Aqueous organic-inorganic hybrid composition

Patent metadata

Field	Value
Publication number	US-9403950-B2
Application number	US-201113178864-A
Country	US
Kind code	B2
Filing date	Jul 8, 2011
Priority date	Dec 13, 2005
Publication date	Aug 2, 2016
Grant date	Aug 2, 2016

Abstract

Disclosed is an organic-inorganic hybrid composition containing a metal oxide (A) having a particle diameter of 1-400 nm and a polymer emulsion particle (B) having a particle diameter of 10-800 nm. The polymer emulsion particle (B) is obtained by polymerizing a hydrolyzable silicon compound (b1) and a vinyl monomer (b2) having a secondary and/or tertiary amide group in the presence of water and an emulsifying agent.

First claim

The invention claimed is:

1. An aqueous organic-inorganic hybrid composition characterized by comprising:
a metal oxide (A) having a particle size of 1 to 400 nm; and
a polymer emulsion particle (B) having a particle size of 10 to 800 nm, obtained by polymerizing a hydrolyzable silicon compound (b1) and a secondary amide group-containing vinyl monomer (b2) in the presence of water and an emulsifier,
wherein an amount of the secondary amide group-containing vinyl monomer (b2) used for obtaining the polymer emulsion particle (B) is more than 0 and 0.5 or less in terms of a mass ratio (b2)/(B) of the secondary amide group-containing vinyl monomer (b2) to the polymer emulsion particle (B) to be obtained, and
the polymer emulsion particle (B) is a core/shell structure formed of two or more layers, wherein each of the core and shell comprises a polymer, and wherein the core and the shell are different from one another.

2. The aqueous organic-inorganic hybrid composition according to claim 1 , wherein a mass ratio (b2)/(A) of the secondary amide group-containing vinyl monomer (b2) used for obtaining the polymer emulsion particle (B) to the metal oxide (A) is 0.1 or more and 1.0 or less.

3. The aqueous organic-inorganic hybrid composition according to claim 1 , wherein a mass ratio (b2)/(b1) of the secondary amide group-containing vinyl monomer (b2) to the hydrolyzable silicon compound (b1) in the innermost layer of the two or more layers is 1.0 or less, and the mass ratio (b2)/(b1) in the outermost layer of the two or more layers is 0.1 or more and 5.0 or less.

4. The aqueous organic-inorganic hybrid composition according to claim 1 , wherein the polymer emulsion particle (B) is obtained by polymerizing the hydrolyzable silicon compound (b1) and the secondary amide group-containing vinyl monomer (b2) in the presence of a seed particle which is obtained by polymerizing the secondary amide group-containing vinyl monomer (b2) and/or an additional vinyl monomer (b3) copolymerizable with the monomer (b2) and/or the hydrolyzable silicon compound (b1) in the presence of water and an emulsifier.

5. The aqueous organic-inorganic hybrid composition according to claim 3 , wherein a mass ratio (b2)/(A) of the secondary amide group-containing vinyl monomer (b2) used for obtaining the polymer emulsion particle (B) to the metal oxide (A) is 0.1 or more and 1.0 or less.

6. The aqueous organic-inorganic hybrid composition according to claim 4 , wherein a mass ratio (b2)/(A) of the secondary amide group-containing vinyl monomer (b2) used for obtaining the polymer emulsion particle (B) to the metal oxide (A) is 0.1 or more and 1.0 or less.

7. The aqueous organic-inorganic hybrid composition according to claim 2 , wherein a mass ratio (b2)/(b1) of the secondary amide group-containing vinyl monomer (b2) to the hydrolyzable silicon compound (b1) the innermost layer of the two or more layers is 1.0 or less, and the mass ratio (b2)/(b1) in the outermost layer of the two or more layers is 0.1 or more and 5.0 or less.

8. The aqueous organic-inorganic hybrid composition according to claim 4 , wherein a mass ratio (b2)/(b1) of the secondary amide group-containing vinyl monomer (b2) to the hydrolyzable silicon compound (b1) in the innermost layer of the two or more layers is 1.0 or less, and the mass ratio (b2)/(b1) in the outermost layer of the two or more layers is 0.1 or more and 5.0 or less.

9. The aqueous organic-inorganic hybrid composition according to claim 2 , wherein the polymer emulsion particle (B) is obtained by polymerizing the hydrolyzable silicon compound (b1) and the secondary amide group-containing vinyl monomer (b2) in the presence of a seed particle which is obtained by polymerizing the secondary amide group-containing vinyl monomer (b2) and/or an additional vinyl monomer (b3) copolymerizable with the monomer (b2) and/or the hydrolyzable silicon compound (b1) in the presence of water and an emulsifier.

10. The aqueous organic-inorganic hybrid composition according to claim 3 , wherein the polymer emulsion particle (B) is obtained by polymerizing the hydrolyzable silicon compound (b1) and the secondary amide group-containing vinyl monomer (b2) in the presence of a seed particle which is obtained by polymerizing the secondary amide group-containing vinyl monomer (b2) and/or an additional vinyl monomer (b3) copolymerizable with the monomer (b2) and/or the hydrolyzable silicon compound (b1) in the presence of water and an emulsifier.

11. The aqueous organic-inorganic hybrid composition according to claim 1 , wherein the polymer emulsion particle (B) is obtained by polymerizing the hydrolyzable silicon compound (b1) and the secondary amide group-containing vinyl monomer (b2) in the presence of a seed particle which is obtained by polymerizing the hydrolyzable silicon compound (b1) in the presence of water and an emulsifier.

12. The aqueous organic-inorganic hybrid composition according to claim 2 , wherein the polymer emulsion particle (B) is obtained by polymerizing the hydrolyzable silicon compound (b1) and the secondary amide group-containing vinyl monomer (b2) in the presence of a seed particle which is obtained by polymerizing the hydrolyzable silicon compound (b1) in the presence of water and an emulsifier.

13. The aqueous organic-inorganic hybrid composition according to claim 1 , wherein the amount of the secondary amide group-containing vinyl monomer (b2) used for obtaining the polymer emulsion particle (B) is 0.1 or more and 0.5 or less in terms of a mass ratio (b2)/(B) of the secondary amide group-containing vinyl monomer (b2) to the polymer emulsion particle (B) to be obtained.

Assignees

• Niguma Tatsuro
• Takanohashi Hiroaki
• Nakabayashi Akira
• Asahi Kasei Chemicals Corp
• Asahi Kasei E Materials Corp

Inventors

• Niguma Tatsuro
• Takanohashi Hiroaki
• Nakabayashi Akira

Classifications

• C08K3/22

  of metals · CPC title

• C08K3/346

  Clay · CPC title

• Y10T428/254

  Polymeric or resinous material · CPC title

• Y10S977/777

  Metallic powder or flake · CPC title

• C08K3/36

  Silica · CPC title