Shock tolerant heat dissipating electronics package

US9404357B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9404357-B2
Application numberUS-201013518898-A
CountryUS
Kind codeB2
Filing dateDec 22, 2010
Priority dateDec 24, 2009
Publication dateAug 2, 2016
Grant dateAug 2, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An electronics package of substantially monolithic configuration. The package is particularly adept at enhancing heat dissipation and avoiding secondary shock when placed in harsh application environments. Thus, the package may be particularly well suited for use in conjunction with high shock producing downhole application environments such as bridge plug setting.

First claim

Opening claim text (preview).

We claim: 1. An electronics package comprising: a housing defining a channel therethrough; a first electronics chassis disposed in the channel with a first inclined surface at an end thereof; a second electronics chassis disposed in the channel adjacent said first electronics chassis and with a second inclined surface at another end thereof; and a screw operatively disposed through the housing and configured to apply axial downward force to the first electronics chassis adjacent thereto; and a stop structurally integral with the housing and adjacent the second electronics chassis. 2. The electronics package of claim 1 wherein said second chassis is immobilized relative said housing by one of the adjacent stop and structural adherence to said housing. 3. The electronics package of claim 1 wherein the inclined surfaces are of a staggered and repeating configuration. 4. The electronics package of claim 1 wherein at least one of said chassis comprises: a structural platform; and an electronics board mounted to said platform. 5. The electronics package of claim 4 wherein said electronics board accommodates motor drive electronics for directing a motor of a downhole application tool. 6. The electronics package of claim 5 wherein the motor drive electronics include a digital signal processor. 7. The electronics package of claim 1 further comprising at least one more chassis disposed in the channel with at least one more inclined surface to enhance the radial expansion via interfacing with another of the inclined surfaces. 8. A downhole assembly for disposal in a well, the assembly comprising: a well isolation mechanism; a setting tool coupled to said isolation mechanism for anchoring and sealing thereof at a location in the well; and a housing incorporated into said tool and accommodating multiple electronics chassis for driving a motor of said tool, the chassis equipped with inclined surfaces oriented for interfacing one another and radially expanding for substantial immobilization thereof upon exposure to an axial force driving the interfacing, wherein the axial force is imparted by a screw disposed through the housing adjacent one of the electronics chassis and a stop structurally integral with the housing and adjacent the other chassis. 9. The downhole assembly of claim 8 wherein said isolation mechanism is one of a bridge plug and a mechanical packer. 10. The downhole assembly of claim 9 wherein said tool is hydraulically driven. 11. The downhole assembly of claim 10 wherein the motor is a brushless dc motor, said tool comprising an axial piston pump. 12. A method comprising: providing a housing accommodating a first electronics chassis with a first inclined surface; positioning a second electronics chassis with a second inclined surface in the housing oriented for interfacing of the surfaces; and imparting an axial force on the second chassis for radial expansion of the chassis in the housing to form an electronics package, wherein the axial force is imparted by a screw disposed through the housing adjacent one of the electronics chassis and a stop structurally integral with the housing and adjacent the other chassis. 13. The method of claim 12 wherein the axial force is less than about 2,000 lbs. and the radial expansion imparts more than about 15,000 lbs. of radial force toward an inner wall of the housing. 14. The method of claim 12 further comprising: deploying the housing into a well over a line as part of downhole tool coupled to a well isolation mechanism; and performing a wellbore application at a target location in the well.

Assignees

Inventors

Classifications

  • E21B47/017Primary

    Protecting measuring instruments · CPC title

  • Radially expanding part in cavity, aperture, or hollow body · CPC title

  • E21B47/011Primary

    Fixed Constructions · mapped topic

  • Cooling arrangements · CPC title

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Frequently asked questions

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What does patent US9404357B2 cover?
An electronics package of substantially monolithic configuration. The package is particularly adept at enhancing heat dissipation and avoiding secondary shock when placed in harsh application environments. Thus, the package may be particularly well suited for use in conjunction with high shock producing downhole application environments such as bridge plug setting.
Who is the assignee on this patent?
Martinez Ruben, Diaz Adan, Schlumberger Technology Corp
What technology area does this patent fall under?
Primary CPC classification E21B47/017. Mapped technology areas include Fixed Constructions.
When was this patent published?
Publication date Tue Aug 02 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).