Multiheight contact via structures for a multilevel interconnect structure

Patent metadata

Field	Value
Publication number	US-9401309-B2
Application number	US-201414468744-A
Country	US
Kind code	B2
Filing date	Aug 26, 2014
Priority date	Aug 26, 2014
Publication date	Jul 26, 2016
Grant date	Jul 26, 2016

Abstract

Contact openings extending to sacrificial layers located at different depths can be formed by sequentially exposing a greater number of openings in a mask layer by iterative alternation of trimming of a slimming layer over the mask layer and an anisotropic etch that recesses pre-existing contact openings by one level. In one embodiment, pairs of an electrically conductive via contact and electrically conductive electrodes can be simultaneously formed as integrated line and via structures. In another embodiment, encapsulated unfilled cavities can be formed in the contact openings by non-conformal deposition of a material layer, electrically conductive electrodes can be formed by replacement of portions of the sacrificial layers, and the electrically conductive via contacts can be subsequently formed on the electrically conductive electrodes. Electrically conductive via contacts extending to electrically conductive electrodes located at different level can be provided with self-aligned insulating liner.

First claim

What is claimed is:

1. A method of forming contacts in a multilayer memory device, comprising:
a) providing an in-process memory device, comprising:
a contact region;
a device region;
a stack of alternating plurality of sacrificial layers and insulating layers over a substrate and extending in a first direction substantially parallel to a major surface of the substrate from the contact region to the device region; and
a hard mask layer formed over the contact region and the device region;

b) forming a plurality of contact openings in the contact region, each contact opening extending in a second direction substantially perpendicular to the major surface of the substrate through the hard mask layer and a portion of the stack to a respective sacrificial layer;
c) forming an insulating liner covering sidewalls of each contact opening of the plurality of contact openings, wherein the insulating liner does not cover a bottom of each contact opening such that a portion of the respective sacrificial layer is exposed at the bottom of the contact opening;
d) forming a non-conformal layer over the hard mask layer that covers a top opening of each contact opening to form a corresponding contact opening air gap.

2. The method of claim 1 , wherein step c) comprises:
forming a conformal insulating material layer covering the sidewalls and bottom of each contact opening;
selectively etching the conformal insulating material layer on the bottom of each contact opening to expose a portion of the respective sacrificial layer.

3. The method of claim 1 , wherein:
the insulating liner comprises silicon oxide;
each insulating layer comprises silicon oxide; and
each sacrificial layer comprises silicon nitride.

4. The method of claim 3 , further comprising:
e) forming a backside contact trench extending in the second direction through the non-conformal layer, the hard mask layer, and the stack to the substrate;
wherein the backside contact trench exposes sidewall portions of each of the sacrificial layers in the stack.

5. The method of claim 4 , further comprising:
f) selectively removing at least a portion of each sacrificial layer in the stack through the backside contact trench to form a plurality of recesses,
wherein each recess extends along the first direction from the device region to the contact region to connect to a respective one of the plurality of air gaps.

6. The method of claim 5 , wherein during step 0 the insulating liner protects the sidewalls of each of the plurality of contact openings from an etchant used to remove the at least a portion of each sacrificial layer.

7. The method of claim 6 , further comprising:
g) depositing an electrically conductive electrode material to:
cover a surface of the non-conformal layer;
fill each of the recesses through the backside contact trench; and
conformally cover sidewalls and a bottom of the backside contact trench, wherein the filled recesses form a plurality of electrically conductive electrodes extending in the first direction from the device region to the contact region.

8. The method of claim 7 , wherein, during step g) the insulating liner and non-conformal layer substantially prevent the electrically conductive electrode material from covering the sidewalls of each contact opening.

9. The method of claim 8 , wherein the electrically conductive electrode material comprises a metal or metal nitride.

10. The method of claim 9 , wherein electrically conductive electrode material comprises tungsten.

11. The method of claim 8 , further comprising:
h) removing the non-conformal layer to expose a surface of the hard mask layer and openings to each of the contact openings in the hard mask layer.

12. The method of claim 11 , further comprising:
i) forming an insulating spacer substantially covering the sidewalls of each of the contact openings and sidewalls of the back contact trench while leaving the bottoms of each of the contact openings and a bottom of the back contact trench exposed.

13. The method of claim 12 , further comprising:
j) depositing a fill layer of electrically conducting material on the hard mask and substantially filling each of the contact openings and the back contact trench.

14. The method of claim 13 , wherein the fill layer of electrically conducting material comprises a metal or metal nitride.

15. The method of claim 14 , wherein the fill layer of electrically conducting material comprises tungsten.

16. The method of claim 13 , further comprising:
k) removing a portion of the fill layer of electrically conducting material covering the hard mask layer to expose a surface of the hard mask layer comprising the tops of the filled contact openings and a top of the filed backside contact trench.

17. The method of claim 16 , wherein step k) results in:
a plurality of electrically conductive via contacts, each via contact extending in the second direction from the exposed top of the filled contact opening to a respective one of the plurality of electrically conductive electrodes; and
a backside contact extending in the second direction from the exposed top of the backside contact trench to the substrate;
wherein:
each one of the plurality of electrically conductive via contacts is in electrical contact with a respective one of the electrically conductive electrodes and electrically insulated from the others of the plurality of electrically conductive via contacts and the plurality of electrically conductive electrodes; and
the backside contact is in electrical contact with the substrate and electrically insulated from the plurality of electrically conductive via contact via contacts and the plurality of electrically conductive electrodes.

18. The method of claim 17 , wherein:
the in-process memory device further comprises a peripheral device region covered by the hard mask layer;
prior to step i) the method further comprises forming at least one peripheral contact opening extending in the second direction through the hard mask layer to a peripheral device in the peripheral device region;
step i) comprises forming the insulating spacer to substantially cover sidewalls of the at least one peripheral device contact opening while exposing a bottom portion of the peripheral device contact opening that contacts or comprises at least a portion of the peripheral device; and
step j) comprises filling the peripheral device contact opening with the electrically conducting material.

19. The method of claim 18 , wherein:
step k) comprises exposing a surface of the hard mask layer comprising a top of the filled peripheral device contact opening which results in a peripheral device electrically conductive via contact extending from the top of the peripheral device contact opening to the peripheral device.

20. The method of claim 17 , wherein:
the device region comprises an array of monolithic three dimensional NAND strings having a plurality of device levels disposed above the substrate;
the backside contact comprises a source line of the array of monolithic three dimensional NAND strings;
electrically conductive electrodes comprise vertically separated word lines; and
each word line electrically contacts a respective one of the plurality of electrically conductive via contacts; and
each word line electrically contacts or comprises a respective one of a plurality of vertically separated control gate electrodes of the array of monolithic three dimensional NAND strings.

21. The method of claim

Assignees

• Sandisk Technologies Inc
• Sandisk Technologies Llc

Inventors

• Izumi Keisuke
• Yanagida Naohito
• Sano Michiaki
• Yamazaki Takehiro
• Iuchi Hiroaki
• Yanai Akio
• Mizuno Genta
• Yamaguchi Minoru

Classifications

• H10P50/283

  by chemical means · CPC title

• H10P50/73

  using masks for insulating materials · CPC title

• H10W20/089 Primary

  using processes for implementing desired shapes or dispositions of the openings, e.g. double patterning · CPC title

• H10W20/083

  the openings being via holes penetrating underlying conductors · CPC title

• H10W20/076

  in via holes or trenches · CPC title