Wiring board and method of manufacturing wiring board

Patent metadata

Field	Value
Publication number	US-9399825-B2
Application number	US-201414469690-A
Country	US
Kind code	B2
Filing date	Aug 27, 2014
Priority date	Sep 13, 2013
Publication date	Jul 26, 2016
Grant date	Jul 26, 2016

Abstract

A wiring board includes a first insulating layer; and a coil formed on the first insulating layer and including a first magnetic layer formed on the first insulating layer and formed by a plating layer, a coil portion formed on the first magnetic layer, a second insulating layer formed on the first insulating layer to cover the first magnetic layer and the coil portion, and a second magnetic layer formed on the second insulating layer and formed by a plating layer.

First claim

What is claimed is:

1. A wiring board comprising:
a plurality of insulating layers;
a plurality of wiring layers;
a through via provided to penetrate at least one of the insulating layers to electrically connect the wiring layers that are provided to interpose the at least one of the insulating layers therebetween;
a first insulating layer, which is one of the insulating layers; and
a coil formed on the first insulating layer and including
a first magnetic layer formed on the first insulating layer and formed by a plating layer to form a first convexo-concave shape on the first insulating layer,
a coil portion formed on the first magnetic layer to form a second convexo-concave shape on the first magnetic layer,
a second insulating layer, which is one of the insulating layers, formed on the first insulating layer to cover the first magnetic layer and the coil portion so as to absorb the first convexo-concave shape and the second convexo-concave shape generated by the first magnetic layer and the coil portion, respectively, an upper surface of the second insulating layer being a flat surface that is flat with respect to the first insulating layer, and
a second magnetic layer formed on the second insulating layer and formed by a plating layer, the second magnetic layer being formed to extend only in a direction that is parallel to the upper surface of the second insulating layer,

wherein the second insulating layer is formed to cover the entirety of the first magnetic layer including side surfaces and an upper surface of the first magnetic layer.

2. The wiring board according to claim 1 ,
wherein the coil further includes a third insulating layer formed on the second insulating layer, and the second magnetic layer is formed on an upper surface side of the second insulating layer via the third insulating layer,
wherein the thickness of the third insulating layer is thinner than the thickness of the second insulating layer, and
wherein the upper surface of the third insulating layer is more even than the upper surface of the second insulating layer.

3. The wiring board according to claim 1 , wherein the second insulating layer is formed by resin.

4. The wiring board according to claim 3 , wherein the resin includes magnetic filler.

5. The wiring board according to claim 1 , wherein the coil portion is fanned by a plating layer.

6. The wiring board according to claim 1 ,
wherein the coil includes a fourth insulating layer formed between the first insulating layer and the first magnetic layer,
wherein the thickness of the fourth insulating layer is thinner than the thickness of the first insulating layer, and
wherein the upper surface of the fourth insulating layer is more even than the upper surface of the first insulating layer.

7. The wiring board according to claim 1 , further comprising a sixth insulating layer that continuously covers an upper surface and side surfaces of the first magnetic layer, and an upper surface of the first insulating layer,
wherein the coil portion is provided on the first magnetic layer via the sixth insulating layer,
wherein the second insulating layer is provided on the first insulating layer and the first magnetic layer via the sixth insulating layer, and
wherein the thickness of the sixth insulating layer is thinner than the thickness of the second insulating layer.

8. A wiring board comprising:
a plurality of insulating layers;
a plurality of wiring layers;
a through via provided to penetrate at least one of the insulating layers to electrically connect the wiring layers that are provided to interpose the at least one of the insulating layers therebetween;
a first insulating layer, which is one of the insulating layers;
a coil formed on the first insulating layer and including
a first magnetic layer formed on the first insulating layer and formed by a plating layer to form a first convexo-concave shape on the first insulating layer,
a coil portion formed on the first magnetic layer to form a second convexo-concave shape on the first magnetic layer,
a second insulating layer, which is one of the insulating layers, formed on the first insulating layer to cover the first magnetic layer and the coil portion by embedding the first convexo-concave shape and the second convexo-concave shape generated by the first magnetic layer and the coil portion, respectively, an upper surface of the second insulating layer being a flat surface that is flat with respect to the first insulating layer, and
a second magnetic layer formed on the second insulating layer and formed by a plating layer;

a fifth insulating layer formed on the second insulating layer to cover the second magnetic layer;
a wiring formed on an upper surface of the fifth insulating layer; and
a via wiring formed to penetrate the fifth insulating layer and the second insulating layer to electrically connect the wiring and the coil portion,
wherein the second insulating layer is formed to cover the entirety of the first magnetic layer including side surfaces and an upper surface of the first magnetic layer.

9. The wiring board according to claim 8 ,
wherein the coil further includes a third insulating layer formed on the second insulating layer, and the second magnetic layer is formed on an upper surface side of the second insulating layer via the third insulating layer,
wherein the thickness of the third insulating layer is thinner than the thickness of the second insulating layer, and
wherein the upper surface of the third insulating layer is more even than the upper surface of the second insulating layer.

10. The wiring board according to claim 8 , wherein the second insulating layer is formed by resin.

11. The wiring board according to claim 10 , wherein the resin includes magnetic filler.

12. The wiring board according to claim 8 , wherein the coil portion is formed by a plating layer.

13. The wiring board according to claim 8 ,
wherein the coil includes a fourth insulating layer formed between the first insulating layer and the first magnetic layer,
wherein the thickness of the fourth insulating layer is thinner than the thickness of the first insulating layer, and
wherein the upper surface of the fourth insulating layer is more even than the upper surface of the first insulating layer.

14. The wiring board according to claim 8 , wherein the second magnetic layer is provided with an open portion and the via wiring is formed to penetrate within the open portion.

15. The wiring board according to claim 14 , wherein the open portion is provided to overlap one end of the coil portion such that the via wiring is connected to the one end of the coil portion.

16. The wiring board according to claim 8 , further comprising a sixth insulating layer that continuously covers an upper surface and side surfaces of the first magnetic layer, and an upper surface of the first insulating layer,
wherein the coil portion is provided on the first magnetic layer via the sixth insulating layer,
wherein the second insulating layer is provided on the first insulating layer and the first magnetic layer via the sixth insulating layer, and
wherein the thickness of the sixth insulating layer is thinner than the thickness of the second insulating layer.

17. The wiring board according to claim 8 , further comprising:
a second wiring, which is one of the wiring layers, on which the first insulating layer is formed;
a second via wiring formed to penetrate the fifth insulating layer, the second insulating layer and the first insulating layer,
wherein the second

Assignees

• Shinko Electric Ind Co

Inventors

• Fujii Tomoharu

Classifications

• H01F2017/0066

  with a magnetic layer · CPC title

• H01F17/0006

  Printed inductances (printed coils for dynamo-electric machines H02K3/26; printed circuits H05K) · CPC title

• H01F41/046

  structurally combined with ferromagnetic material · CPC title

• C23C18/1653

  Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating · CPC title

• H01F2017/0073

  with a special conductive pattern, e.g. flat spiral · CPC title