Solid-state drive with passive heat transfer

Patent metadata

Field	Value
Publication number	US-9408328-B2
Application number	US-201213683955-A
Country	US
Kind code	B2
Filing date	Nov 21, 2012
Priority date	Jun 7, 2012
Publication date	Aug 2, 2016
Grant date	Aug 2, 2016

Abstract

The disclosed embodiments relate to a system that facilitates thermal conductance in a system that includes a module comprising a circuit board with integrated circuits, such as a solid-state drive. A thermal-coupling material between one side of the circuit board and an adjacent baseplate is used to increase thermal conduction between the circuit board and the baseplate. Furthermore, the module may include another thermal-coupling material between the baseplate and a housing that at least in part surrounds the circuit board, thereby increasing thermal conduction between the baseplate and the housing. In these ways, the baseplate and/or the housing may be used as a heat-transfer surfaces or heat spreaders that reduce hotspots associated with operation of the integrated circuits.

First claim

What is claimed is:

1. A module, comprising: a housing; a circuit board having an integrated circuit disposed on a surface of the circuit board; a baseplate mechanically coupled to an edge of the circuit board; a thermal-coupling material that: is positioned between and contacts the integrated circuit, and the baseplate, and directly contacts the circuit board, wherein the thermal-coupling material provides for thermal conductance between the circuit board and the baseplate; and a secondary thermal-coupling material disposed between and directly contacting the housing and the baseplate.

2. The module of claim 1 , wherein the thermal-coupling material directly contacts the integrated circuit and the baseplate.

3. The module of claim 1 , wherein at least a portion of the thermal-coupling material at least partially envelopes the integrated circuit.

4. The module of claim 1 , wherein the thermal-coupling material includes one of a thermal pad and a thermal gel.

5. The module of claim 1 , further comprising an arm that extends from the baseplate and grasps the edge of the circuit board, wherein the arm is secured to at least two surfaces of the circuit board.

6. The module of claim 1 , wherein the secondary thermal-coupling material includes one of a thermal pad and a thermal gel.

7. The module of claim 6 , wherein the secondary thermal-coupling material directs heat from the baseplate to the housing.

8. The module of claim 1 , wherein the integrated circuit includes an electromagnetic interference shield.

9. The module of claim 1 , wherein the circuit board includes integrated circuits disposed on opposing surfaces of the circuit board.

10. A portable electronic device, comprising: a housing; a circuit board having an integrated circuit disposed on a surface of the circuit board; a baseplate mechanically coupled to an edge of the circuit board; a thermal-coupling material that is positioned between and contacts the integrated circuit and the baseplate, and directly contacts the circuit board, wherein the thermal-coupling material provides for thermal conductance between the circuit board and the baseplate; and a secondary thermal-coupling material disposed between and directly contacting the housing and the baseplate.

11. The portable electronic device of claim 10 , wherein the thermal-coupling material directly contacts the integrated circuit, the circuit board, and the baseplate.

12. The portable electronic device of claim 10 , wherein at least a portion of the thermal-coupling material at least partially envelopes the integrated circuit.

13. The portable electronic device of claim 10 , wherein the thermal-coupling material includes one of a thermal pad and a thermal gel.

14. The portable electronic device of claim 10 , further comprising an arm that extends from the baseplate and grasps an edge of the circuit board, wherein the arm is secured to at least two surfaces of the circuit board.

15. The portable electronic device of claim 10 , wherein the integrated circuit includes an electromagnetic interference shield.

16. The portable electronic device of claim 15 , wherein the circuit board includes integrated circuits disposed on opposing surfaces of the circuit board.

17. A method for transferring heat from an integrated circuit of a circuit board, the method comprising: transferring heat from the integrated circuit to a baseplate using a first thermal-coupling material that is positioned between and contacts the integrated circuit and the baseplate, and directly contacts the circuit board; and transferring heat from the baseplate to an external housing of a portable electronic device using a second thermal-coupling material disposed between and directly contacting the baseplate and the external housing.

18. The method of claim 17 , wherein the thermal-coupling material directly contacts a surface of the circuit board and the baseplate.

19. The method of claim 17 , wherein at least a portion of the thermal-coupling material at least partially envelopes the integrated circuit gel.

20. The method of claim 17 , wherein the baseplate includes an arm that extends from the baseplate and grasps an edge of the circuit board, wherein the arm is secured to at least two surfaces of the circuit board.

21. A module, comprising: a housing; a first circuit board having an integrated circuit disposed on a surface of the first circuit board; a second circuit board that is mechanically coupled to the first circuit board, wherein the surface of the first circuit board is separated from the second circuit board; a thermal-coupling material that is positioned between and contacts the integrated circuit and the second circuit board, and directly contacts the first circuit board; and a secondary thermal-coupling material disposed between and directly contacting a housing surface and the second circuit board.

22. The module of claim 21 , wherein the thermal-coupling material directly contacts the surface of the first circuit board, the integrated circuit, and the second circuit board.

23. The module of claim 22 , wherein at least a portion of the thermal-coupling material at least partially envelopes the integrated circuit.

24. The module of claim 21 , wherein the integrated circuit includes a solid-state memory.

25. The module of claim 21 , further comprising:
an arm that extends from the second circuit board and grasps an edge of the first circuit board, wherein the arm is secured to at least two surfaces of the first circuit board.

26. The module of claim 21 , wherein the thermal-coupling material includes one of: a foam, a thermal gel, a thermal pad, thermal grease, and an elastomeric material.

27. The module of claim 21 , wherein the integrated circuit includes an electromagnetic interference shield.

28. A portable electronic device, comprising:
a first circuit board having a component disposed on a surface of the first circuit board;
a second circuit board that is mechanically coupled to the first circuit board, wherein the component is separated from the second circuit board by a gap; and
a thermal-interface material in the gap between the component and the second circuit board, wherein a portion of the thermal-interface material facing the surface of the first circuit board includes a pre-compressed region that (i) is compressed partially into the gap away from the surface and (ii) at least partially envelopes the component on the surface of the first circuit board.

29. The portable electronic device of claim 28 , further comprising an electromagnetic-interference shield at least partially enclosing the component.

30. The portable electronic device of claim 29 , wherein the first circuit board includes a wireless-communication circuit board.

31. The portable electronic device of claim 28 , wherein the component includes a solid-state memory.

32. The portable electronic device of claim 31 , wherein the first circuit board includes a solid-state drive.

33. The portable electronic device of claim 28 , wherein the thermal-interface material includes one of: a foam, a thermal gel, a thermal pad, a thermal grease, and an elastomeric material.

34. The portable electronic device of claim 28 , wherein the portion of the thermal-interface material is disposed between the com

Assignees

• Apple Inc

Inventors

• Nigen Jay S
• Hopkinson Ron A
• Yap Derek J
• Knopf Eric A
• Leggett William F
• Tan Richard H

Classifications

• H10W42/20

  protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons · CPC title

• H10W40/251

  Organics · CPC title

• H10W40/037

  Assembling together parts thereof · CPC title

• H10W40/255 Primary

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• F28F21/00

  Constructions of heat-exchange apparatus characterised by the selection of particular materials {(coatings for modifying heat-transfer F28F13/18; coatings for preventing the formation of deposits or corrosion F28F19/02)} · CPC title