Electrically conductive adhesive compound and adhesive tape

Patent metadata

Field	Value
Publication number	US-9399723-B2
Application number	US-201214236249-A
Country	US
Kind code	B2
Filing date	Jul 10, 2012
Priority date	Aug 10, 2011
Publication date	Jul 26, 2016
Grant date	Jul 26, 2016

Abstract

A pressure-sensitive adhesive composition comprising a) a polymer-metal blend comprising at least one pressure-sensitive adhesive and at least one metal component melting in the temperature range from 50° C. to 400° C., and b) at least one fibrous, electrically conductive filler, the filler being present at least partly in the form of a bound fiber network with the metal component.

First claim

The invention claimed is:

1. A pressure-sensitive adhesive composition comprising
a) a polymer-metal blend comprising
at least one pressure-sensitive adhesive, and
at least one metal component melting in a temperature range from 50° C. to 400° C., and

b) at least one fibrous, electrically conductive filler, wherein the filler is present, at least partly, in a form of a bound fiber network with the at least one metal component.

2. The pressure-sensitive adhesive composition according to claim 1 , wherein the at least one metal component is a metal or a metal alloy.

3. The pressure-sensitive adhesive composition according to claim 1 , wherein the pressure-sensitive adhesive is a pressure-sensitive polyacrylate adhesive.

4. The pressure-sensitive adhesive composition according to claim 1 , wherein the pressure-sensitive adhesive is a pressure-sensitive rubber adhesive.

5. The pressure-sensitive adhesive composition according to claim 1 , wherein at least one of the at least one fibrous, electrically conductive filler is metallic.

6. The pressure-sensitive adhesive composition according to claim 1 , wherein at least one of the at least one fibrous, electrically conductive filler is a carbon modification or a carbon-containing chemical compound.

7. The pressure-sensitive adhesive composition according to claim 1 , wherein at least one of the at least one fibrous, electrically conductive filler is magnetic.

8. The pressure-sensitive adhesive composition according to claim 1 , wherein the pressure-sensitive adhesive has a layer thickness of 50 μm and a water vapor permeation of less than 50 g/m 2 d at 38° C. and 50% relative humidity.

9. The pressure-sensitive adhesive composition according to claim 1 , wherein the pressure-sensitive adhesive has a water content of less than 5000 ppm determined after 72 h of conditioning at 23° C. and 50% relative humidity by means of Karl Fischer titration.

10. The pressure-sensitive adhesive composition according to claim 9 , wherein the pressure-sensitive adhesive has a water content of less than 1000 ppm determined after 72 h of conditioning at 23° C. and 50% relative humidity by means of Karl Fischer titration.

11. A pressure-sensitive adhesive tape comprising at least one layer of the pressure-sensitive adhesive composition according to claim 1 .

12. The pressure-sensitive adhesive tape according to claim 11 , further comprising a layer of a carrier material.

13. The pressure-sensitive adhesive tape according to claim 11 , wherein the layer of a carrier material comprises an electrically conductive carrier material.

14. A method for adhesive bonding on a first substrate surface, the method comprising:
bonding the first substrate surface with the pressure-sensitive adhesive composition according to claim 1 or the pressure-sensitive adhesive tape according to claim 11 .

15. The method according to claim 14 , further comprising bonding the first substrate surface to a second substrate surface, at a bond site, with the pressure-sensitive adhesive composition according to claim 1 or the pressure-sensitive adhesive tape according to claim 11 .

16. The method according to claim 15 , further comprising:
heating the bond site, during or after the bonding operation, to a temperature above the melting temperature of the at least one metal component.

Assignees

• KEITE-TELGENBüSCHER KLAUS
• Tesa Se

Inventors

• KEITE-TELGENBüSCHER KLAUS

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/07331

  Connecting techniques · CPC title

• H10W72/074

  of anisotropic conductive adhesives · CPC title

• H10W72/07336

  Soldering or alloying · CPC title

• H10W72/351

  Materials of die-attach connectors · CPC title