Holding device, method of determining attraction abnormality in holding device, lithography apparatus, and method of manufacturing article
US-2024393682-A1 · Nov 28, 2024 · US
US9400426B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9400426-B2 |
| Application number | US-201213603575-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 5, 2012 |
| Priority date | Sep 7, 2011 |
| Publication date | Jul 26, 2016 |
| Grant date | Jul 26, 2016 |
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An imprint apparatus molds an uncured resin on a substrate and cures the resin to form a pattern of the cured resin on the substrate. The apparatus includes a mold holding unit that holds the mold, a substrate holding unit that holds the substrate, a deforming unit that deforms the mold held by the mold holding unit into a convex shape toward the substrate, a driving unit that changes an attitude of the mold or the substrate during a releasing operation in which the mold deformed into the convex shape is released from the resin to thereby make the position of a contact region at which the mold is brought into contact with the resin movable, a measuring unit that acquires image information indicating a state of the contact region, and a control unit configured to control the operation of the driving unit based on the image information.
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What is claimed is: 1. An imprint apparatus that molds an imprint material on a substrate using a mold and cures the imprint material to thereby form a pattern of the imprint material on the substrate, the imprint apparatus comprising: a mold holding mechanism configured to hold the mold; a substrate holding unit configured to hold the substrate; a deforming unit configured to deform the mold held by the mold holding mechanism into a convex shape toward the substrate; a measuring unit configured to obtain an image of a contact region at which the mold deformed into the convex shape is brought into contact with the imprint material; a driving unit configured to change a position of the contact region; and a control unit configured to calculate a plane coordinate of a centroid of the contact region based on the image and to control the operation of the driving unit based on the image acquired by the measuring unit during a releasing operation in which the mold is released from the imprint material such that the plane coordinate position of the centroid is directed toward a pre-acquired plane coordinate position of the center of a pattern-forming region on the substrate. 2. The imprint apparatus according to claim 1 , wherein the deforming unit is further configured to deform the mold into the convex shape toward the substrate by adjusting pressure in a space in contact with the mold. 3. The imprint apparatus according to claim 1 , wherein the control unit is further configured to calculate a moving speed of a boundary of the contact region during the releasing operation based on the image and to control the operation of the driving unit such that the moving speed is kept constant. 4. The imprint apparatus according to claim 1 , wherein the driving unit is an actuator that is installed in the mold holding mechanism and is configured to change the angle of the holding surface of the mold in the mold holding mechanism with respect to the plane of the substrate. 5. The imprint apparatus according to claim 1 , wherein the driving unit is an actuator that is provided in the substrate holding unit and is configured to change the angle of the holding surface of the substrate in the substrate holding unit with respect to the surface of the mold. 6. The imprint apparatus according to claim 1 , wherein the driving unit includes the mold holding mechanism and comprises a plurality of suction grooves configured to hold the mold by suction and a switching mechanism configured to switch the suction state of each of the plurality of suction grooves independently of one another. 7. The imprint apparatus according to claim 1 , wherein the driving unit is a moving mechanism configured to move the mold deformed into a convex shape toward the substrate while being held by the holding unit along the plane of the substrate. 8. The imprint apparatus according to claim 1 , further comprising: a load measurement unit configured to measure a load applied to the mold, wherein the control unit is further configured to calculate the area of the contact region during the releasing operation based on the image and control the relative speed between the substrate and the mold during the releasing operation such that the load does not exceed a value in which the suction pressure applied by the substrate holding unit is multiplied by the area of the contact region. 9. An imprint apparatus that molds an imprint material on a substrate using a mold and cures the imprint material to thereby form a pattern of the imprint material on the substrate, the imprint apparatus comprising: a mold holding mechanism configured to hold the mold; a substrate holding unit configured to hold the substrate; a deforming unit configured to deform the mold held by the mold holding mechanism into a convex shape toward the substrate; a measuring unit configured to obtain an image of a contact region at which the mold deformed into the convex shape is brought into contact with the imprint material; a driving unit configured to change a position of the contact region; and a control unit configured to cause the measuring unit to acquire the image with the mold deformed into the convex shape in contact with the imprint material, to calculate a plane coordinate of a centroid of the contact region based on the image and to control the driving unit based on the acquired image such that the plane coordinate position of the centroid is directed toward a pre-acquired plane coordinate position of the center of a pattern-forming region on the substrate.
Manufacture or treatment of nanostructures · CPC title
characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor · CPC title
Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic · CPC title
Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title
Microembossing · CPC title
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