Light emitting module having heat conductive substrate

US9410685B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9410685-B2
Application numberUS-201414158246-A
CountryUS
Kind codeB2
Filing dateJan 17, 2014
Priority dateMay 30, 2008
Publication dateAug 9, 2016
Grant dateAug 9, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A lighting apparatus including a plurality of light-emitting elements mounted on a first surface of a substrate, a heat conducting layer disposed on a second surface of the substrate opposite the first surface, and one or more holes extending from the first surface to the second surface of the substrate. A heat conductive and electrically non-conducting material covers an inner surface of the one or more holes, and is thermally connected to the heat conductive layer.

First claim

Opening claim text (preview).

What is claimed is: 1. A module substrate comprising: a substrate comprising a first surface, a second surface opposite to the first surface, and a corresponding portion of the second surface having a heat conductive layer; a light-emitting element mounted on the first surface; and at least two heat-conductive holes, each heat-conductive hole comprising a through hole extending entirely through the substrate between the first surface and the second surface and a heat-conductive material covering an inner surface of the through hole, wherein the material covering the inner surface of the through hole is not electrically connected to the light-emitting element, wherein the heat conductive layer is thermally connected to the material covering an inner surface of one of the at least two heat-conductive holes and the material covering an inner surface of another one of the at least two heat-conductive holes. 2. A lighting apparatus comprising: an apparatus main body; and a module substrate, the module substrate comprising: a substrate comprising a first surface, a second surface opposite to the first surface, and a corresponding portion of the second surface having an heat conductive layer; a light-emitting element mounted on the first surface; and at least two heat-conductive holes, each heat-conductive hole comprising a through hole extending entirely through the substrate between the first surface and the second surface and a heat-conductive material covering an inner surface of the through hole, wherein the material covering the inner surface of the through hole is electrically not connected to the light-emitting element, wherein the heat conductive layer is thermally connected to the material covering an inner surface of one of the at least two heat-conductive holes and the material covering an inner surface of another one of the at least two heat-conductive holes.

Assignees

Inventors

Classifications

  • Light-emitting diodes [LED] · CPC title

  • by printed thermal vias · CPC title

  • Holes or slots in insulating substrate not used for electrical connections · CPC title

  • with fins or blades · CPC title

  • Light emitting diode [LED] · CPC title

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What does patent US9410685B2 cover?
A lighting apparatus including a plurality of light-emitting elements mounted on a first surface of a substrate, a heat conducting layer disposed on a second surface of the substrate opposite the first surface, and one or more holes extending from the first surface to the second surface of the substrate. A heat conductive and electrically non-conducting material covers an inner surface of the o…
Who is the assignee on this patent?
Toshiba Lighting & Technology, Toshiba Kk
What technology area does this patent fall under?
Primary CPC classification F21V29/00. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Aug 09 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).