High modulus, toughened one-component epoxy structural adhesives with high aspect ratio fillers
US-2024110085-A1 · Apr 4, 2024 · US
US9399697B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9399697-B2 |
| Application number | US-201214354985-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 8, 2012 |
| Priority date | Nov 10, 2011 |
| Publication date | Jul 26, 2016 |
| Grant date | Jul 26, 2016 |
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The present invention relates to hardeners for epoxy resins, which contain secondary aliphatic and primary aromatic amino groups. They harden surprisingly quickly together with epoxy resins even under cold and humid conditions and without blushing effects to give films with a high degree of hardness. They are especially suitable for coatings with high resistance requirements.
Opening claim text (preview).
The invention claimed is: 1. A hardener, suitable for hardening epoxy resins, containing at least one amine with at least one amino group of formula (I), where R represents a hydrogen atom or an alkyl group with 1 to 12 C atoms; Y represents a hydrogen atom, a monovalent hydrocarbon group with 1 to 12 C atoms, an alkoxy with 1 to 12 C atoms, or aryloxy group wit…
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
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