock coupled to the factory interface, and wherein the transfer chamber is further coupled to the load lock. 3. A method for outgassing a workpiece, comprising: transferring a workpiece having a mask to an outgassing station having one or more heating elements; heating the workpiece to an outgassing temperature that causes moisture from the mask layer to be outgassed; and transferring the workpiece to a plasma processing chamber after the mask layer has been outgassed, wherein the outgassing station is within a process tool that comprises a factory interface, a load lock coupled to the factory interface, a transfer chamber coupled to the load lock, and the plasma processing chamber coupled to the transfer chamber, and wherein the outgassing station is within the load lock. 4. The method of claim 3 , wherein the one or more heating elements are vacuum compatible lamps. 5. The method of claim 3 , further comprising: pumping down the load lock to a vacuum pressure when the workpiece is in the load lock, and wherein the workpiece is heated while the load lock is pumped down to a vacuum pressure. 6. The method of claim 5 , wherein the vacuum pressure is less than 0.05 mTorr. 7. The method of claim 2 , wherein the outgassing station is positioned in the transfer chamber proximate to an opening to the load lock, and wherein the workpiece is heated as the workpiece is transferred from the load lock to the transfer chamber. 8. The method of claim 1 , wherein the outgassing station is positioned in the transfer chamber proximate to an opening to the plasma processing chamber, and wherein the workpiece is heated as the workpiece is transferred from the transfer chamber to the plasma processing chamber. 9. The method of claim 1 , further comprising: forming one or more openings in the mask layer prior transferring the workpiece to the outgassing station. 10. The method of claim 9 , wherein the openings are formed with a laser scribing tool. 11. The method of claim 1 , wherein the workpiece is maintained in a vacuum environment after the workpiece is heated to the outgassing temperature at the outgassing station and until the workpiece has been processed in the plasma processing chamber. 12. A method of outgassing a workpiece comprising: forming a mask layer over a workpiece; transferring the workpiece to a process tool that comprises a factory interface, a load lock coupled to the factory interface, a transfer chamber coupled to the load lock, and a plasma processing chamber coupled to the transfer chamber, wherein the process tool has one or more outgassing stations each having one or more heating elements; transferring the workpiece to an outgassing station within the process tool; heating the workpiece to an outgassing temperature that causes moisture from the mask layer to be outgassed; and transferring the workpiece to the plasma processing chamber after the mask layer has been outgassed. 13. The method of claim 12 , wherein the outgassing station is within the load lock. 14. The method of claim 13 , further comprising: pumping down the load lock to a vacuum pressure when the workpiece is in the load lock, and wherein the workpiece is heated while the load lock is pumped down to a vacuum pressure.
Horizontal transfer of a single workpiece · CPC title
characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier · CPC title
comprising a chamber adapted to a particular process · CPC title
characterised by the construction of the load-lock chamber · CPC title
characterised by the construction of the transfer chamber · CPC title
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