Resin composition for photoimprinting, pattern forming process and etching mask

US9399693B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9399693-B2
Application numberUS-201113979527-A
CountryUS
Kind codeB2
Filing dateDec 2, 2011
Priority dateJan 13, 2011
Publication dateJul 26, 2016
Grant dateJul 26, 2016

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A resin composition for photoimprinting, a cured product of the resin composition which is excellent in etching and heat resistance, and a pattern forming process using the resin composition are provided. The resin composition contains photocurable monomer (A) containing at least one carbazole compound of formula (I): a photocurable monomer (B) containing at least one compound of the following formulae (II), (III), and (IV): and a photopolymerization initiator (C). The weight ratio of the photocurable monomer (A) to the photocurable monomer (B) is from 30/70 to 87/13.

First claim

Opening claim text (preview).

The invention claimed is: 1. A resin composition, comprising: a photocurable monomer (A), a photocurable monomer (B), a photopolymerization initiator (C), and a viscosity-adjusting agent (D) of a polymer comprising a carbazole skeleton, wherein the photocurable monomer (A) comprises a carbazole compound of formula (I), the photocurable monomer (B) comprises at least one member selected from the group consisting of a compound of formula (II), a compound of formula (III)…

Assignees

Inventors

Classifications

Patent family

Related publications grouped by family.

External sources

Next steps

Free tools are coming soon. Tell us what you want to track and we'll notify you.

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9399693B2 cover?
A resin composition for photoimprinting, a cured product of the resin composition which is excellent in etching and heat resistance, and a pattern forming process using the resin composition are provided. The resin composition contains photocurable monomer (A) containing at least one carbazole compound of formula (I): a photocurable monomer (B) containing at least one…
Who is the assignee on this patent?
Hayashida Yoshihisa, Satsuka Takuro, Ikeda Teruyo, and 3 more
What technology area does this patent fall under?
Primary CPC classification G03F7/0002. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jul 26 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).