Method of manufacturing coil substrate and inductor

Patent metadata

Field	Value
Publication number	US-9396874-B2
Application number	US-201414488400-A
Country	US
Kind code	B2
Filing date	Sep 17, 2014
Priority date	Oct 11, 2013
Publication date	Jul 19, 2016
Grant date	Jul 19, 2016

Abstract

A method of manufacturing a coil substrate, includes forming a plurality of structures, each of the structures including a first insulating layer and a metal layer formed on the first insulating layer; forming a stacked structure by stacking the structures while connecting the metal layers of the adjacent structures in series; and shaping the stacked structure such that the metal layers of the structures are shaped at the same time to be in shapes of wirings, each becomes a part of a spiral-shaped coil, to form the spiral-shaped coil in which the wirings of the adjacent structures are connected in series.

First claim

What is claimed is:

1. A method of manufacturing a coil substrate, comprising:
forming a plurality of structures, each of the structures including a first insulating layer and a metal layer formed on the first insulating layer;
forming a stacked structure by stacking the structures while connecting the metal layers of the adjacent structures in series; and
shaping the stacked structure such that the metal layers of the structures are shaped at the same time to be in shapes of wirings, each becomes a part of a spiral-shaped coil, to form the spiral-shaped coil in which the wirings of the adjacent structures are connected in series,
wherein in the shaping, unnecessary parts of each of the structures are removed at the same time such that an outer shape of each of the metal layers is shaped at the same time and a through hole around which the spiral-shaped coil is formed is provided among the metal layers at the same time.

2. The method of manufacturing the coil substrate according to claim 1 ,
wherein in the forming the plurality of structures, each of the structures is formed to include the first insulating layer, the metal layer formed on the first insulating layer and a second insulating layer formed on the first insulating layer such as to cover the metal layer.

3. The method of manufacturing the coil substrate according to claim 1 ,
wherein the forming the plurality of structures includes
forming a first structure on a first substrate, and
forming a second structure on a second substrate, and

wherein the forming the stacked structure includes
facing the first structure and the second structure to be stacked such that the first substrate and the second substrate are positioned outside,

removing the second substrate, and
connecting the metal layer of the first structure and the metal layer of the second structure in series.

4. The method of manufacturing the coil substrate according to claim 1 ,
wherein in the shaping the stacked structure, the stacked structure is shaped by press working.

5. The method of manufacturing the coil substrate according to claim 1 ,
wherein in the shaping the stacked structure, the stacked structure is shaped by laser processing.

6. The method of manufacturing the coil substrate according to claim 1 , further comprising:
after the shaping the stacked structure, forming an insulating film that covers surfaces of the stacked structure.

7. The method of manufacturing the coil substrate according to claim 6 ,
wherein the insulating film is formed so as to cover the end surfaces of the wirings exposed in the shaping.

8. The method of manufacturing the coil substrate according to claim 6 ,
wherein the insulating film is made of insulating resin.

9. The method of manufacturing the coil substrate according to claim 6 ,
wherein the insulating film is formed by electrodeposition coating.

10. The method of manufacturing the coil substrate according to claim 1 ,
wherein in the shaping the stacked structure, the spiral-shaped coil and a linking portion that supports the spiral-shaped coil are formed.

11. The method of manufacturing the coil substrate according to claim 1 ,
wherein the stacked structure is formed to include a plurality of individual areas, and
wherein in the shaping the stacked structure, a plurality of the spiral-shaped coils in the plurality of individual areas, respectively, and a linking portion that supports and links the plurality of spiral-shaped coils are formed.

12. The method of manufacturing the coil substrate according to claim 1 ,
wherein the first insulating layer is made of insulating resin.

13. The method of manufacturing the coil substrate according to claim 1 ,
wherein in the shaping, unnecessary parts of the first insulating layer and the metal layer of each of the structures are removed.

14. A method of manufacturing an inductor comprising:
providing a component including a magnetic material in the through hole of the coil substrate according to claim 1 ; and
forming a first electrode and a second electrode that are connected to one end and the other end of the spiral-shaped coil respectively.

15. A method of manufacturing an inductor comprising:
cutting the linking portion of the coil substrate according to claim 11 so as to expose one end and the other end of each of the spiral-shaped coils; and
forming a first electrode and a second electrode that are connected to the one end and the other end of each of the spiral-shaped coils respectively.

Assignees

• Shinko Electric Ind Co

Inventors

• Nakamura Atsushi
• Nakanishi Tsukasa
• Sasada Yoichi

Classifications

• H01F27/2804 Primary

  Printed windings · CPC title

• H01F41/04

  for manufacturing coils {(coils for transformer or inductances H01F27/28)} · CPC title

• Y10T156/10

  Methods of surface bonding and/or assembly therefor · CPC title

• Y10T29/49073

  by assembling coil and core · CPC title

• H01F27/323

  Insulation between winding turns, between winding layers · CPC title