Card body, a manufacturing method for an IC card, and the IC card

Patent metadata

Field	Value
Publication number	US-9412059-B2
Application number	US-201414471036-A
Country	US
Kind code	B2
Filing date	Aug 28, 2014
Priority date	Sep 18, 2013
Publication date	Aug 9, 2016
Grant date	Aug 9, 2016

Abstract

According to one embodiment, a card body includes a card part onto which an IC module is to be mounted, and a bracket part to support the card part. The card part includes a bevel. The bracket part includes a hole, a first bridge part, a second bridge part, a first break-off line, and a second break-off line. The hole is formed at a circumference of the card part. The first bridge part connects the bracket part and the card part. The second bridge part connects the bracket part and the card part. The second bridge part is provided at a farer position from the bevel than the first bridge part. The first break-off line is provided with a first depth at the first bridge part. The second break-off line is provided with a second depth at the second bridge part. The second depth is shallower than the first depth.

First claim

What is claimed is:

1. A card body comprising:
a card part onto which an IC module is to be mounted, the IC module including an IC chip and a contact pattern; and
a bracket part to support the card part;
wherein
the card part includes a bevel, and
the bracket part includes
a hole formed at a circumference of the card part,
a first bridge part connecting the bracket part and the card part,
a second bridge part connecting the bracket part and the card part, the second bridge part is provided at a farer position from the bevel than the first bridge part,
a first break-off line provided at both surfaces of a connection part between the card part and the first bridge part so that a thickness of the connection part is equal to a first thickness, and
a second break-off line provided at both surfaces of a connection part between the card part and the second bridge part so that a thickness of the connection part is equal to a second thickness, the first thickness being shorter than the second thickness.

2. The card body according to claim 1 , wherein
the card part has a rectangular shape,
the first bridge part is provided at a short side of the card part nearer to the bevel, and
the second bridge part is provided at another short side of the card part as the opposite side of the first bridge part.

3. The card body according to claim 1 , wherein
the card part has a rectangular shape,
the first bridge part is provided at a long side of the card part nearer to the bevel, and
the second bridge part is provided at another long side of the card part as the opposite side of the first bridge part.

4. The card body according to claim 1 , wherein
a width of the first bridge part is narrower than a width of the second bridge part.

5. The card body according to claim 2 , wherein
a width of the first bridge part is narrower than a width of the second bridge part.

6. The card body according to claim 3 , wherein
a width of the first bridge part is narrower than a width of the second bridge part.

7. A card body comprising:
a card part onto which an IC module is to be mounted, the IC module including an IC chip and a contact pattern; and
a bracket part to support the card part;
wherein
the card part includes a bevel, and
the bracket part includes
a hole formed at a circumference of the card part,
a first bridge part connecting the bracket part and the card part,
a second bridge part connecting the bracket part and the card part, a width of the second bridge part is wider than a width of the first bridge part,
a first break-off line provided at both surfaces of a connection part between the card part and the first bridge part so that a thickness of the connection part is equal to a first thickness, and
a second break-off line provided at both surfaces of a connection part between the card part and the second bridge part so that a thickness of the connection part is equal to a second thickness, the first thickness being shorter than the second thickness.

8. The card body according to claim 7 , wherein
the card part has a rectangular shape,
the first bridge part is provided at a short side of the card part nearer to the bevel, and
the second bridge part is provided at another short side of the card part as the opposite side of the first bridge part.

9. The card body according to claim 7 , wherein
the card part has a rectangular shape,
the first bridge part is provided at a long side of the card part nearer to the bevel, and
the second bridge part is provided at another long side of the card part as the opposite side of the first bridge part.

10. A manufacturing method for an IC card from a card body,
the card body including a card part onto which an IC module is to be mounted, and a bracket part to support the card part,
the IC module including an IC chip and a contact pattern,
the method comprising:
forming a bevel at the card part;
forming a hole at a circumference of the card part on the bracket part;
forming a first bridge part connecting the bracket part and the card part;
forming a second bridge part connecting the bracket part and the card part at a farer position from the bevel than the first bridge part;
forming a first break-off line at both surfaces of a connection part between the card part and the first bridge part so that a thickness of the connection part is equal to a first thickness; and
forming a second break-off line at both surfaces of a connection part between the card part and the second bridge part so that a thickness of the connection part is equal to a second thickness.

11. An IC card manufactured from a card body,
the card body comprising:
a card part onto which an IC module is to be mounted, the IC module including an IC chip and a contact pattern; and
a bracket part to support the card part; wherein
the card part includes a bevel,
the bracket part includes
a hole formed at a circumference of the card part,
a first bridge part connecting the bracket part and the card part,
a second bridge part connecting the bracket part and the card part, the second bridge part is provided at a farer position from the bevel than the first bridge part,
a first break-off line provided at both surfaces of a connection part between the card part and the first bridge part so that a thickness of the connection part is equal to a first thickness, and
a second break-off line provided at both surfaces of a connection part between the card part and the second bridge part so that a thickness of the connection part is equal to a second thickness, the first thickness being shorter than the second thickness,
the IC card is the card part separated from the bracket part by cutting the first break-off line and the second break-off line by pressure.

Assignees

• Toshiba Kk

Inventors

• Arai Hideaki

Classifications

• G06K19/07747

  at least one of the integrated circuit chips being mounted as a module · CPC title

• G06K19/07739

  comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor · CPC title

• G06K19/07732 Primary

  the record carrier having a housing or construction similar to well-known portable memory devices, such as SD cards, USB or memory sticks (housings for electrical equipment in general, see H05K5/02) · CPC title

• Y10T29/49117

  Conductor or circuit manufacturing · CPC title

• G06K19/077 Primary

  Constructional details, e.g. mounting of circuits in the carrier · CPC title