Modular electronic prototyping platforms
US-12177969-B2 · Dec 24, 2024 · US
US9398693B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9398693-B2 |
| Application number | US-201414300797-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 10, 2014 |
| Priority date | Jun 13, 2013 |
| Publication date | Jul 19, 2016 |
| Grant date | Jul 19, 2016 |
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A capacitor arrangement structure includes: a first wiring pattern; a second wiring pattern; a first electrode pattern that protrudes from the first wiring pattern toward the second wiring pattern; a second electrode pattern that protrudes from the second wiring pattern toward the first wiring pattern so as to run in parallel to the first electrode pattern; and a plurality of capacitors that are arranged in parallel between the first electrode pattern and the second electrode pattern.
Opening claim text (preview).
What is claimed is: 1. A capacitor arrangement structure comprising: a first wiring pattern; a second wiring pattern; a first electrode pattern that protrudes from the first wiring pattern toward the second wiring pattern; a second electrode pattern that protrudes from the second wiring pattern toward the first wiring pattern so as to run in parallel to the first electrode pattern; and a plurality of capacitors that are arranged in parallel between the first electrode pattern and the second electrode pattern. 2. The capacitor arrangement structure according to claim 1 , wherein a plurality of paths each of which extends the first wiring pattern and the second wiring pattern via any one of the capacitors are included, and a plurality of the paths has the same resistance. 3. The capacitor arrangement structure according to claim 1 , wherein the first electrode pattern and the second electrode pattern are alternately arranged. 4. The capacitor arrangement structure according to claim 3 , wherein a plurality of the first electrode patterns have mutually different resistances depending on a length of a path from a current source connected to the first wiring pattern. 5. The capacitor arrangement structure according to claim 3 , wherein, among a plurality of the first electrode patterns, an electrode pattern that has a longer path from a current source connected to the first wiring pattern has a resistance lower than an electrode pattern that has a shorter path from the current source. 6. The capacitor arrangement structure according to claim 4 , wherein the plurality of the first electrode patterns have mutually different resistances at predetermined positions. 7. The capacitor arrangement structure according to claim 6 , wherein cross-sectional areas of the predetermined positions are mutually different. 8. The capacitor arrangement structure according to claim 7 , wherein amounts of a solder at the predetermined positions are mutually different. 9. The capacitor arrangement structure according to claim 7 , wherein magnitudes of separate patterns connected to the predetermined positions are mutually different. 10. The capacitor arrangement structure according to claim 7 , wherein notches are disposed at the predetermined positions and magnitudes of the notches are mutually different. 11. The capacitor arrangement structure according to claim 6 , wherein the predetermined positions are root sections between the capacitor and the first wiring pattern. 12. The capacitor arrangement structure according to claim 1 , further comprising a current source that is a generator of a ripple current, which is connected to the first wiring pattern and the second wiring pattern and inverts a direction of electric conduction between the first wiring pattern and the second wiring pattern. 13. A method of mounting a capacitor comprising: arranging a plurality of capacitors in parallel between a plurality of first electrode patterns that protrude from a first wiring pattern toward a second wiring pattern and a second electrode pattern that protrudes from the second wiring pattern toward the first wiring pattern so as to be sandwiched by the first electrode patterns; and adjusting resistances of the first electrode patterns depending on a length of a path from a current source connected to the first wiring pattern.
Printed elements for providing electric connections to or between printed circuits · CPC title
incorporating printed inductors · CPC title
Varying thickness of a single conductor; Conductors in the same plane having different thicknesses · CPC title
associated with surface mounted components · CPC title
incorporating printed capacitors · CPC title
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