Dynamically directed workpiece positioning system

US9409306B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9409306-B2
Application numberUS-201514814223-A
CountryUS
Kind codeB2
Filing dateJul 30, 2015
Priority dateJul 31, 2014
Publication dateAug 9, 2016
Grant dateAug 9, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

In various embodiments, a dynamically directed workpiece positioning system may include a transport, a sensor positioned to detect a workpiece on the transport, a cutting member positioned along or downstream of the transport, and a computer system. The sensor may scan the workpiece as the workpiece is moved relative to the transport by a human operator or a positioning device. Based on the scan data, the computer system may generate commands to guide the human operator or positioning device in moving the workpiece to a desired position corresponding to a cut solution for the workpiece. Optionally, the computer system may cause the cutting member to be repositioned while the workpiece is being moved relative to the transport. Once the workpiece is in the desired position, the transport may be used to move the workpiece toward the cutting member. Corresponding methods and apparatuses are also disclosed.

First claim

Opening claim text (preview).

What is claimed is: 1. A workpiece positioning system comprising: a transport configured to convey a workpiece in a flow direction toward a cutting member; a sensor configured to detect a workpiece on the transport upstream of the cutting device; a projector, and a computer system operatively coupled with the sensor and the projector, the computer system programmed with instructions operable, upon execution by a processor, to determine, based on data from the sensor, a first actual position of the workpiece relative to the transport; compare the first actual position to a cut solution for the workpiece; and generate, based at least on the comparison, one or more commands configured to cause the projector to project an image onto the transport or the workpiece to indicate the cut solution or a desired position that corresponds to the cut solution, to thereby guide repositioning of the workpiece relative to the transport to the desired position. 2. The workpiece positioning system of claim 1 , wherein the sensor includes one or more of a vision camera and a laser triangulation sensor. 3. The workpiece processing system of claim 1 , wherein the instructions are further operable, upon execution by the processor, to calculate the cut solution based at least on data from the sensor. 4. The workpiece processing system of claim 1 , wherein the sensor is configured to detect one or more additional positions of the workpiece as the workpiece is moved relative to the transport, and the instructions are further operable, upon execution by the processor, to recalculate or modify the cut solution based at least on corresponding additional data from the sensor. 5. A method of positioning a workpiece on a support, the method comprising: using a sensor to detect the workpiece on the support; determining by a computer system, based on data from the sensor, a first actual position of the workpiece relative to the support; comparing, by the computer system, the first actual position to a cut solution for the workpiece; and generating by the computer system, based at least on the comparison, one or more commands configured to cause a projector to project an image onto the transport to indicate the cut solution or a desired position that corresponds to the cut solution to thereby cause the workpiece to be moved relative to the transport to the desired position. 6. The method of claim 5 , further including calculating, by the computer system, one or more of the cut solution, a cut pattern that corresponds to the cut solution, or the desired position based at least on the data from the sensor. 7. The method of claim 5 , further including: moving the workpiece from the first actual position to one or more additional positions; and using the sensor to detect the workpiece in the one or more additional positions to thereby obtain additional information about the workpiece. 8. A method of modifying a workpiece processing system, wherein the workpiece processing system includes a transport and a cutting member positioned along or downstream of the transport, the method comprising: positioning a sensor relative to the transport, wherein the sensor is operable to detect a workpiece on the transport; coupling a computer system with the sensor and a projector, wherein the computer system is programmed with instructions operable, upon execution, to determine, based on data from the sensor, a first actual position of the workpiece relative to the transport; compare the first actual position to a cut solution for the workpiece; and generate, based at least on the comparison, one or more commands configured to cause the projector to project onto the transport or the workpiece an image that indicates the cut solution or a desired position that corresponds to the cut solution, to thereby cause the workpiece to be moved relative to the transport to the desired position. 9. The workpiece processing system of claim 1 , wherein the image includes a visual representation of the workpiece or a visual representation of a dimensional model of the workpiece, and the one or more commands are configured to cause the projector to project the visual representation onto the transport at the desired position to thereby indicate the desired position. 10. The workpiece processing system of claim 1 , wherein the image includes a visual representation of an alignment mark or a visual representation of a cut pattern that corresponds to the cut solution. 11. The workpiece processing system of claim 1 , wherein the image includes a visual representation of a cut line that indicates an actual position of the cutting member. 12. The workpiece processing system of claim 11 , wherein the cutting member is one of a plurality of saws, and the image includes visual representations of cut lines along the planes of some or all of the saws. 13. The workpiece processing system of claim 11 , wherein the instructions are further operable, upon execution by the processor, to cause the projector to reposition the visual representation of the cut line based on a change in the actual position of the cutting member, such that the projected cut line indicates the position of the cutting member in real time. 14. The workpiece processing system of claim 1 , wherein the image includes a visual representation of the workpiece or a dimensional model of the workpiece, and a visual representation of an alignment mark or a cut pattern that corresponds to the cut solution. 15. The method of claim 5 , wherein the image includes a visual representation of the workpiece or of a dimensional model of the workpiece, and the one or more commands are configured to cause the projector to project the visual representation onto the transport at the desired position to thereby indicate the desired position. 16. The method of claim 15 , further including generating, by the computer, the dimensional model of the workpiece based at least on the data from the sensor. 17. The method of claim 7 , further including recalculating or modifying the cut solution or a corresponding cut pattern, by the computer system, based at least on the additional information. 18. The method of claim 17 , further including generating, by the computer system, one or more commands configured to cause the projector to modify or reposition the image based at least on the recalculating or modifying. 19. The method of claim 7 , wherein the image includes a visual representation of a cut line, the method further comprising: determining, by the computer system, a change in a position of a cutting member downstream of the workpiece; and generating, by the computer system, one or more commands configured to cause the projector to move the visual representation to reflect the change in position, such that the visual representation indicates the actual position of the cutting member in real time. 20. The method of claim 19 , wherein the image includes a visual representation of an alignment mark, the method further comprising generating, by the computer system, one or more commands configured to cause the projector to move the alignment mark based on the actual position of the cutting member. 21. The method of claim 8 , further including positioning the projector above the transport or proximal to the cutting member. 22. The method of claim 8 , wherein the sensor includes one or more of a laser triangulation sensor or a vision camera. 23. The method of claim 8 , wherein the

Assignees

Inventors

Classifications

  • by endless conveyors, e.g. belts · CPC title

  • characterised by control arrangements for positioning, e.g. centring a tool relative to a hole in the workpiece, additional detection means to correct position (G05B19/19 takes precedence) · CPC title

  • B26D5/007Primary

    Control means comprising cameras, vision or image processing systems · CPC title

  • Workpiece, setup of component, workpiece · CPC title

  • Means for holding or positioning work · CPC title

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Frequently asked questions

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What does patent US9409306B2 cover?
In various embodiments, a dynamically directed workpiece positioning system may include a transport, a sensor positioned to detect a workpiece on the transport, a cutting member positioned along or downstream of the transport, and a computer system. The sensor may scan the workpiece as the workpiece is moved relative to the transport by a human operator or a positioning device. Based on the sca…
Who is the assignee on this patent?
Usnr Llc
What technology area does this patent fall under?
Primary CPC classification B26D5/007. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 09 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).