Shingled solar cell module

Patent metadata

Field	Value
Publication number	US-9401451-B2
Application number	US-201414572206-A
Country	US
Kind code	B2
Filing date	Dec 16, 2014
Priority date	May 27, 2014
Publication date	Jul 26, 2016
Grant date	Jul 26, 2016

Abstract

A high efficiency configuration for a solar cell module comprises solar cells arranged in a shingled manner to form super cells, which may be arranged to efficiently use the area of the solar module, reduce series resistance, and increase module efficiency.

First claim

What is claimed is:

1. A method comprising:
providing a silicon wafer having a length;
scribing a scribe line on the silicon wafer to define a solar cell region;
applying an electrically conductive adhesive bonding material to a surface of the silicon wafer;
separating the silicon wafer along the scribe line to provide a solar cell strip comprising a portion of the electrically conductive adhesive bonding material disposed adjacent to a long side of the solar cell strip;
arranging a plurality of solar cell strips in line with long sides of adjacent solar cell strips overlapping and a portion of the electrically conductive adhesive bonding material disposed in between; and
curing the electrically conductive bonding material, thereby bonding adjacent overlapping solar cell strips to each other and electrically connecting them in series.

2. A method as in claim 1 wherein:
the arranging comprises forming a layered structure; and
the curing comprises the application of heat and/or pressure to the layered structure.

3. A method as in claim 2 wherein the layered structure comprises a thermoplastic olefin polymer encapsulant.

4. A method as in claim 3 wherein the layered structure comprises:
a white backing sheet; and
darkened stripes on the white backing sheet.

5. A method as in claim 1 wherein:
a plurality of wafers are provided on a template;
the conductive adhesive bonding material is dispensed on the plurality of wafers; and
the plurality of wafers are simultaneously separated into a plurality of solar cell strips with a fixture.

6. A method as in claim 5 further comprising transporting the plurality of solar cell strips as a group, and wherein the arranging comprises arranging the plurality of solar cell strips into a module.

7. A method as in claim 1 wherein the arranging comprises arranging at least nineteen solar cell strips having a breakdown voltage of at least 10V in line with only a single bypass diode.

8. A method as in claim 7 further comprising forming a ribbon conductor between one of the at least nineteen solar cell strips and the single bypass diode.

9. A method as in claim 8 wherein the single bypass diode is located in a first junction box of a first solar module that is in mating arrangement with a second junction box of a second solar module.

10. A method as in claim 7 further comprising forming a ribbon conductor between one of the at least nineteen solar cell strips and a smart switch.

11. A method as in claim 1 wherein an overlapping cell strip of the plurality of solar cell strips overlaps the solar cell strip by between about 1-5 mm.

12. A method as in claim 1 wherein the solar cell strip includes a first chamfered corner.

13. A method as in claim 12 wherein a long side of an overlapping solar cell strip of the plurality of solar cell strips does not include a second chamfered corner.

14. A method as in claim 13 wherein a width of the solar cell strip is greater than a width of the overlapping solar cell strip such that the solar cell strip and the overlapping solar cell strip have approximately a same area.

15. A method as in claim 12 wherein a long side of an overlapping solar cell strip of the plurality of solar cell strips includes a second chamfered corner.

16. A method as in claim 15 wherein the long side of the overlapping solar cell strip of the plurality of solar cell strips overlaps the long side of the cell strip including the first chamfered corner.

17. A method as in claim 15 wherein the long side of the overlapping solar cell strip of the plurality of solar cell strips overlaps a long side of the cell strip not including the first chamfered corner.

18. A method as in claim 1 further comprising connecting the plurality of solar cell strips with another plurality of solar cell strips utilizing an interconnect.

19. A method as in claim 18 wherein a portion of the interconnect is covered by a dark film or is colored.

20. A method as in claim 18 wherein the plurality of solar cell strips is connected in series with the other plurality of solar cell strips.

21. A method as in claim 1 wherein the scribing comprises laser scribing.

22. A method as in claim 21 comprising laser scribing the scribe line and then applying the electrically conductive adhesive bonding material.

23. A method as in claim 21 comprising applying the electrically conductive adhesive bonding material to the wafer and then laser scribing the scribe line.

24. A method as in claim 23 wherein:
the applying comprises applying uncured electrically conductive adhesive bonding material; and
the laser scribing comprises avoiding curing the uncured conductive adhesive bonding material with heat from the laser.

25. A method as in claim 24 wherein the avoiding comprises selecting a laser power and/or a distance between the scribe line and the uncured conductive adhesive bonding material.

26. A method as in claim 1 wherein the applying comprises printing.

27. A method as in claim 1 wherein the applying comprises depositing using a mask.

28. A method as in claim 1 wherein the scribe line and the electrically conductive adhesive bonding material are on the surface.

29. A method as in claim 1 wherein the separating comprises using a roller to apply pressure to the wafer.

30. A method as in claim 1 wherein the providing comprises providing the silicon wafer with a metallization pattern such that the separating produces the solar cell strip having the metallization pattern along the long side.

31. A method as in claim 30 wherein the metallization pattern comprises a bus bar or a discrete contact pad.

32. A method as in claim 30 wherein the providing comprises printing the metallization pattern.

33. A method as in claim 30 wherein the providing comprises electroplating the metallization pattern.

34. A method as in claim 30 wherein the metallization pattern comprises a feature configured to confine spreading of the electrically conductive adhesive bonding material.

35. A method as in claim 1 wherein a length of the long side of the solar cell strip reproduces a shape of the wafer.

36. A method as in claim 35 wherein the length is 156 mm or 125 mm.

37. A method as in claim 35 wherein an aspect ratio between a width of the solar cell strip and the length is between about 1:2 to about 1:20.

Assignees

• Cogenra Solar Inc
• Sunpower Corp

Inventors

• Morad Ratson
• Almogy Gilad
• Suez Itai
• Hummel Jean
• Beckett Nathan
• Lin Yafu
• Maydan Dan
• Gannon John

Classifications

• H10F77/937

  Busbar structures for modules · CPC title

• H10F77/935 Primary

  for photovoltaic devices or modules · CPC title

• H10F77/215

  Geometries of grid contacts · CPC title

• H10F77/211

  for photovoltaic cells · CPC title

• H10F77/50

  Encapsulations or containers (for photovoltaic modules H10F19/80) · CPC title