Semiconductor light-emitting device

Patent metadata

Field	Value
Publication number	US-9406657-B2
Application number	US-201314377111-A
Country	US
Kind code	B2
Filing date	Jan 22, 2013
Priority date	Feb 6, 2012
Publication date	Aug 2, 2016
Grant date	Aug 2, 2016

Abstract

A semiconductor light-emitting device has a substrate, one or more semiconductor light-emitting elements provided on the substrate, and that emit light having a peak wavelength in a 380 nm to 480 nm wavelength region, and a molded member covering the semiconductor light-emitting element, and containing a phosphor that emits visible light by being excited by the emitted light from the semiconductor light-emitting element. The molded member is formed so that index A=H/(s/n) satisfies 0.3≦A≦6, where H is the height [mm] of the molded member from the substrate, s is the square root [mm] of the contact area between the substrate and the molded member, and n is the number of the semiconductor light-emitting elements covered with the molded member.

First claim

The invention claimed is:

1. A semiconductor light-emitting device comprising:
a substrate;
one or more semiconductor light-emitting elements provided on the substrate, and that emit light having a peak wavelength in a 380 nm to 480 nm wavelength region; and
a molded member covering the semiconductor light-emitting element, and containing a phosphor that emits visible light by being excited by the emitted light from the semiconductor light-emitting element,
wherein the molded member is formed so that index A=H/(s/n) satisfies 0.3≦A≦6, where H is the height [mm] of the molded member from the substrate, s is the square root [mm] of the contact area between the substrate and the molded member, and n is the number of the semiconductor light-emitting elements covered with the molded member,
wherein a plurality of the semiconductor light-emitting elements are disposed in a plurality of lines on the substrate,
wherein a plurality of the molded members are disposed, each of which respectively covers each of the plurality of lines, and
wherein each of the plurality of the molded members respectively is formed in a column shape that extends in a direction along the plurality of lines.

2. The semiconductor light-emitting device according to claim 1 , wherein the molded member is formed into a shape that is largest along the thickness in a main emission direction of the semiconductor light-emitting element.

3. The semiconductor light-emitting device according to claim 1 ,
wherein more than one of the semiconductor light-emitting elements is disposed on the substrate, and
wherein the molded member is integrally provided so as to be continuous between the semiconductor light-emitting elements.

4. The semiconductor light-emitting device according to claim 1 , wherein the molded member is formed so as to satisfy the index A of 0.9≦A≦1.7.

5. The semiconductor light-emitting device according to claim 1 , wherein the volume concentration of the phosphor contained in the molded member is 0.005 vol % to 10 vol %.

6. The semiconductor light-emitting device according to claim 2 ,
wherein more than one of the semiconductor light-emitting elements is disposed on the substrate, and
wherein the molded member is integrally provided so as to be continuous between the semiconductor light-emitting elements.

7. The semiconductor light-emitting device according to claim 2 , wherein the molded member is formed so as to satisfy the index A of 0.9≦A≦1.7.

8. The semiconductor light-emitting device according to claim 3 , wherein the molded member is formed so as to satisfy the index A of 0.9≦A≦1.7.

9. The semiconductor light-emitting device according to claim 6 , wherein the molded member is formed so as to satisfy the index A of 0.9≦A≦1.7.

10. The semiconductor light-emitting device according to claim 2 , wherein the volume concentration of the phosphor contained in the molded member is 0.005 vol % to 10 vol %.

11. The semiconductor light-emitting device according to claim 3 , wherein the volume concentration of the phosphor contained in the molded member is 0.005 vol % to 10 vol %.

12. The semiconductor light-emitting device according to claim 4 , wherein the volume concentration of the phosphor contained in the molded member is 0.005 vol % to 10 vol %.

13. The semiconductor light-emitting device according to claim 6 , wherein the volume concentration of the phosphor contained in the molded member is 0.005 vol % to 10 vol %.

14. The semiconductor light-emitting device according to claim 7 , wherein the volume concentration of the phosphor contained in the molded member is 0.005 vol % to 10 vol %.

15. The semiconductor light-emitting device according to claim 8 , wherein the volume concentration of the phosphor contained in the molded member is 0.005 vol % to 10 vol %.

16. The semiconductor light-emitting device according to claim 9 , wherein the volume concentration of the phosphor contained in the molded member is 0.005 vol % to 10 vol %.

17. The semiconductor light-emitting device according to claim 1 , wherein at least part of the molded member is formed in a shape of a circular cone or a shape of a polygonal pyramid.

Assignees

• Koito Mfg Co Ltd

Inventors

• Sugimori Shogo
• Kuboyama Osamu
• Daicho Hisayoshi

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• F21K9/00

  Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers · CPC title

• H10H20/853

  characterised by their shape · CPC title

• H10H20/8515

  not being in contact with the bodies · CPC title

• H10H20/8514 Primary

  characterised by their shape, e.g. plate or foil · CPC title