Vertical JFET with body diode and device regions disposed in a single compound epitaxial layer
US-9209318-B2 · Dec 8, 2015 · US
US9406743B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9406743-B2 |
| Application number | US-201514706329-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 7, 2015 |
| Priority date | Mar 21, 2013 |
| Publication date | Aug 2, 2016 |
| Grant date | Aug 2, 2016 |
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A manufacturing method of a junction field effect transistor includes the steps of: (a) forming an n + -type source layer on a surface of an n − -type drift layer formed on an n + -type SiC substrate; (b) forming a plurality of shallow trenches disposed at predetermined intervals by etching the surface of the n − -type drift layer with a silicon oxide film formed on the n − -type drift layer used as a mask; (c) forming an n-type counter dope layer by doping the n − -type drift layer below each of the shallow trenches with nitrogen by using a vertical ion implantation method; (d) forming a sidewall spacer on each sidewall of the silicon oxide film and the shallow trenches; and (e) forming a p-type gate layer by doping the n − -type drift layer below each of shallow trenches with aluminum by using the vertical ion implantation method.
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What is claimed is: 1. A semiconductor device having a junction field effect transistor formed on a main surface of a semiconductor substrate of a first conductivity type, the device comprising: a drift layer of the first conductivity type formed on the semiconductor substrate; a plurality of source layers of the first conductivity type formed at predetermined intervals on a surface of the drift layer; a plurality of trenches formed in the drift layer at regions between adjace…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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