UV- and heat-resistant optoelectronic semiconductor component

Patent metadata

Field	Value
Publication number	US-9397271-B2
Application number	US-92224009-A
Country	US
Kind code	B2
Filing date	Apr 20, 2009
Priority date	May 28, 2008
Publication date	Jul 19, 2016
Grant date	Jul 19, 2016

Abstract

An optoelectronic semiconductor component includes a connection carrier with at least two connection points and a carrier top that in a main side of the connection carrier, wherein the connection carrier configured with a silicone matrix with a fiber reinforcement, at least one optoelectronic semiconductor chip mounted on the connection carrier and in direct contact therewith, an annular potting body includes a soft silicone on the carrier top and in direct contact with the carrier top, but not in direct contact with the semiconductor chip, and a glass body comprising a glass sheet applied over the semiconductor chip and over sides of the potting body remote from the connection carrier, thereby forming a space between the semiconductor chip and the potting body.

First claim

The invention claimed is:

1. An optoelectronic semiconductor component comprising:
a connection carrier with at least two connection points and a carrier top that is a main side of the connection carrier, wherein the connection carrier is configured with a silicone matrix with a fiber reinforcement,
at least one optoelectronic semiconductor chip mounted on the connection carrier on the carrier top and in direct contact therewith,
an annular potting body comprising a soft silicone on the carrier top and in direct contact with the carrier top, but not in direct contact with the semiconductor chip, the potting body has two separate rectangular shaped areas when seen in a cross-sectional view perpendicular with the carrier top, a height of each one of the rectangular shaped areas is smaller than individual widths of the rectangular shaped areas such that a contact surface between the potting body and the connection carrier is formed to ensure adhesion between the potting body and the connection carrier, and
a glass body comprising a plane parallel glass sheet applied over the semiconductor chip and over sides of the potting body remote from the connection carrier, thereby forming a space filled with a gas between the semiconductor chip and the potting body,
wherein the connection points at the carrier top proceed to a carrier bottom opposite the carrier top by vias which completely run through the connection carrier, the vias are through holes filled with an electrically conductive material,
electrical connection points at the carrier bottom project beyond the carrier bottom,
coefficients of thermal expansion of the connection carrier and the potting body are substantially identical,
the glass body and the potting body contain mutually different admixtures to adjust the physical and chemical characteristics of the potting body and the glass body,
the glass body, the potting body and the connection carrier terminate flush with each other on lateral sides of the semiconductor component, and
the connection carrier, the potting body and the glass body are translucent to radiation to be received or emitted by the semiconductor chip.

2. The component according to claim 1 , wherein the fiber reinforcement is formed of glass fibers.

3. The component according to claim 1 , wherein the fiber reinforcement is surrounded completely by the silicone matrix.

Assignees

• Jaeger Harald
• Sorg Joerg Erich
• Kashiwagi Tsutomu
• Shiobara Toshio
• Osram Opto Semiconductors Gmbh
• Shinetsu Chemical Co

Inventors

• Jaeger Harald
• Sorg Joerg Erich
• Kashiwagi Tsutomu
• Shiobara Toshio

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H05K2201/0162

  Silicon containing polymer, e.g. silicone · CPC title

• H05K1/0366

  reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence) · CPC title

• H10H20/8506 Primary

  Containers · CPC title

• H01L2224/48091

  Electricity · mapped topic