Layered radiation-sensitive materials with varying sensitivity

Patent metadata

Field	Value
Publication number	US-9405192-B2
Application number	US-201113088792-A
Country	US
Kind code	B2
Filing date	Apr 18, 2011
Priority date	Dec 19, 2008
Publication date	Aug 2, 2016
Grant date	Aug 2, 2016

Abstract

A method for fabricating a radiation-cured structure is provided. The method includes the steps of providing a first radiation-sensitive material and a second radiation-sensitive material adjacent the first radiation-sensitive material. The first radiation-sensitive material has a first sensitivity. The second radiation-sensitive material has the first sensitivity and a second sensitivity different from the first sensitivity. At least one mask is placed between at least one radiation source and the first and second radiation-sensitive materials. The mask has a plurality of substantially radiation-transparent apertures. The first and second radiation-sensitive materials are then exposed to a plurality of radiation beams through the radiation-transparent apertures in the mask to form a first construct in the first radiation-sensitive material and a second construct in the second radiation-sensitive material. The first construct and the second construct cooperate to form the radiation-cured structure.

First claim

What is claimed is:

1. A method for fabricating a radiation-cured structure, the method comprising the steps of
providing a first radiation-sensitive material, the first radiation-sensitive material having a first sensitivity;
providing a second radiation-sensitive material adjacent the first radiation-sensitive material, the second radiation-sensitive material having the first sensitivity and a second sensitivity different from the first sensitivity, the second radiation-sensitive material including a photoinitiator not found in the first radiation-sensitive material, the photoinitiator providing the second sensitivity;
placing at least one mask between at least one radiation source and the first and second radiation-sensitive materials, the mask having a plurality of substantially radiation-transparent apertures;
exposing the first and second radiation-sensitive materials to a plurality of radiation beams through the radiation-transparent apertures in the mask; and
forming at least a first construct in the first radiation-sensitive material and a second construct in the second radiation-sensitive material, the first construct and the second construct cooperating to form the radiation-cured structure.

2. The method of claim 1 , wherein at least one of the first and second radiation-sensitive materials is one of a radiation-curable material and a radiation-dissociable material.

3. The method of claim 1 , wherein at least one of the first and second sensitivities is at least one of a curing rate, an initiation rate, a dissociation rate, a sensitivity to radiation frequency, a sensitivity to radiation amplitude, a sensitivity to radiation type.

4. The method of claim 1 , further comprising the step of removing an uncured portion of the first and second radiation-sensitive materials following the step of exposing the first and second radiation-sensitive materials to the plurality of radiation beams.

5. The method of claim 1 , further comprising the step of applying a third radiation sensitive material to the second radiation sensitive material, the third radiation-sensitive material having a third sensitivity.

6. The method of claim 5 , wherein the third radiation-sensitive material forms a third construct following the step of exposing the third radiation-sensitive material to the plurality of radiation beams, the third construct cooperating with the first construct and the second construct to form the radiation-cured structure.

7. The method of claim 5 , wherein the third sensitivity is substantially the same as the first sensitivity.

8. The method of claim 5 , wherein the third sensitivity is different from the first sensitivity and the second sensitivity.

9. The method of claim 1 , further comprising the steps of providing a substrate and applying the first radiation-sensitive material to the substrate.

10. The method of claim 1 , further comprising at least one of the steps of metalizing, carbonizing, and ceramicizing the radiation-cured structure.

11. The method of claim 1 , wherein the plurality of radiation beams include a plurality of first radiation beams and a plurality of second radiation beams.

12. The method of claim 11 , wherein the plurality of first radiation beams is different from the plurality of second radiation beams in at least one of frequency, amplitude, and type.

13. The method of claim 11 , wherein the plurality of first radiation beams is different from the plurality of second radiation beams in at least one of cross-sectional shape and angle of incidence relative a surface of one of the first radiation-sensitive material and the second radiation-sensitive material.

14. The method of claim 13 , wherein the plurality of first radiation beams is provided by a first radiation source having a first mask and the plurality of second radiation beams is provided by a second radiation source having a second mask.

15. The method of claim 14 , wherein at least one of the first radiation-sensitive material and the second radiation-sensitive material is one of a negative resist and a positive resist.

16. The method of claim 14 , wherein at least one of the first radiation-sensitive material and the second radiation-sensitive material is a liquid photomonomer.

17. The method of claim 14 , wherein the forming step includes the step of heating the first radiation-sensitive material and the second radiation-sensitive material following the step of exposing the radiation-sensitive material to the plurality of radiation beams, the heating facilitating at least one of polymerization, a crosslinking, and a dissociation of at least one of the first radiation-sensitive material and the second radiation-sensitive material.

18. The method of claim 1 , further comprising the step of applying a filter layer between the first radiation-sensitive material and the second radiation-sensitive material, the filter layer militating against an exposure of one of the first and second radiation-sensitive materials to at least a portion of the plurality of radiation beams.

19. A method for fabricating a radiation-cured structure, the method comprising the steps of:
providing a first radiation-curable material, the first radiation-curable material having a first sensitivity including at least one of a first curing rate, a first initiation rate, a sensitivity to a first radiation frequency, a sensitivity to a first radiation amplitude, and a sensitivity to a first radiation type;
providing a second radiation-curable material adjacent the first radiation-curable material, the second radiation-curable material having the first sensitivity and a second sensitivity including at least one of a second curing rate, a second initiation rate, a sensitivity to a second radiation frequency, a sensitivity to a second radiation amplitude, and a sensitivity to a second radiation type, the second sensitivity different from the first sensitivity, the second radiation-sensitive material including a photoinitiator not found in the first radiation-sensitive material, the photoinitiator providing the second sensitivity;
placing at least one mask between at least one radiation source and the first and second radiation-curable materials, the mask having a plurality of substantially radiation transparent apertures;
exposing the first and second radiation-curable materials to a plurality of radiation beams through the radiation-transparent apertures in the mask; and
forming at least a first construct in the first radiation-curable material and a second construct in the second radiation-curable material, the first construct and the second construct cooperating to form the radiation-cured structure.

20. A method for fabricating a radiation-cured structure, the method comprising the steps of:
providing a first radiation-dissociable material, the first radiation-dissociable material having a first sensitivity including at least one of a first dissociation rate, a sensitivity to a first radiation frequency, a sensitivity to a first radiation amplitude, and a sensitivity to a first radiation type;
providing a second radiation-dissociable material adjacent the first radiation-dissociable material, the second radiation-dissociable material having the first sensitivity and a second sensitivity including at least one of a second dissociation rate, a sensitivity to a second radiation frequency, a sensitivity to a second radiation amplitude, and a sensitivity to a second radiation type, the second sensitivity different from the first sensitivity, the second radiation-sen

Assignees

• Rock Jeffrey A
• Fly Gerald W
• Lai Yeh-Hung
• Newman Keith E
• Jacobsen Alan J
• Carter William B
• Brewer Peter D
• Nguyen Hung D
• Kolodziejska Joanna A
• Gm Global Tech Operations Llc

Inventors

• Rock Jeffrey A
• Fly Gerald W
• Lai Yeh-Hung
• Newman Keith E
• Jacobsen Alan J
• Carter William B
• Brewer Peter D
• Nguyen Hung D
• Kolodziejska Joanna A

Classifications

• G03F7/095 Primary

  having more than one photosensitive layer (G03F7/075 takes precedence) · CPC title

• G03F7/2022

  Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure · CPC title