Transparent conductive film, electronic device, and method for manufacturing electronic device

Patent metadata

Field	Value
Publication number	US-9401490-B2
Application number	US-201113881952-A
Country	US
Kind code	B2
Filing date	Jul 20, 2011
Priority date	Oct 29, 2010
Publication date	Jul 26, 2016
Grant date	Jul 26, 2016

Abstract

The present invention provides a transparent conductive film which is low in terms of surface resistivity and high in terms of transparency.
The transparent conductive film according to the present invention includes an adhesive conductive layer in openings of a conductive metal mesh layer provided on at least one surface of a transparent base material, wherein
the conductive layer is composed of a conductive adhesive composition containing (A) a water-soluble vinyl polymer, (B) an organic additive, and (C) a conductive organic polymer compound, the organic additive (B) is at least one member selected among water-soluble polyhydric alcohols, water-soluble pyrrolidones, and hydrophilic aprotic solvents, and the conductive organic polymer compound (C) is at least one member selected among polyanilines, polypyrroles, polythiophenes, and derivatives thereof.

In addition, the present invention provides an electronic device having the foregoing transparent conductive film and a method for manufacturing an electronic device including forming a photoelectric conversion layer on an anodic layer and sticking the conductive layer of the transparent conductive film and a surface of the photoelectric conversion layer to each other at a temperature at which the foregoing conductive adhesive composition is softened or higher.

First claim

The invention claimed is:

1. A transparent conductive film, consisting of:
a transparent base material;
a conductive metal mesh layer on a surface of the transparent base material; and
an adhesive conductive layer in openings of the conductive metal mesh layer;
wherein:
the conductive metal mesh layer is a fine mesh structure of a metal or alloy in a grid pattern;
the conductive layer consists of a conductive adhesive composition, consisting of a water-soluble vinyl polymer (A), an organic additive (B), and a conductive organic polymer compound (C);
the organic additive (B) is at least one member selected from the group consisting of a water-soluble polyhydric alcohol, a water-soluble pyrrolidone, and a hydrophilic aprotic solvent;
the conductive organic polymer compound (C) is at least one member selected from the group consisting of a polyaniline, a polvpyrrole, a polythiophene, and a derivative thereof;
the conductive adhesive composition comprises 10 to 40 parts by mass of component (A), 20 to 65 parts by mass of component (B), and 5 to 55 parts by mass of component (C), based on a total of 100 parts by mass of components (A), (B), and (C); and
the water-soluble vinyl polymer (A) is an acrylic acid polymer.

2. The film according to claim 1 , wherein, when a glass transition temperature of the water-soluble vinyl polymer (A) is T1, a melting point of the organic additive (B) is T2, and a boiling point of the organic additive (B) at 0.101 MPa (760 mmHg) is T3, T2<T1<T3.

3. An electronic device comprising the transparent conductive film according to claim 1 .

4. The electronic device according to claim 3 , comprising the transparent conductive film, a photoelectric conversion layer, and a cathodic layer arranged in this order.

5. The film according to claim 1 , wherein the conductive mesh layer has a thickness of from 20 nm to 100 μm.

6. The film according to claim 1 , wherein a glass transition temperature of the water-soluble vinyl polymer (A) is from −50 to 150° C.

7. The film according to claim 1 , wherein a glass transition temperature of the water-soluble vinyl polymer (A) is from 20 to 140° C.

8. The film according to claim 1 , wherein a glass transition temperature of the water-soluble vinyl polymer (A) is from 30 to 130° C.

9. The film according to claim 1 , wherein the organic additive (B) has a boiling point of from 120 to 300° C.

10. The film according to claim 1 , wherein the organic additive (B) has a boiling point of from 140 to 300° C.

11. The film according to claim 1 , wherein the conductive layer has a thickness of from 5 to 10,000 nm.

12. The film according to claim 1 , wherein the conductive layer has a thickness of from 30 to 3,000 nm.

13. The film according to claim 1 , wherein the water-soluble vinyl polymer (A) has a structural unit —CH 2 —CH(COOH)— and contains at least 30 mole % of the structural unit.

14. The film according to claim 1 , wherein a total light transmittance of the conductive layer is 80% or more.

15. The film according to claim 1 , wherein a weight average molecular weight (Mw) of the water-soluble polyvinyl polymer (A) is from 500 to 300,000.

16. The film according to claim 1 , wherein a weight average molecular weight (Mw) of the water-soluble polyvinyl polymer (A) is from 1,000 to 200,000.

17. The film according to claim 1 , wherein a weight average molecular weight (Mw) of the water-soluble polyvinyl polymer (A) is from 3,000 to 150,000.

18. A method for manufacturing an electronic device comprising a transparent conductive film, the method comprising:
forming a photoelectric conversion layer on a cathodic layer; and
sticking an adhesive conductive layer of the transparent conductive film and a surface of the photoelectric conversion layer to each other at a temperature at which a constituent conductive adhesive composition of the adhesive conductive layer is softened or higher;
wherein:
the transparent conductive film, consists of:
a transparent base material;
a conductive metal mesh layer on a surface of the transparent base material; and
the adhesive conductive layer in openings of the conductive metal mesh layer;
wherein:
the conductive metal mesh layer is a fine mesh structure of a metal or alloy in a grid pattern;
the conductive layer consists of the conductive adhesive composition, consisting of a water-soluble vinyl polymer (A), an organic additive (B), and a conductive organic polymer compound (C);
the organic additive (B) is at least one member selected from the group consisting of a water-soluble polyhydric alcohol, a water-soluble pyrrolidone, and a hydrophilic aprotic solvent;
the conductive organic polymer compound (C) is at least one member selected from the group consisting of a polyaniline, a polypyrrole, a polythiophene, and a derivative thereof;
the conductive adhesive composition comprises 10 to 40 parts by mass of component (A), 20 to 65 parts by mass of component (B), and 5 to 55 parts by mass of component (C), based on a total of 100 parts by mass of components (A), (B), and (C); and
the water-soluble vinyl polymer (A) is an acrylic acid polymer.

Assignees

• Kato Kunihisa
• Muto Tsuyoshi
• Uemura Kazue
• Nakajima Emi
• Lintec Corp

Inventors

• Kato Kunihisa
• Muto Tsuyoshi
• Uemura Kazue
• Nakajima Emi

Classifications

• C09J7/381

  based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds · CPC title

• C09J2479/02

  polyamine · CPC title

• C09J2481/00

  Presence of sulfur containing polymers · CPC title

• Y10T156/10

  Methods of surface bonding and/or assembly therefor · CPC title

• C08J2323/06

  Polyethene · CPC title