Thin film deposition apparatus and thin film deposition method using electric field

Patent metadata

Field	Value
Publication number	US-9399826-B2
Application number	US-201414278638-A
Country	US
Kind code	B2
Filing date	May 15, 2014
Priority date	May 15, 2014
Publication date	Jul 26, 2016
Grant date	Jul 26, 2016

Abstract

A thin film deposition apparatus and a thin film deposition method using an electric field are provided. The thin film deposition apparatus includes: a first substrate; a plurality of electrodes in a 2D arrangement on the first substrate; and a solution provided on the plurality of electrodes and in which charged nanoparticles are distributed, wherein the charged nanoparticles are selectively deposited on at least a part of the plurality of electrodes by independently applying a voltage to each of the plurality of electrodes.

First claim

What is claimed is:

1. A thin film deposition apparatus comprising:
a first substrate;
a plurality of electrodes disposed on the first substrate in a two-dimensional arrangement;
a membrane layer disposed on the plurality of electrodes, the membrane layer comprising a first layer, disposed to cover the electrodes, and a second layer disposed on the first layer, wherein the first layer comprises a flexible material and the second layer is transformable into a transparent material by annealing the second layer in a solvent; and
a solution disposed on the plurality of electrodes, the solution comprising a plurality of charged nanoparticles distributed therewithin,
wherein the charged nanoparticles are selectively deposited on at least one of the plurality of electrodes by independently controlling voltages applied to each of the plurality of electrodes.

2. The thin film deposition apparatus of claim 1 , wherein the thin film deposition apparatus forms a multilayer thin film comprising a multilayered structure comprising at least a first nanoparticle layer of a first material, and a second nanoparticle layer of a second material, different from the first material.

3. The thin film deposition apparatus of claim 1 , wherein the nanoparticles comprise metal, ceramics, or polymer.

4. The thin film deposition apparatus of claim 1 , wherein the voltages applied to each of the plurality of electrodes are within a range of about 1.2 V to about 7 V.

5. The thin film deposition apparatus of claim 1 , further comprising a first auxiliary electrode disposed at a first side of the solution, and a second auxiliary electrode disposed at a second side of the solution, opposite the first side.

6. The thin film deposition apparatus of claim 1 , further comprising a second substrate disposed on the solution.

7. The thin film deposition apparatus of claim 6 , wherein the second substrate comprises a conductive material.

8. The thin film deposition apparatus of claim 1 , wherein the first substrate comprises a porous material, and the plurality of electrodes are porous, such that gas within the solution is transmitted through the plurality of electrodes and the first substrate.

9. The thin film deposition apparatus of claim 8 , wherein a direct current voltage in a range of about 3 V to 3000 V or an alternating current voltage in the range of about 3 V to 3000 V is applied to each of the plurality of electrodes.

Assignees

• Samsung Electronics Co Ltd
• Univ California

Inventors

• Heo Jin S
• Park Hwi-Yeol
• Cho Kyung-Hoon
• Choi Kyoung-Hwan
• Kim Se-Jung
• Heller Michael J
• Song Young-Jun

Classifications

• C25D13/02 Primary

  with inorganic material · CPC title

• C25D13/00 Primary

  Electrophoretic coating characterised by the process (C25D15/00 takes precedence; compositions for electrophoretic coating C09D5/44) · CPC title

• C25D13/22

  Servicing or operating {apparatus or multistep processes} · CPC title

• C25D13/18

  using modulated, pulsed, or reversing current · CPC title

• C25D13/12

  characterised by the article coated · CPC title