Ultrasonic transducer element chip, probe head, probe, electronic instrument, and ultrasonic diagnostic device

Patent metadata

Field	Value
Publication number	US-9404959-B2
Application number	US-201313774178-A
Country	US
Kind code	B2
Filing date	Feb 22, 2013
Priority date	Feb 24, 2012
Publication date	Aug 2, 2016
Grant date	Aug 2, 2016

Abstract

An ultrasonic transducer element chip includes a substrate, a plurality of ultrasonic transducer elements, a wiring part and an additional wiring part. The substrate defines a plurality of openings arranged in an array pattern. Each of the ultrasonic transducer elements is provided in each of the openings. The wiring part is connected to the ultrasonic transducer elements. The additional wiring part is disposed in a peripheral region between an outline of the array pattern of the openings and an outer edge of the substrate in a plan view as viewed along a thickness direction of the substrate. The additional wiring part is electrically insulated from the wiring part. The additional wiring part is longer than a shortest distance between the outline of the array pattern and the outer edge of the substrate in the plan view.

First claim

What is claimed is:

1. An ultrasonic transducer element chip comprising:
a substrate including a substrate surface and a plurality of opening portions arranged in an array pattern, each of the opening portions extending from the substrate surface in a first direction along a perpendicular direction that is perpendicular to the substrate surface;
a plurality of ultrasonic transducer elements arranged, relative to the substrate surface, in a second direction along the perpendicular direction, the second direction being opposite the first direction, the ultrasonic transducer elements being arranged so as to correspond to, in the perpendicular direction, the opening portions, respectively;
a wiring part connected to the ultrasonic transducer elements; and
an additional wiring part disposed in a peripheral region between an outline of the array pattern of the openings and an outer edge of the substrate such that the additional wire part and the ultrasonic transducer elements do not overlap with respect to each other in the perpendicular direction, the additional wiring part being electrically insulated from the wiring part, and the additional wiring part being longer than a shortest distance between the outline of the array pattern and the outer edge of the substrate as viewed in the perpendicular direction.

2. The ultrasonic transducer element chip according to claim 1 , wherein
an end of the wiring part includes a signal terminal located in the peripheral region as viewed in the perpendicular direction.

3. The ultrasonic transducer element chip according to claim 1 , wherein
an outline of the substrate as viewed in the perpendicular direction has a straight side, and an end of the wiring part and an end of the additional wiring part are disposed between the straight side and the outline of the array pattern.

4. The ultrasonic transducer element chip according to claim 3 , wherein
the substrate has a rectangle shape as viewed in the perpendicular direction, and the additional wiring part has portions disposed between each of three sides of the rectangle shape and the outline of the array pattern.

5. The ultrasonic transducer element chip according to claim 1 , wherein
the wiring part has a first wiring section connected to one of a pair of electrodes of at least one of the ultrasonic transducer elements and a second wiring section connected to the other of the electrodes of the at least one of the ultrasonic transducer elements, and
the additional wiring part is disposed in a conductive layer of the substrate in which one of the first wiring section and the second wiring section is disposed.

6. The ultrasonic transducer element chip according to claim 1 , wherein
the wiring part has a first wiring section connected to one of a pair of electrodes of at least one of the ultrasonic transducer elements and a second wiring section connected to the other of the electrodes of the at least one of the ultrasonic transducer elements, and
a part of the additional wiring part is disposed in a first conductive layer of the substrate in which the first wiring section is disposed, and a rest of the additional wiring part is disposed in a second conductive layer of the substrate in which the second wiring section is disposed.

7. The ultrasonic transducer element chip according to claim 1 , wherein
the additional wiring part includes
a first check terminal disposed at one end of the additional wiring part in the peripheral region as viewed in the perpendicular direction,
a second check terminal disposed at the other end of the additional wiring in the peripheral region as viewed in the perpendicular direction, the second check terminal being spaced apart from the first check terminal, and
an interconnection wiring section interconnecting the first check terminal and the second check terminal, the interconnection wiring section being disposed in the peripheral region as viewed in the perpendicular direction.

8. The ultrasonic transducer element chip according to claim 1 , wherein
the outline of the substrate as viewed in the perpendicular direction has a first straight side and a second straight side extending parallel to each other, and
a first end of the wiring part and a first end of the additional wiring part are disposed between the first straight side and the outline of the array pattern, and a second end of the wiring part and a second end of the additional wiring part are disposed between the second straight side and the outline of the array pattern.

9. The ultrasonic transducer element chip according to claim 8 , wherein
the substrate has a rectangle shape as viewed in the perpendicular direction, and
the additional wiring part has a first additional wiring section and a second additional wiring section, the first additional wiring section has a portion disposed between the outline of the array pattern and each of the first straight side and a third straight side of the substrate adjacent to the first straight side, and the second additional wiring section has a portion disposed between the outline of the array pattern and each of the second straight side and a fourth straight side of the substrate opposed to the third straight side.

10. The ultrasonic transducer element chip according to claim 8 , wherein
the wiring part has a first wiring section connected to one of a pair of electrodes of at least one of the ultrasonic transducer elements and a second wiring section connected to the other of the electrodes of the at least one of the ultrasonic transducer elements, and
the additional wiring part is disposed in a conductive layer of the substrate in which one of the first wiring section and the second wiring section is disposed.

11. A probe head comprising:
the ultrasonic transducer element chip according to claim 1 ;
a case supporting the ultrasonic transducer element chip; and
a connector fixed to the case such that the connector is exposed on an external surface of the case, and electrically connected at least to the additional wiring part.

12. A probe comprising:
the probe head according to claim 11 ; and
a probe main body removably connected to the probe head through the connector.

13. An electronic instrument comprising:
the probe according to claim 12 ; and
a processing circuit connected to the probe, and configured to process output signals from the ultrasonic transducer elements.

14. An ultrasonic diagnostic device comprising:
the probe according to claim 12 ;
a processing circuit connected to the probe, and configured to process output signals of the ultrasonic transducer elements to generate an image; and
a display device configured to display the image.

15. A probe comprising the ultrasonic transducer element chip according to claim 1 .

16. An electronic instrument comprising the ultrasonic transducer element chip according to claim 1 .

17. An ultrasonic diagnostic device comprising:
a probe including the ultrasonic transducer element chip according to claim 1 ;
a processing circuit connected to the probe, and configured to process output signals of the ultrasonic transducer elements to generate an image; and
a display device configured to display the image.

18. An electronic instrument comprising:
a substrate including a substrate surface and a plurality of opening portions arranged in an array pattern, each of the opening portions extending from the substrate surface in a first direction along a perpendicular direction that is perpendicular to the substrate surface;
a plurality of ultrasonic transd

Assignees

• Seiko Epson Corp

Inventors

• Takahashi Masaki

Classifications

• B06B1/06

  operating with piezoelectric effect or with electrostriction (piezoelectric or electrostrictive devices per se H10N30/00) · CPC title

• B06B1/0622 Primary

  on one surface · CPC title

• G03B42/06

  using ultrasonic, sonic or infrasonic waves · CPC title

• G01R31/2607 Primary

  Circuits therefor (G01R31/2642 takes precedence) · CPC title

• A61B8/4494

  characterised by the arrangement of the transducer elements · CPC title