Infrared reflection/absorption layer for reducing ghost image of infrared reflection noise and image sensor using the same

Patent metadata

Field	Value
Publication number	US-9406716-B2
Application number	US-201514876296-A
Country	US
Kind code	B2
Filing date	Oct 6, 2015
Priority date	Oct 29, 2012
Publication date	Aug 2, 2016
Grant date	Aug 2, 2016

Abstract

An image sensor includes a photosensing element for receiving infrared (IR) radiation and detecting the IR radiation and generating an electrical signal indicative of the IR radiation. A redistribution layer (RDL) is disposed under the photosensing element, the RDL comprising pattern of conductors for receiving the electrical signal. An IR reflection layer, an IR absorption layer or an isolation layer is disposed between the photosensing element and the RDL. The IR reflection layer, IR absorption layer or isolation layer provides a barrier to IR radiation such that the IR radiation does not impinge upon the RDL. As a result, a ghost image of the RDL is not generated, resulting in reduced noise and improved sensitivity and performance of the image sensor.

First claim

What is claimed is:

1. An image sensor, comprising:
a photosensing layer for receiving infrared (IR) radiation and detecting the IR radiation and generating an electrical signal indicative of the IR radiation;
a redistribution layer (RDL) under the photosensing layer, the RDL comprising a pattern of conductors configured for receiving the electrical signal;
a plurality of conductive pads under the RDL layer, each conductive pad being electrically connected to a conductor of the pattern of conductors; and
an IR reflection layer between the photosensing layer and the RDL, said IR reflection layer reflecting a reflected portion of the IR radiation back to the photosensing layer such that the reflected portion of the IR radiation does not impinge upon the RDL.

2. The image sensor of claim 1 , wherein the IR reflection layer comprises multiple layers of different transparent materials.

3. The image sensor of claim 2 , the different transparent materials being two different materials; wherein the IR reflection layer comprises multiple alternating layers of the two different materials.

4. The image sensor of claim 3 , wherein the two different materials comprise at least one of TiO 2 and SiO 2 .

5. The image sensor of claim 2 , wherein the multiple layers of different transparent materials have different refractive indices.

6. The image sensor of claim 2 , wherein the multiple layers of different transparent materials have different thicknesses.

7. The image sensor of claim 1 , wherein the IR reflection layer comprises a layer of metal.

8. The image sensor of claim 7 , wherein the layer of metal comprises one of aluminum, chromium, gold, silver and copper.

9. The image sensor of claim 1 , further comprising on a top side of the photosensing layer, (a) a first plurality of pixel lenses and (b) a layer of infrared-absorbent black photoresist not covering any of the first plurality of pixel lenses.

10. The image sensor of claim 1 , further comprising a layer of black photoresist under the photosensing layer for absorbing radiation.

11. The image sensor of claim 1 , wherein the IR radiation is in a near infrared (NIR) wavelength range of 900-1200 nm.

12. The image sensor of claim 9 , the photosensing layer including a plurality of peripheral pixel lenses covered by the layer of black photoresist, a portion of the first plurality of pixel lenses being between two peripheral pixel lenses.

Assignees

• Omnivision Tech Inc

Inventors

• Lin Wei-Feng
• Chien Yeh-An
• Fan Chun-Sheng

Classifications

• H10W72/012

  of bump connectors, dummy bumps or thermal bumps · CPC title

• H10F39/8063

  Microlenses · CPC title

• H10F39/8053

  Colour filters · CPC title

• H10F39/8067

  Reflectors · CPC title

• H10F39/8057

  Optical shielding · CPC title