Chassis with airflow and thermal management

Patent metadata

Field	Value
Publication number	US-9398720-B1
Application number	US-201414530617-A
Country	US
Kind code	B1
Filing date	Oct 31, 2014
Priority date	May 30, 2014
Publication date	Jul 19, 2016
Grant date	Jul 19, 2016

Abstract

A system includes a chassis having a longitudinal axis defined therethrough and an upper airflow chamber, a central airflow chamber, and a lower airflow chamber formed longitudinally therethrough, a midplane secured within the chassis in a direction perpendicular to the longitudinal axis defined through the chassis, in which the midplane defines a front portion and a rear portion within the chassis, and wherein the midplane is configured to allow airflow therethrough, and a first printed circuit board disposed within the rear portion of the chassis in the upper airflow chamber, the first printed circuit board having a first end, a second end, and an opening formed therethrough, in which the first end of the first printed circuit board is operatively coupled to the midplane.

First claim

What is claimed is:

1. A system, comprising:
a chassis having a longitudinal axis defined therethrough and an upper airflow chamber, a central airflow chamber, and a lower airflow chamber formed longitudinally therethrough;
a midplane secured within the chassis in a direction perpendicular to the longitudinal axis defined through the chassis, wherein the midplane defines a front portion and a rear portion within the chassis, and wherein the midplane is configured to allow airflow therethrough;
a first printed circuit board disposed within the rear portion of the chassis in the upper airflow chamber, the first printed circuit board having a first end, a second end, and an opening formed therethrough, wherein the first end of the first printed circuit board is operatively coupled to the midplane;
a second printed circuit board disposed within the rear portion of the chassis in the lower airflow chamber, the second printed circuit board having a first end and a second end, wherein the first end of the second printed circuit board is operatively coupled to the midplane;
a fan module disposed within the rear portion of the chassis in the central airflow chamber and operatively coupled to the midplane, wherein the fan module is configured to draw air from the front portion of the chassis to the rear portion of the chassis through each of the upper airflow chamber, the central airflow chamber, and the lower airflow chamber,
wherein the opening formed through the first printed circuit board is configured to allow airflow therethrough.

2. The system of claim 1 , further comprising an air guide panel disposed within the rear portion of the chassis in the lower airflow chamber between the second printed circuit board and the central airflow chamber, the air guide panel having a first end, a second end, and an opening formed through the second end of the air guide panel configured to allow airflow therethrough.

3. The system of claim 2 , wherein the opening formed through the second end of the air guide panel is positioned closer to an end of the rear portion of the chassis than to the midplane.

4. The system of claim 1 , wherein the second printed circuit board comprises an opening formed therethrough, and the opening formed through the second printed circuit board is configured to allow airflow therethrough.

5. The system of claim 4 , wherein the opening formed through the second printed circuit board is positioned closer to an end of the rear portion of the chassis than to the midplane.

6. The system of claim 1 , wherein the opening formed through the first printed circuit board is positioned closer to an end of the rear portion of the chassis than to the midplane.

7. The system of claim 1 , wherein airflow through both the upper airflow chamber and through the lower airflow chamber are configured to mix in at least a portion of the central airflow chamber.

8. The system of claim 1 , wherein the first printed circuit board is substantially identical to the second printed circuit board.

9. The system of claim 1 , wherein the first printed circuit board and the second printed circuit board are both oriented in a first direction.

10. The system of claim 9 , wherein both the first printed circuit board and the second printed circuit board have components mounted on a top surface thereof when the first printed circuit board and the second printed circuit board are operatively coupled to the midplane.

11. The system of claim 1 , wherein the chassis further comprises a power supply airflow chamber formed longitudinally therethrough.

12. The system of claim 11 , wherein airflow through the power supply airflow chamber is isolated from each of the upper airflow chamber, the central airflow chamber, and the lower airflow chamber.

13. The system of claim 1 , wherein the central airflow chamber in the front portion of the chassis is configured to receive a plurality of flash modules.

14. The system of claim 1 , wherein the central airflow chamber in the rear portion of the chassis is configured to receive a plurality of fan modules.

15. The system of claim 14 , wherein the midplane is configured to operatively couple to the plurality of fan modules.

16. The system of claim 15 , wherein each of the plurality of fan modules is configured to allow airflow therethrough.

17. The system of claim 13 , wherein the midplane is configured to operatively couple to the plurality of flash modules.

18. The system of claim 17 , wherein airflow is allowed between the plurality of flash modules when the plurality of flash modules are operatively coupled to the midplane.

19. A system, comprising:
a chassis having a longitudinal axis defined therethrough and an upper airflow chamber, a central airflow chamber, and a lower airflow chamber formed longitudinally therethrough;
a midplane secured within the chassis in a direction perpendicular to the longitudinal axis defined through the chassis, wherein the midplane defines a front portion and a rear portion within the chassis, and wherein the midplane is configured to allow airflow therethrough;
a first printed circuit board disposed within the rear portion of the chassis in the upper airflow chamber, the first printed circuit board having a first end, a second end, and an opening formed therethrough, wherein the first end of the first printed circuit board is operatively coupled to the midplane;
a second printed circuit board disposed within the rear portion of the chassis in the lower airflow chamber, the second printed circuit board having a first end and a second end, wherein the first end of the second printed circuit board is operatively coupled to the midplane;
a third printed circuit board disposed within the front portion of the chassis in the upper airflow chamber, the third printed circuit board having a first end, a second end, and an opening formed therethrough, wherein the second end of the third printed circuit board is operatively coupled to the midplane;
a fourth printed circuit board disposed within the front portion of the chassis in the lower airflow chamber, the fourth printed circuit board having a first end and a second end, wherein the second end of the fourth printed circuit board is operatively coupled to the midplane;
a first air guide panel disposed within the rear portion of the chassis in the lower airflow chamber between the second printed circuit board and the central airflow chamber, the first air guide panel having a first end, a second end, and an opening formed through the second end of the air guide panel;
a second air guide panel disposed within the front portion of the chassis in the lower chamber between the fourth printed circuit board and the central airflow chamber, the second air guide panel having a first end and a second end; and
a fan module disposed within the rear portion of the chassis in the central airflow chamber and operatively coupled to the midplane, wherein the fan module is configured to draw air from the front portion of the chassis to the rear portion of the chassis through each of the upper airflow chamber, the central airflow chamber, and the lower airflow chamber,
wherein the opening formed through the first printed circuit board and the opening formed through the first air guide panel are configured to allow airflow therethrough.

20. A chassis, comprising:
an upper airflow chamber;
a central airflow chamber disposed below the upper airflow chamber and having flash modules disposed therein;
a lower airflow chamber disposed below both the

Assignees

• Emc Corp

Inventors

• Frank Christopher
• Olesiewicz Timothy

Classifications

• H05K7/1445

  with double-sided connections · CPC title

• H05K9/0081

  Electromagnetic shielding materials, e.g. EMI, RFI shielding (H05K9/0003 takes precedence) · CPC title

• H05K7/1424

  Card cages · CPC title

• G06F1/182

  with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI] · CPC title

• H05K7/20136 Primary

  Forced ventilation, e.g. by fans (H05K7/202 takes precedence) · CPC title