Diamond bonded construction with thermally stable region

US9404309B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9404309-B2
Application numberUS-201414148718-A
CountryUS
Kind codeB2
Filing dateJan 6, 2014
Priority dateOct 3, 2008
Publication dateAug 2, 2016
Grant dateAug 2, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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Diamond bonded constructions comprise a polycrystalline diamond body having a matrix phase of bonded-together diamond grains and a plurality of interstitial regions between the diamond grains including a catalyst material used to form the diamond body disposed within the interstitial regions. A sintered thermally stable diamond element is disposed within and bonded to the diamond body, and is configured and positioned to form part of a working surface. The thermally stable diamond element is bonded to the polycrystalline diamond body, and a substrate is bonded to the polycrystalline diamond body. The thermally stable diamond element comprises a plurality of bonded-together diamond grains and interstitial regions, wherein the interstitial regions are substantially free of a catalyst material used to make or sinter the thermally stable diamond element. A barrier material may be disposed over or infiltrated into one or more surfaces of the thermally stable diamond element.

First claim

Opening claim text (preview).

What is claimed is: 1. An ultra-hard composite construction comprising: a body formed from an ultra-hard material having a hardness of greater than about 4,000 HV; and a thermally stable element disposed within and bonded to the body, wherein the thermally stable element has a level of thermal stability that is greater than that of the ultra-hard material, wherein the thermally stable element has a thickness of about 2 mm or more, and wherein the body has a grain size greater than the thermally stable element. 2. The construction as recited in claim 1 wherein the thermally stable element has an average grain size less than about 10 microns. 3. The construction as recited in claim 1 wherein the thermally stable element is positioned in the body to form a working surface of the construction. 4. The construction as recited in claim 1 wherein the thermally stable element is formed separately from the body. 5. The construction as recited in claim 1 wherein the thermally stable element is bonded to the body during formation of the body at high pressure-high temperature conditions. 6. The construction as recited in claim 1 wherein the ultra-hard material comprises sintered polycrystalline diamond having a catalyst material disposed therein. 7. The construction as recited in claim 1 wherein the thermally stable element comprises sintered polycrystalline diamond that is substantially free of a catalyst material used to form the polycrystalline diamond. 8. The construction as recited in claim 1 wherein the thermally stable element is formed separately from the body and is bonded to the body during a high pressure-high temperature condition used to form the body, and wherein the construction further comprises a metallic substrate that is attached to the body. 9. A bit for drilling subterranean formations comprising a bit body and a number of cutting elements operatively attached thereto, the cutting elements comprising the construction as recited in claim 1 . 10. The bit as recited in claim 1 wherein the body comprises a number of fixed blades extending outwardly from the body, and wherein the cutting elements are attached to one or more of the blades. 11. A thermally stable element containing assembly comprising; a volume of precursor material grains useful for forming an ultra-hard body having a hardness of greater than about 4,000 HV at high-pressure-high temperature processing conditions; and a thermally stable sintered element disposed within the volume of the precursor material and having a thickness of about 2 mm or more; wherein the ultra-hard body is formed by subjecting the volume of precursor material to high pressure-high temperature processing condition, wherein the thermally stable element is relatively more thermally stable than the ultra-hard body, and wherein the average grain size of the thermally stable sintered element is less than that of the precursor material grains. 12. The assembly as recited in claim 11 wherein the thermally stable element has an average grain size of less than about 10 microns. 13. The assembly as recited in claim 11 wherein the thermally stable element is bonded to the ultra-hard body during the high pressure-high temperature processing conditions. 14. The assembly as recited in claim 11 wherein the precursor material is diamond grains, and wherein the ultra-hard body is formed in the presence of a catalyst material to form a polycrystalline diamond body. 15. The assembly as recited in claim 11 wherein the thermally stable element is positioned within the body to form a portion of a working surface. 16. A method for making an ultra-hard composite construction comprising: combining a sintered thermally stable element together with a volume of precursor material grains to form an assembly; and subjecting the assembly to high pressure-high temperature processing conditions to sinter the volume precursor material grains to form an ultra-hard body having a hardness of greater than about 4,000 HV, wherein the thermally stable element has a thickness of about 2 mm or more; wherein during the step of subjecting, the thermally stable element is bonded to the ultra-hard body to form at least part of a working surface, wherein the thermally stable element is relatively more thermally stable than the body, wherein the average grain size of the thermally stable sintered element is less than the precursor material grains. 17. The method as recited in claim 16 wherein the assembly includes a metallic substrate disposed thereby, and wherein during the step of subjecting the body is attached to the substrate. 18. The method as recited in claim 17 wherein the precursor material grains comprise diamond grains, and wherein the step of subjecting takes place in the presence of a catalyst material. 19. The method as recited in claim 18 wherein after the step of subjecting, the thermally stable element is substantially free of the catalyst material, and comprises bonded-together diamond grains. 20. A bit for drilling subterranean formations comprising a bit body and a number of cutting elements operatively attached thereto, the cutting elements comprising the construction made according to claim 16 .

Assignees

Inventors

Classifications

  • E21B10/567Primary

    with preformed cutting elements mounted on a distinct support, e.g. polycrystalline inserts · CPC title

  • having a cutting face with different segments, e.g. mosaic-type inserts · CPC title

  • Processes characterised by the sequence of their steps · CPC title

  • for porous or cellular structure, e.g. for use with diamonds as abrasives · CPC title

  • C22C26/00Primary

    Alloys containing diamond {or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes} · CPC title

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What does patent US9404309B2 cover?
Diamond bonded constructions comprise a polycrystalline diamond body having a matrix phase of bonded-together diamond grains and a plurality of interstitial regions between the diamond grains including a catalyst material used to form the diamond body disposed within the interstitial regions. A sintered thermally stable diamond element is disposed within and bonded to the diamond body, and is c…
Who is the assignee on this patent?
Smith International
What technology area does this patent fall under?
Primary CPC classification E21B10/567. Mapped technology areas include Fixed Constructions.
When was this patent published?
Publication date Tue Aug 02 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).