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Device having reduced pad peeling during tensile stress testing and a method of forming thereof
US9396993B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9396993-B2 |
| Application number | US-201414256241-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 18, 2014 |
| Priority date | Jun 19, 2013 |
| Publication date | Jul 19, 2016 |
| Grant date | Jul 19, 2016 |
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Abstract
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The present disclosure relates to a method for forming a semiconductor device. The method includes forming a first aluminum pad layer on a metal layer, forming an adhesion layer on the first aluminum pad layer, etching the adhesion layer so as to form a patterned adhesion layer, and forming a second aluminum pad layer on the first aluminum pad layer and the patterned adhesion layer.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for forming a semiconductor device, comprising: forming a first aluminum pad layer on a metal layer; forming an adhesion layer on the first aluminum pad layer; etching the adhesion layer so as to form a patterned adhesion layer; forming a second aluminum pad layer on the first aluminum pad layer and the patterned adhesion layer; and reducing a width of the first aluminum pad layer after a plurality of spaced portions of the patterned adhesio…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9396993B2 cover?
- The present disclosure relates to a method for forming a semiconductor device. The method includes forming a first aluminum pad layer on a metal layer, forming an adhesion layer on the first aluminum pad layer, etching the adhesion layer so as to form a patterned adhesion layer, and forming a second aluminum pad layer on the first aluminum pad layer and the patterned adhesion layer.
- Who is the assignee on this patent?
- Semiconductor Mfg Int Shanghai
- What technology area does this patent fall under?
- Primary CPC classification H10W72/90. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jul 19 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).