Microelectronic assemblies with inductors in direct bonding regions
US-2024355768-A1 · Oct 24, 2024 · US
US9406739B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9406739-B2 |
| Application number | US-201414182116-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 17, 2014 |
| Priority date | Mar 14, 2013 |
| Publication date | Aug 2, 2016 |
| Grant date | Aug 2, 2016 |
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A system and method for providing and manufacturing an inductor is provided. In an embodiment similar masks are reutilized to form differently sized inductors. For example, a two turn inductor and a three turn inductor may share masks for interconnects and coils, while only masks necessary for connections between the interconnects and coils may need to be newly developed.
Opening claim text (preview).
What is claimed is: 1. A method of manufacturing semiconductor devices, the method comprising; manufacturing a first inductor using a first mask and a second mask, wherein the first inductor is manufactured in a first semiconductor device; and manufacturing a second inductor using the first mask and a third mask but not the second mask, wherein the second inductor is manufactured in a second semiconductor device different from the first semiconductor device.…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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