Polycarbosilane and curable compositions for LED encapsulants comprising same

Patent metadata

Field	Value
Publication number	US-9410019-B2
Application number	US-201514609863-A
Country	US
Kind code	B2
Filing date	Jan 30, 2015
Priority date	Aug 2, 2012
Publication date	Aug 9, 2016
Grant date	Aug 9, 2016

Abstract

The present invention provides a polycarbosilane represented by the following formula (1):

[R 1 R 2 R 3 SiX 1/2 ] M [R 4 R 5 SiX 2/2 ] D [R 6 SiX 3/2 ] T [SiX 4/2 ] Q   (1); and

a curable composition comprising:
(A) said polycarbosilane of formula 1 as polycarbosilane A, (B) at least one polycarbosilane B represented by the following formula (2):

[R 7 R 8 R 9 SiX 1/2 ] M′ [R 10 R 11 SiX 2/2 ] D′ [R 12 SiX 3/2 ] T′ [SiX 4/2 ] Q′ ,  (2), and
(C) at least a catalyst.

First claim

What is claimed is:

1. A curable composition, comprising:
(A) at least one polycarbosilane A, represented by the following formula (1):
[R 1 R 2 R 3 SiX 1/2 ] M [R 4 R 5 SiX 2/2 ] D [R 6 SiX 3/2 ] T [SiX 4/2 ] Q   (1),

wherein R 1 , R 2 , R 3 , R 4 , R 5 , and R 6 , each independently designates a methyl group, an ethyl group, a vinyl group, or a phenyl group, with the proviso that each molecule comprises at least 2 vinyl groups; each X independently designates a bivalent C 2 H 4 hydrocarbon group or phenylene; and M, D, T, and Q each represents a number ranging from 0 to less than 1, provided that M+D+T+Q is 1, wherein T+Q is greater than 0
(B) at least one polycarbosilane B represented by the following formula (2):
[R 7 R 8 R 9 SiX 1/2 ] M′ [R 10 R 11 SiX 2/2 ] D′ [R 12 SiX 3/2 ] T′ [SiX 4/2 ]Q′,  (2),

wherein R 7 , R 8 , R 9 , R 10 , R 11 , and R 12 , each independently designates a methyl group, an ethyl group, a vinyl group, a phenyl group, or hydrogen, with the proviso that each molecule comprises at least 2 hydrogen atoms directly bonded to silicon; each X independently designates a bivalent C 2 H 4 hydrocarbon group or phenylene; and M′, D′, T′, and Q′ each represents a number ranging from 0 to less than 1, provided that M′+D′+T′+Q′ is 1, and
(C) at least a catalyst.

2. The composition according to claim 1 , wherein polycarbosilane A and polycarbosilane B is present in respective amounts to provide a molar Si—H/Si-Vinyl ratio of 0.5-10.

3. The composition according to claim 1 , wherein the weight average molecular weight of the polycarbosilane B is 100-300,000 g/mol.

4. The composition according to claim 1 , wherein the catalyst is one or more selected from the group consisting of platinum group metal catalysts.

5. The composition according to claim 1 , wherein the catalyst is present in such an amount that the content of the catalytic metal is in the range of 1 to 500 ppm based on the total weight of the curable composition.

6. The composition according to claim 1 , wherein the composition is a two-component preparation consisting of component 1 and component 2, wherein component 1 comprises polycarbosilane A and the total amount of catalyst being present and component 2 comprises the total amount of polycarbosilane B being present and optionally further polycarbosilane A.

7. Cured reaction products of the curable composition according to claim 1 .

8. A semiconductor encapsulated within cured reaction products of the composition according to claim 1 .

9. The composition according to claim 1 , wherein polycarbosilane A and polycarbosilane B is present in respective amounts to provide a molar Si—H/Si-Vinyl ratio of 1.0-3.0.

10. The composition according to claim 1 , wherein the weight average molecular weight of the polycarbosilane B is 1,000-50,000 g/mol.

11. The composition according to claim 1 , wherein the catalyst is present in such an amount that the content of the catalytic metal is in the range of 2 to 100 ppm, based on the total weight of the curable composition.

12. The polycarbosilane according to claim 4 , wherein at least one X is a phenylene.

Assignees

• Henkel Ag & Co Kgaa

Inventors

• Xing Thomas
• Zhang Liwei
• Li Zhiming Pasing
• Zhang Yong
• Du Juan

Classifications

• C08G2190/00

  Compositions for sealing or packing joints · CPC title

• H10H20/854

  characterised by their material, e.g. epoxy or silicone resins · CPC title

• C08L83/16

  in which all the silicon atoms are connected by linkages other than oxygen atoms · CPC title

• C09D183/16

  in which all the silicon atoms are connected by linkages other than oxygen atoms · CPC title

• C08L2203/162

  sealable films · CPC title