Polishing apparatus and polishing method

Patent metadata

Field	Value
Publication number	US-9409277-B2
Application number	US-201314067723-A
Country	US
Kind code	B2
Filing date	Oct 30, 2013
Priority date	Oct 31, 2012
Publication date	Aug 9, 2016
Grant date	Aug 9, 2016

Abstract

A polishing apparatus includes: a rotatable polishing table for supporting a polishing pad having a polishing surface; a top ring head having a top ring; a top ring head cover surrounding the top ring head; a dresser head having a dresser configured to dress the polishing surface; a dresser head cover surrounding the dresser head; a spray nozzle configured to spray a cleaning liquid onto an upper surface of the top ring and an outer surface of the top ring head cover when the top ring is in the substrate transfer position; and a spray nozzle configured to spray a cleaning liquid onto an outer surface of the dresser head cover when the dresser is in the retreated position.

First claim

What is claimed is:

1. A polishing apparatus comprising:
a rotatable polishing table for supporting a polishing pad having a polishing surface;
an atomizer head configured to spray a cleaning fluid onto the polishing surface to clean the polishing surface; and
an atomizer cover that covers an upper surface of the atomizer head,
the atomizer cover including
a semicylindrical top plate having a semicylindrical shape, and
a first side plate and a second side plate extending downward from both lower ends of the semicylindrical top plate,

the semicylindrical top plate including
a first top plate having a vertical cross section in a shape of an arc whose radius is constant over its entire length from a base end to a distal end of the atomizer cover, and
a second top plate having a vertical cross section in a shape of an arc whose radius decreases gradually from the base end toward the distal end of the atomizer cover,

the first top plate and the second top plate being connected to each other at their top portions to constitute the semicylindrical top plate.

2. The polishing apparatus according to claim 1 , wherein the semicylindrical top plate, the first side plate, and the second side plate are formed integrally from resin.

3. The polishing apparatus according to claim 1 , wherein the first side plate and the second side plate have lower end surfaces, respectively, which are inclined downward from the distal end to the base end of the atomizer cover.

4. The polishing apparatus according to claim 1 , wherein the second side plate is connected to the second top plate, and the second side plate is provided with a projecting portion projecting in a horizontal direction.

5. The polishing apparatus according to claim 1 , further comprising:
a top ring head having a top ring configured to press a substrate against the polishing surface while holding and rotating the substrate; and
a top ring head cover surrounding the top ring head,
the top ring head cover including a side cover that surrounds the top ring head, and a lower cover that closes a bottom opening of the side cover,
the lower cover including a bottom plate inclined downwardly toward a radially outward direction of the polishing table when the top ring is in a polishing position above the polishing table.

6. The polishing apparatus according to claim 5 , wherein the lower cover includes a side plate which extends upwardly from a peripheral portion of the bottom plate and which is in contact with or in proximity to a side plate of the side cover.

Assignees

• Ebara Corp

Inventors

• Umemoto Masao
• Sone Tadakazu
• Aizawa Hideo
• Kosuge Ryuichi
• Eriguchi Masaaki

Classifications

• B24B37/04

  designed for working plane surfaces · CPC title

• B24B53/017 Primary

  Devices or means for dressing, cleaning or otherwise conditioning lapping tools · CPC title

• B24B37/34

  Accessories · CPC title

• B24B37/32

  Retaining rings · CPC title

• B24B37/10

  for single side lapping · CPC title