Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Leadframe based light emitter components and related methods
US9406594B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9406594-B2 |
| Application number | US-201414550443-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 21, 2014 |
| Priority date | Nov 21, 2014 |
| Publication date | Aug 2, 2016 |
| Grant date | Aug 2, 2016 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
Leadframe based light emitter components and methods are provided. In some aspects, a leadframe based light emitter component includes a leadframe element, an electrical device connected to a portion of the leadframe element, and a molded cup encasing portions of the leadframe element and the electrical device connected thereto. A method of providing a leadframe based light emitter component includes providing a leadframe element, connecting an electrical device to a portion of the leadframe element, and molding a body over portions of the leadframe element and the electrical device.
First claim
Opening claim text (preview).
What is claimed is: 1. A leadframe based light emitter component comprising: a leadframe element; at least one light emitting diode (LED) chip connected to a first portion of the leadframe element; an electrical device connected to a second portion of the leadframe element; and a molded body disposed around the first portion of the leadframe element and the LED chip connected thereto, wherein the molded body encases the second portion of the leadframe element and a portion o…
Assignees
Inventors
Classifications
- H10W90/00Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H10W90/811Primary
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9406594B2 cover?
- Leadframe based light emitter components and methods are provided. In some aspects, a leadframe based light emitter component includes a leadframe element, an electrical device connected to a portion of the leadframe element, and a molded cup encasing portions of the leadframe element and the electrical device connected thereto. A method of providing a leadframe based light emitter component in…
- Who is the assignee on this patent?
- Cree Inc
- What technology area does this patent fall under?
- Primary CPC classification H10W90/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 02 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).