Sputtering device and method of forming layer using the same

Patent metadata

Field	Value
Publication number	US-9410234-B2
Application number	US-201514670403-A
Country	US
Kind code	B2
Filing date	Mar 26, 2015
Priority date	Dec 8, 2014
Publication date	Aug 9, 2016
Grant date	Aug 9, 2016

Abstract

Provided are a sputtering device and a method of forming a layer using the same.
The method of forming a layer using the sputtering device includes: placing a substrate within a chamber; depositing target particles emitted from a target, which faces the substrate, on the substrate using a sputtering process; and horizontally moving a plurality of shield rods, which are installed in a shield mask disposed between the substrate and the target and are separated from each other along a first direction, during the sputtering process.

First claim

What is claimed is:

1. A method for forming a thin layer, comprising:
placing a substrate within a chamber;
placing a target facing the substrate;
depositing target particles emitting from the target on the substrate using a sputtering process; and
moving a plurality of shield rods in a first direction,
wherein
the plurality of shield rods are installed in a shield mask and separated from each other along the first direction, and
the shield mask is disposed between the substrate and the target, the shield mask comprising a plurality of sidewalls that define an opening and a plurality of grooves that are formed in two facing ones of the sidewalls.

2. The method of claim 1 , wherein step of moving of the shield rods in a first direction comprises:
moving the shield rods back and forth between a first side and a second side of the target.

3. The method of claim 1 , wherein step of moving of the shield rods in a first direction comprises:
moving the shield rods in the first direction at a predetermined speed in a direction from a first side of the target toward a second side of the target; and
moving the shield rods in the first direction at the predetermined speed in a direction from the second side of the target toward the first side of the target.

4. The method of claim 1 , wherein step of moving of the shield rods in a first direction comprises:
repeating moving the shield rods in the first direction at a predetermined speed in a direction from a first side of the target toward a second side of the target and halting the shield rods for a predetermined period of time; and
repeating moving the shield rods in the first direction at the predetermined speed in a direction from the second side of the target toward the first side of the target and halting the shield rods for the predetermined period of time.

5. The method of claim 1 , wherein moving of the shield rods in a first direction is performed by moving a plurality of moving members that are housed in the shield mask and coupled to the shield rods in the first direction.

6. The method of claim 5 ,
wherein the plurality of moving members are housed in the grooves of the shield mask, and
wherein the grooves are housing grooves that are respectively formed in two facing ones of the sidewalls.

7. The method of claim 6 , wherein each of the moving member comprises:
a plurality of coupling grooves,
wherein the shield rods are coupled to the coupling grooves.

8. The method of claim 1 , wherein moving of the shield rods in a first direction is performed by moving the shield mask coupled to the shield rods in the first direction.

9. The method of claim 8 ,
wherein the shield rods are coupled to the grooves of the shield mask, and
wherein the grooves are coupling grooves that are formed in two facing ones of the sidewalls.

10. The method of claim 9 , wherein the shield rods extend along a second direction substantially perpendicular to the first direction and are coupled to the coupling grooves.

11. The method of claim 1 , wherein a diameter of each of the shield rods is equal to a distance between adjacent shield rods.

12. The method of claim 1 , wherein a layer formed by the deposition of the target particles on the substrate is a metal thin layer.

13. A method for forming a thin layer, comprising:
placing a substrate within a chamber;
placing a target facing the substrate;
depositing target particles emitting from the target on the substrate using a sputtering process; and
moving a plurality of shield rods in a first direction,
wherein the plurality of shield rods are installed in a shield mask and separated from each other along the first direction, the shield mask is disposed between the substrate and the target, and
wherein moving of the shield rods in a first direction is performed by moving a plurality of moving members that are housed in the shield mask and coupled to the shield rods in the first direction.

14. A method for forming a thin layer, comprising:
placing a substrate within a chamber;
placing a target facing the substrate;
depositing target particles emitting from the target on the substrate using a sputtering process; and
moving a plurality of shield rods in a first direction,
wherein the plurality of shield rods are installed in a shield mask and separated from each other along the first direction, the shield mask is disposed between the substrate and the target,
wherein moving of the shield rods in a first direction is performed by moving the shield mask coupled to the shield rods in the first direction, and
wherein the shield mask comprises: a plurality of sidewalls that define an opening; and a plurality of coupling grooves that are formed in two facing ones of the sidewalls.

Assignees

• Samsung Display Co Ltd

Inventors

• Kang Hyun Ju
• Sohn Sang Woo
• Shin Sang Won
• Lee Dong Hee
• Jeong Chang Oh

Classifications

• C23C14/044 Primary

  using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient · CPC title

• H01J37/3447

  Collimators, shutters, apertures · CPC title

• H01J37/34

  operating with cathodic sputtering (H01J37/36 takes precedence {; methods of cathodic sputtering C23C14/34}) · CPC title

• H10P14/22

  using physical deposition, e.g. vacuum deposition or sputtering · CPC title