High-frequency signal transmission line and electronic device

Patent metadata

Field	Value
Publication number	US-9401531-B2
Application number	US-201414191595-A
Country	US
Kind code	B2
Filing date	Feb 27, 2014
Priority date	Feb 3, 2012
Publication date	Jul 26, 2016
Grant date	Jul 26, 2016

Abstract

A high-frequency signal transmission line includes a dielectric body including a plurality of dielectric sheets. A signal line is provided in the dielectric body. A connector is mounted on a first main surface of the dielectric body and electrically connected to the signal line. A ground conductor is provided on a second main surface side of the dielectric body, compared with the signal line, and faces the signal line across the dielectric sheet. In the ground conductor, conductor-missing portions are provided in which no conductors are provided in at least portions of regions overlapping with the signal line in planar in connection portions. Adjustment conductors are provided in the second main surface of the dielectric body, and overlap with at least portions of the conductor-missing portions in the planar view.

First claim

What is claimed is:

1. A high-frequency signal transmission line comprising:
a body including a plurality of insulator layers laminated on each other;
a linear signal line provided in or on the body;
a first ground conductor facing the signal line across at least one of the plurality of insulator layers; and
an adjustment conductor; wherein
the body includes a connection portion in which the signal line and an external circuit are electrically connected in a first main surface of the body, and a line portion in which the signal line is provided, the line portion extending from the connection portion;
in the first ground conductor, a conductor-missing portion is provided in at least a portion of a region overlapping with the signal line, in a planar view from a lamination direction in the connection portion; and
the adjustment conductor is provided in a second main surface of the body, and overlaps with at least a portion of the conductor-missing portion in the planar view from the lamination direction; and
the adjustment conductor is not provided in the line portion.

2. The high-frequency signal transmission line according to claim 1 , wherein a portion of the adjustment conductor overlaps with the signal line in the planar view of the body from the lamination direction.

3. The high-frequency signal transmission line according to claim 1 , wherein the adjustment conductor includes an insulating substrate in which a metal plate or a conductor layer is provided.

4. The high-frequency signal transmission line according to claim 1 , wherein the adjustment conductor is fixed to the body via an adhesive or a resist material.

5. The high-frequency signal transmission line according to claim 1 , wherein the adjustment conductor is not electrically connected to the signal line or the first ground conductor.

6. The high-frequency signal transmission line according to claim 1 , wherein the first ground conductor is provided on the first main surface side of the body, compared with the signal line.

7. The high-frequency signal transmission line according to claim 1 , further comprising:
an external electrode provided on the first main surface of the connection portion of the body and electrically connected to the signal line; wherein
the signal line is electrically connected to the external circuit through the external electrode.

8. The high-frequency signal transmission line according to claim 1 , wherein capacitance is generated between the adjustment conductor and the signal line and capacitance is generated between the adjustment conductor and the first ground conductor.

9. The high-frequency signal transmission line according to claim 1 , further comprising:
a second ground conductor provided on the first main surface side of the body, compared with the signal line, and facing the signal line across at least one of the plurality of insulator layers; wherein
the first ground conductor is provided on the second main surface side of the body, compared with the signal line; and
a plurality of openings are provided in at least one of the first ground conductor and the second ground conductor, the plurality of openings being arranged along the signal line in the planar view from the lamination direction.

10. The high-frequency signal transmission line according to claim 9 , wherein
a characteristic impedance of the signal line in a first region overlapping with the openings is higher than a characteristic impedance of the signal line in a second region not overlapping with the openings; and
the characteristic impedance of the signal line in the first region and the characteristic impedance of the signal line in the second region are set so that a characteristic impedance of an entirety of the signal line is a predetermined characteristic impedance.

11. The high-frequency signal transmission line according to claim 1 , further comprising:
a connector is mounted on the first main surface of the connection portion of the body, and is electrically connected to the signal line; wherein
the signal line is electrically connected to the external circuit through the connector.

12. The high-frequency signal transmission line according to claim 11 , wherein the adjustment conductor is configured such that a characteristic impedance of the connector has a predetermined characteristic impedance.

13. An electronic device comprising:
a high-frequency signal transmission line; and
a housing containing the high-frequency signal transmission line; wherein
the high-frequency signal transmission line includes:
a body including a plurality of insulator layers laminated on each other;
a linear signal line provided in or on the body;
a first ground conductor facing the signal line across at least one of the plurality of insulator layers; and
an adjustment conductor; wherein
the body includes a connection portion in which the signal line and an external circuit are electrically connected in a first main surface of the body, and a line portion in which the signal line is provided, the line portion extending from the connection portion;
in the first ground conductor, a conductor-missing portion is provided in at least a portion of a region overlapping with the signal line, in a planar view from a lamination direction in the connection portion; and
the adjustment conductor is provided in a second main surface of the body, and overlaps with at least a portion of the conductor-missing portion in the planar view from the lamination direction; and

the adjustment conductor is not provided in the line portion.

14. The electronic device according to claim 13 , wherein a portion of the adjustment conductor overlaps with the signal line in the planar view of the body from the lamination direction.

15. The electronic device according to claim 13 , wherein the adjustment conductor includes an insulating substrate in which a metal plate or a conductor layer is provided.

16. The electronic device according to claim 13 , wherein the adjustment conductor is fixed to the body via an adhesive or a resist material.

17. The electronic device according to claim 13 , wherein the adjustment conductor is not electrically connected to the signal line or the first ground conductor.

18. The electronic device according to claim 13 , wherein the first ground conductor is provided on the first main surface side of the body, compared with the signal line.

19. The electronic device according to claim 13 , further comprising:
a second ground conductor provided on the first main surface side of the body, compared with the signal line, and facing the signal line across at least one of the plurality of insulator layers; wherein
the first ground conductor is provided on the second main surface side of the body, compared with the signal line; and
a plurality of openings are provided in at least one of the first ground conductor and the second ground conductor, the plurality of openings being arranged along the signal line in the planar view from the lamination direction.

20. The electronic device according to claim 19 , wherein
a characteristic impedance of the signal line in a first region overlapping with the openings is higher than a characteristic impedance of the signal line in a second region not overlapping with the openings; and
the characteristic impedance of the signal line in the first region and the characteristic impedance of the signal line in the second region are set so that a characteristic impedance of an entirety of the signal li

Assignees

• Murata Manufacturing Co

Inventors

• Iida Kanto
• Tago Shigeru

Classifications

• H05K2201/09618

  Via fence, i.e. one-dimensional array of vias · CPC title

• H05K1/0225

  Single or multiple openings in a shielding, ground or power plane (H05K1/0227 takes precedence) · CPC title

• H05K2201/09327

  Special sequence of power, ground and signal layers in multilayer PCB · CPC title

• H03H7/38

  Impedance-matching networks · CPC title

• H05K1/0253

  Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings (H05K1/0251 takes precedence) · CPC title