Magnetoresistive element and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-9406871-B2
Application number	US-201514807267-A
Country	US
Kind code	B2
Filing date	Jul 23, 2015
Priority date	Sep 9, 2013
Publication date	Aug 2, 2016
Grant date	Aug 2, 2016

Abstract

According to one embodiment, a magnetoresistive element is disclosed. The magnetoresistive element includes a reference layer, a tunnel barrier layer, a storage layer. The storage layer includes a first region and a second region provided outside the first region to surround the first region, the second region including element included in the first region and another element being different from the element. The magnetoresistive element further includes a cap layer including a third region and a fourth region provided outside the third region to surround the third region, the fourth region including an element included in the third region and the another element.

First claim

What is claimed is:

1. A method for manufacturing a magnetoresistive element comprising:
forming a stacked body including a reference layer, a tunnel barrier layer and a storage layer;
processing the stacked body by process including RIE (reactive ion etching) process; and
implanting another element being different from element included in the storage layer into a surface of the storage layer exposed by processing the stacked body.

2. The method according to claim 1 , wherein implanting the element is performed using ion implantation method.

3. The method according to claim 2 , wherein the ion implantation method is an oblique ion implantation method.

4. The method according to claim 2 , wherein implanting the another element is performed in a state where the stacked body is cooled.

5. The method according to claim 1 , wherein the implanting the element is performed using a plasma doping method.

6. The method according to claim 1 , wherein the another element is at least one of As, Ge, Ga, Sb, In, N, Ar, He, F, Cl, Br, I, O, Si, B, C, Zr, Tb, S, Se, P and Ti.

7. The method according to claim 1 , wherein forming the stacked body including the reference layer, the tunnel barrier layer and the storage layer comprises forming the tunnel barrier layer on the reference layer, forming the storage layer on the tunnel barrier layer.

8. The method according to claim 7 , wherein the forming the stacked body further comprises forming a cap layer on the storage layer.

9. The method according to claim 1 , wherein forming the stacked body including the reference layer, the tunnel barrier layer and storage layer comprises forming the tunnel barrier layer on the storage layer, forming the reference layer on the tunnel barrier layer.

10. The method according to claim 9 , wherein forming the stacked body further comprises forming a cap layer on the reference layer.

11. The method according to claim 10 , wherein processing the stacked body comprises etching the cap layer and the reference layer which are on the tunnel barrier layer by the RIE process without etching the storage layer under the tunnel barrier layer by the RIE process.

12. The method according to claim 10 , wherein the processing the stacked body further comprises etching the storage layer under the tunnel barrier layer by IBE (ion beam etching) process.

Assignees

• Nakayama Masahiko
• Yoshikawa Masatoshi
• Kai Tadashi
• Hashimoto Yutaka
• Toko Masaru
• Yoda Hiroaki
• Oh Jae Geun
• Lee Keum Bum
• Ryu Choon Kun
• Lee Hyung Suk
• Kim Sook Joo
• Toshiba Kk
• Sk Hynix Inc

Inventors

• Nakayama Masahiko
• Yoshikawa Masatoshi
• Kai Tadashi
• Hashimoto Yutaka
• Toko Masaru
• Yoda Hiroaki
• Oh Jae Geun
• Lee Keum Bum
• Ryu Choon Kun
• Lee Hyung Suk
• Kim Sook Joo

Classifications

• H01L43/10

  Electricity · mapped topic

• H01L43/12

  Electricity · mapped topic

• H01L43/08

  Electricity · mapped topic

• H01L43/02 Primary

  Electricity · mapped topic

• H01L27/222

  Electricity · mapped topic