Electromagnetic coupling structure, multilayered transmission line plate, method for producing electromagnetic coupling structure, and method for producing multilayered transmission line plate

US9397381B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9397381-B2
Application numberUS-201113983796-A
CountryUS
Kind codeB2
Filing dateNov 4, 2011
Priority dateFeb 8, 2011
Publication dateJul 19, 2016
Grant dateJul 19, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

This electromagnetic coupling structure includes a laminated body that is laminated with an inner dielectric layer interposed between inner conductive layers, one pair of outer dielectric layers facing each other with the laminated body interposed therebetween, and one pair of outer conductive layers facing each other with the one pair of outer dielectric layers interposed therebetween. The one pair of outer conductive layers include wiring portions and conductive patch portions disposed at front ends of the wiring portions, and the conductive patch portions have portions longer than the wiring portions in a direction perpendicular to an extending direction of the wiring portions. In the laminated body, a hole passing through the inner dielectric layer and the inner conductive layers is arranged, and the one pair of outer conductive layers are electromagnetically coupled through a metal film formed inside the hole.

First claim

Opening claim text (preview).

The invention claimed is: 1. An electromagnetic coupling structure used in a frequency band of a microwave zone, the electromagnetic coupling structure comprising: a laminated body that is laminated with an inner dielectric layer interposed between inner conductive layers that are a plurality of ground layers; one pair of outer dielectric layers that face each other with the laminated body interposed between the outer dielectric layers; and one pair of outer conductive layers that face each other with the one pair of outer dielectric layers interposed between the outer conductive layers, wherein each one of the one pair of outer conductive layers includes a wiring portion and a conductive patch portion disposed at a front end of the wiring portion, the conductive patch portion has a portion longer than a width of the wiring portion in a direction perpendicular to an extending direction of the wiring portion, a hole passing through the inner dielectric layer and the inner conductive layers that are the plurality of ground layers is formed in the laminated body, and a tube-shaped metal film formed on an inner wall of the hole electrically connecting the inner conductive layers that are a plurality of ground layers, whereby the one pair of outer conductive layers are electromagnetically coupled. 2. An electromagnetic coupling structure used in a frequency band of a microwave zone, wherein a first conductive layer, a first dielectric layer, a second conductive layer, a second dielectric layer, a third conductive layer, a third dielectric layer, and a fourth conductive layer are stacked in this order, each one of the first and fourth conductive layers includes a wiring portion and a conductive patch portion disposed at a front end of the wiring portion, the conductive patch portion has a portion longer than a width of the wiring portion in a direction perpendicular to an extending direction of the wiring portion, a hole passing through the second conductive layer, the second dielectric layer, and the third conductive layer is formed, and a tube-shaped metal film formed on an inner wall of the hole electrically connecting the second conductive layer and the third conductive layer to each other, whereby the first conductive layer and the fourth conductive layer are electromagnetically coupled. 3. The electromagnetic coupling structure according to claim 1 , wherein the tube-shaped metal film is a plating film. 4. A multilayered transmission line plate used in a frequency band of a microwave zone, the multilayered transmission line plate comprising: a laminated body that is laminated with an inner dielectric layer interposed between inner conductive layers that are a plurality of ground layers; one pair of outer dielectric layers that face each other with the laminated body interposed between the outer dielectric layers; and one pair of outer conductive layers that face each other with the one pair of outer dielectric layers interposed between the outer conductive layers and forms transmission lines, wherein each one of the one pair of outer conductive layers includes a wiring portion and a conductive patch portion disposed at a front end of the wiring portion, the conductive patch portion has a portion longer than a width of the wiring portion in a direction perpendicular to an extending direction of the wiring portion, a hole passing through the inner dielectric layer and the inner conductive layers that are the plurality of ground layers is formed in the laminated body, and a tube-shaped metal film formed on an inner wall of the hole electrically connecting the inner conductive layers that are a plurality of ground layers, whereby the one pair of outer conductive layers are electromagnetically coupled. 5. A multilayered transmission line plate used in a frequency band of a microwave zone, wherein a first conductive layer forming a first transmission line, a first dielectric layer, a second conductive layer, a second dielectric layer, a third conductive layer, a third dielectric layer, and a fourth conductive layer forming a second transmission line are stacked in this order, each one of the first and fourth conductive layers includes a wiring portion and a conductive patch portion disposed at a front end of the wiring portion, the conductive patch portion has a portion longer than a width of the wiring portion in a direction perpendicular to an extending direction of the wiring portion, a hole passing through the second conductive layer, the second dielectric layer, and the third conductive layer is formed, and a tube-shaped metal film formed on an inner wall of the hole electrically connecting the second conductive layer and the third conductive layer to each other, whereby the first conductive layer and the fourth conductive layer are electromagnetically coupled. 6. The multilayered transmission line plate according to claim 4 , wherein the tube-shaped metal film is a plating film. 7. The electromagnetic coupling structure according to claim 1 , wherein a width of the hole in a direction perpendicular to the extending direction of the wiring portion is set to be an effective wavelength corresponding to a frequency used in the frequency band or less. 8. The multilayered transmission line plate according to claim 4 , wherein a width of the hole in a direction perpendicular to the extending direction of the wiring portion is set to be an effective wavelength corresponding to a frequency used in the frequency band or less. 9. The electromagnetic coupling structure according to claim 1 , wherein a dielectric having dielectric loss tangent of 0 to 0.0300 at 10 GHz is filled in the hole in which the tube-shaped metal film is formed. 10. The electromagnetic coupling structure according to claim 1 , wherein air is filled in the hole in which the tube-shaped metal film is formed. 11. The multilayered transmission line plate according to claim 4 , wherein a dielectric having dielectric loss tangent of 0 to 0.0300 at 10 GHz is filled in the hole in which the tube-shaped metal film is formed. 12. The multilayered transmission line plate according to claim 4 , wherein air is filled in the hole in which the tube-shaped metal film is formed.

Assignees

Inventors

Classifications

  • Plated through-holes or plated blind vias filled with insulating material · CPC title

  • Manufacturing waveguides or transmission lines of the waveguide type · CPC title

  • H01P5/00Primary

    Coupling devices of the waveguide type · CPC title

  • Dielectric details, e.g. changing the dielectric material around a transmission line · CPC title

  • Antenna or wave energy "plumbing" making · CPC title

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What does patent US9397381B2 cover?
This electromagnetic coupling structure includes a laminated body that is laminated with an inner dielectric layer interposed between inner conductive layers, one pair of outer dielectric layers facing each other with the laminated body interposed therebetween, and one pair of outer conductive layers facing each other with the one pair of outer dielectric layers interposed therebetween. The one…
Who is the assignee on this patent?
Kondou Yuusuke, Mizushima Etsuo, Watanabe Yasushi, and 2 more
What technology area does this patent fall under?
Primary CPC classification H01P5/00. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jul 19 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).