Semiconductor structure with flush shallow trench isolation and gate oxide and method of manufacturing the same
US-2024395883-A1 · Nov 28, 2024 · US
US9397191B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9397191-B2 |
| Application number | US-201514922308-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 26, 2015 |
| Priority date | Jun 7, 2013 |
| Publication date | Jul 19, 2016 |
| Grant date | Jul 19, 2016 |
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An isolation region is formed in a semiconductor substrate to laterally define and electrically isolate a device region and first and second laterally adjacent well regions are formed in the device region. A gate structure is formed above the device region such that the first well region extends below an entirety of the gate structure and a well region interface formed between the first and second well regions is laterally offset from a drain-side edge of the gate structure. Source and drain regions are formed in the device region such that the source region extends laterally from a source-side edge of the gate structure and across a first portion of the first well region to a first inner edge of the isolation region and the drain region extends laterally from the drain-side edge and across a second portion of the first well region.
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What is claimed: 1. A method, comprising: forming an isolation region in a semiconductor substrate so as to laterally define and electrically isolate a device region; forming a first well region doped with a first type of dopant material in said device region; forming a second well region doped with a second type of dopant material in said device region laterally adjacent to said first well region, wherein said second type of dopant material has an opposite conductivity type f…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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