Semiconductor device
US-2015187951-A1 · Jul 2, 2015 · US
Semiconductor device
US9397149B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9397149-B2 |
| Application number | US-201414581089-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 23, 2014 |
| Priority date | Dec 27, 2013 |
| Publication date | Jul 19, 2016 |
| Grant date | Jul 19, 2016 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A display device that includes a first flexible substrate, a first bonding layer over the first flexible substrate, a first insulating film over the first bonding layer, a first element layer over the first insulating film, a second element layer over the first element layer, a second insulating film over the second element layer, a second bonding layer over the second insulating film, and a second flexible substrate over the second bonding layer is provided. The first element layer includes a pixel portion and a circuit portion. The pixel portion includes a display element and a first transistor, and the circuit portion includes a second transistor. The second element layer includes a coloring layer and a light-blocking layer.
First claim
Opening claim text (preview).
What is claimed is: 1. A display device comprising: a first flexible substrate; a first bonding layer over the first flexible substrate; a first insulating film over the first bonding layer; a first element layer over the first insulating film; a second element layer over the first element layer; a second insulating film over the second element layer; a second bonding layer over the second insulating film; and a second flexible substrate over the second bonding layer…
Assignees
Inventors
Classifications
Cross-Sectional Technologies · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H10D86/423Primary
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9397149B2 cover?
- A display device that includes a first flexible substrate, a first bonding layer over the first flexible substrate, a first insulating film over the first bonding layer, a first element layer over the first insulating film, a second element layer over the first element layer, a second insulating film over the second element layer, a second bonding layer over the second insulating film, and a se…
- Who is the assignee on this patent?
- Semiconductor Energy Lab
- What technology area does this patent fall under?
- Primary CPC classification H10D86/423. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jul 19 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 11 related publications on this page (citations in our corpus or others sharing the same primary CPC).