MEMS micro-mirror assembly

Patent metadata

Field	Value
Publication number	US-9405116-B2
Application number	US-201314382724-A
Country	US
Kind code	B2
Filing date	Feb 11, 2013
Priority date	Mar 8, 2012
Publication date	Aug 2, 2016
Grant date	Aug 2, 2016

Abstract

A MEMS micro-mirror assembly ( 250, 300, 270, 400 ) comprising, a MEMS device ( 240 ) which comprises a MEMS die ( 241 ) and a magnet ( 231 ); a flexible PCB board ( 205 ) to which the MEMS device ( 240 ) is mechanically, and electrically, connected; wherein the flexible PCB board ( 205 ) further comprises a first extension portion ( 205 b ) which comprises a least one electrical contact ( 259 a,b ) which is useable to electrically connect the MEMS micro-mirro rassembly ( 250, 300, 270, 400 ) to another electrical component). There is further provided a projection system comprising such a MEMS micro-mirror assembly ( 250, 300, 270, 400 ).

First claim

The invention claimed is:

1. A MEMS micro-mirror assembly comprising;
a MEMS device, which comprises a MEMS die and a magnet;
a flexible PCB board to which the MEMS device is mechanically, and electrically, connected;
wherein the flexible PCB board further comprises a first extension portion, which is defined by a portion of the flexible PCB board, which comprises a least one electrical contact, which is useable to electrically connect the MEMS micro-mirror assembly to another electrical component, wherein the MEMS device is mounted on the flexible PCB board.

2. A MEMS micro-mirror assembly according to claim 1 , wherein the PCB board is interposed between the MEMS die and magnet.

3. A MEMS micro-mirror assembly according to claim 1 , wherein the first extension portion further comprises a least one electrical contact to which the MEMS device is electrically connected.

4. A MEMS micro-mirror assembly according to claim 1 , wherein the flexible PCB board further comprises a second extension portion which comprises a least one electrical contact to which the MEMS device is electrically connected.

5. A MEMS micro-mirror assembly according to claim 1 , wherein the MEMS device comprises at least one electrical contact.

6. A MEMS micro-mirror assembly according to claim 1 , wherein the electrical contacts on the PCB board are soldered directly to electrical contacts on the MEMS device, so as to electrically and mechanically connect the MEMS device to the flexible PCB board.

7. A MEMS micro-mirror assembly according to claim 5 , wherein the MEMS micro-mirror assembly further comprise one or more wire bonds which electrically connect the electrical contact on the MEMS device to an electrical contact on the first extension portion, so that the MEMS device is electrically connected to the flexible PCB board.

8. A MEMS micro-mirror assembly according to claim 5 , wherein the MEMS micro-mirror assembly further comprise one or more wire bonds which electrically connect the electrical contact on the MEMS device to an electrical contact on the second extension portion, so that the MEMS device is electrically connected to the flexible PCB board.

9. A MEMS micro-mirror assembly according to claim 5 , wherein the MEMS micro-mirror assembly comprises a plurality of wire bonds which electrically connect an electrical contact on the MEMS device to an electrical contact on the first or second extension portion.

10. A MEMS micro-mirror assembly according claim 7 , further comprising protective material which is arranged to form an enclosure which encloses the wire bonds.

11. A MEMS micro-mirror assembly according to claim 1 , wherein the flexible PCB board further comprises alignment marks to facilitate positioning the MEMS device on the flexible PCB board.

12. A MEMS micro-mirror assembly according to claim 1 , wherein the flexible PCB board further comprises one or more areas which are mechanically re-enforced.

13. A MEMS micro-mirror assembly according to claim 1 , wherein the flexible PCB board is dimensioned such that two or three edges of the PCB board are aligned with two or three edges of the MEMS device.

14. A projection system comprising:
a light source; and
a micro-electromechanical system (MEMS) mirror assembly optically coupled to the light source, the MEMS mirror assembly to receive light from the light source and direct the light towards a projection surface, the MEMS mirror assembly comprising:
a MEMS device comprising a MEMS die and a magnet; and
a flexible printed circuit board (PCB) mechanically connected to the MEMS device, the flexible PCB comprising a first extension portion to electrically couple the MEMS device to at least one other electrical component.

15. A projection system according to claim 14 , wherein the flexible PCB is interposed between the MEMS die and the magnet.

16. A projection system according to claim 14 , wherein the flexible PCB comprises alignment marks to position the MEMS device on the flexible PCB.

17. A projection system according to claim 14 , wherein the flexible PCB comprises one or more mechanically re-enforced areas.

18. A projection system according to claim 14 , the flexible PCB having a first dimension and the MEMS device having a second dimension, wherein the first dimension and the second dimension are the same.

19. A projection system according to claim 14 , the MEMS device comprising a first electrical contact and the first extension portion comprising a second electrical contact, the first electrical contact soldered to the second electrical contact.

20. A projection system according to claim 19 , the MEMS mirror assembly comprising one or more wire bonds to electrically connect the first electrical contact to the second electrical contact.

Assignees

• Intel Corp

Inventors

• Khechana Faouzi
• Abele Nicolas

Classifications

• H05K2203/049

  Wire bonding · CPC title

• B81C2203/054

  using structural alignment aids, e.g. spacers, interposers, male/female parts, rods or balls · CPC title

• B81C2203/057

  Passive alignment techniques not provided for in B81C2203/054 - B81C2203/055 · CPC title

• H05K1/189

  characterised by the use of flexible or folded printed circuits · CPC title

• H05K1/118

  specially for flexible printed circuits, e.g. using folded portions · CPC title