Pixel blending for multiple charged-particle beam lithography

Patent metadata

Field	Value
Publication number	US-9405203-B2
Application number	US-201414203371-A
Country	US
Kind code	B2
Filing date	Mar 10, 2014
Priority date	Sep 23, 2008
Publication date	Aug 2, 2016
Grant date	Aug 2, 2016

Abstract

System and method for applying mask data patterns to substrate in a lithography manufacturing process are disclosed. In one embodiment, the method includes providing a parallel imaging writer system, where the parallel imaging writer system includes a plurality of multiple charged-particle beam (MCB) imaging units arranged in one or more parallel arrays, receiving a mask data pattern to be written to a substrate, processing the mask data pattern to form a plurality of partitioned mask data patterns corresponding to different areas of the substrate, identifying one or more objects in an area of the substrate to be imaged by corresponding MCB imaging units, and performing multiple exposures to image the one or more objects in the area of the substrate by controlling the plurality of MCB imaging units to write the plurality of partitioned mask data patterns in parallel.

First claim

What is claimed is:

1. A method for processing image data in a lithography manufacturing process, comprising:
providing a parallel imaging writer system, wherein the parallel imaging writer system includes a plurality of multiple charged-particle beam (MCB) imaging units arranged in one or more parallel arrays;
receiving a mask data pattern to be written to a substrate;
processing the mask data pattern to form a plurality of partitioned mask data patterns corresponding to different areas of the substrate;
identifying one or more objects in an area of the substrate to be imaged by corresponding MCB imaging units; and
performing multiple exposures to image the one or more objects in the area of the substrate by controlling the plurality of MCB imaging units to write the plurality of partitioned mask data patterns in parallel, wherein performing multiple exposures to image the one or more objects further comprises:
selectively exposing a first set of pixel locations using a first dose having a first electron energy level; and
selectively exposing a second set of pixel locations using a second dose having a second electron energy level wherein
the first set of pixel locations are exposed in a first scan direction;
the second set of pixel locations are exposed in a second scan direction;
wherein the first scan direction is different from the second scan direction; and
wherein the first electron energy level is different from the second electron energy level.

2. The method of claim 1 , wherein performing multiple exposures to image the one or more objects further comprises at least one of:
performing multiple exposures of a pixel using one of the MCB imaging unit; or
performing multiple exposures of a pixel using a set of the MCB imaging units.

3. A system for processing image data in a lithography manufacturing process, comprising:
a parallel imaging writer system, wherein the parallel imaging writer system includes a plurality of multiple charged-particle beam (MCB) imaging units arranged in one or more parallel arrays;
a controller configured to control the plurality of MCB imaging units, wherein the controller includes
logic for receiving a mask data pattern to be written to a substrate;
logic for processing the mask data pattern to form a plurality of partitioned mask data patterns corresponding to different areas of the substrate;
logic for identifying one or more objects in an area of the substrate to be imaged by corresponding MCB imaging units; and
logic for performing multiple exposures to image the one or more objects in the area of the substrate by controlling the plurality of MCB imaging units to write the plurality of partitioned mask data patterns in parallel, wherein logic for performing multiple exposures to image the one or more objects further comprises:
logic for selectively exposing a first set of pixel locations using a first dose having a first electron energy level; and
logic for selectively exposing a second set of pixel locations using a second dose having a second electron energy level wherein
the first set of pixel locations are exposed in a first scan direction;
the second set of pixel locations are exposed in a second scan direction;
wherein the first scan direction is different from the second scan direction; and
wherein the first electron energy level is different from the second electron energy level.

4. The system of claim 3 , wherein logic for performing multiple exposures to image the one or more objects further comprises at least one of:
logic for performing multiple exposures of a pixel using one of the MCB imaging unit; or
logic for performing multiple exposures of a pixel using a set of the MCB imaging units.

Assignees

• Applied Materials Inc

Inventors

• Chen Jang Fung
• Laidig Thomas

Classifications

• G03F7/70508

  Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus · CPC title

• G03F7/2059

  using a scanning corpuscular radiation beam, e.g. an electron beam · CPC title

• G03F7/70791

  Large workpieces, e.g. glass substrates for flat panel displays or solar panels · CPC title

• G03F7/70466

  Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature (stitching G03F7/70475) · CPC title

• G03F7/70275 Primary

  Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems · CPC title