Method for manufacturing semiconductor device and semiconductor device

US9397474B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9397474-B2
Application numberUS-201414497393-A
CountryUS
Kind codeB2
Filing dateSep 26, 2014
Priority dateJan 10, 2014
Publication dateJul 19, 2016
Grant dateJul 19, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for manufacturing a semiconductor device includes forming a lower light confinement layer on a substrate, a light absorption layer on the lower light confinement layer, and an upper light confinement layer on the light absorption layer; and removing parts of these layers to form an optical modulator, forming a laser section having a diffraction grating in a portion of the substrate where the optical modulator is not present, forming a diffusion constraining layer, which constrains diffusion of a dopant, on the upper light confinement layer, and forming a contact layer on the laser section and the diffusion constraining layer. The same dopant is present in the contact layer and the upper light confinement layer.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for manufacturing a semiconductor device, comprising: forming a lower light confinement layer on a substrate, an undoped light absorption layer on the lower light confinement layer, and an upper light confinement layer on the undoped light absorption layer, wherein the upper light confinement layer includes one of Be and Zn as a dopant; removing parts of the lower light confinement layer, the undoped light absorption layer, and the upper light con…

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What does patent US9397474B2 cover?
A method for manufacturing a semiconductor device includes forming a lower light confinement layer on a substrate, a light absorption layer on the lower light confinement layer, and an upper light confinement layer on the light absorption layer; and removing parts of these layers to form an optical modulator, forming a laser section having a diffraction grating in a portion of the substrate whe…
Who is the assignee on this patent?
Mitsubishi Electric Corp
What technology area does this patent fall under?
Primary CPC classification H01S5/0265. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jul 19 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).