LED lamp with LED assembly on a heat sink tower

Patent metadata

Field	Value
Publication number	US-9395074-B2
Application number	US-201313939827-A
Country	US
Kind code	B2
Filing date	Jul 11, 2013
Priority date	Apr 13, 2012
Publication date	Jul 19, 2016
Grant date	Jul 19, 2016

Abstract

A lamp has an optically transmissive enclosure and a base defining a longitudinal axis of the lamp extending from the base to the free end of the enclosure. A heat sink is at least partially located in the enclosure and includes a tower that extends along the longitudinal axis of the lamp. An LED assembly is positioned in the optically transmissive enclosure. The LED assembly comprises a lead frame circuit or a flex circuit where LEDs are attached to the circuits. The lead frame and flex circuit are formed into a three-dimensional shape and are thermally coupled to the tower.

First claim

The invention claimed is:

1. A lamp comprising:
an optically transmissive enclosure and a base defining a longitudinal axis of the lamp extending from the base to the free end of the enclosure;
a heat sink comprising a tower that is at least partially located in the enclosure, the tower extending along the longitudinal axis and comprising an outer periphery and a first end that extends to a center of the enclosure;
an LED assembly in the optically transmissive enclosure, the LED assembly comprising a lead frame circuit and a plurality of LEDs attached to the lead frame circuit at solder joints such that the solder joints mechanically hold the lead frame circuit together as well as provide the electrical connections to anode and cathode sides of the lead frame, the lead frame being thermally coupled to the tower and formed into a three-dimensional shape where the lead frame wraps around the outer periphery of the tower such that the plurality of LEDs are disposed between the base and the first end of the tower.

2. The lamp of claim 1 comprising a dielectric layer between the heat sink and the lead frame to electrically isolate the heat sink from the lead frame.

3. The lamp of claim 2 wherein the dielectric layer comprises at least one of paint, dip coat and film.

4. The lamp of claim 2 wherein the dielectric layer is thermally transmissive such that heat generated by the LED assembly is conducted to the heat sink.

5. The lamp of claim 1 wherein an exposed surface of the lead frame is coated in white.

6. The lamp of claim 1 wherein the lead frame is mounted directly to the tower.

7. The lamp of claim 1 wherein the lead frame is formed into a cylindrical shape where the interior circumference of the lead frame is slightly smaller than the exterior circumference of the tower such that the lead frame is slightly deformed and expanded when positioned on the tower.

8. The lamp of claim 1 wherein a mechanical retainer is formed on the lead frame that engages the tower.

9. The lamp of claim 1 wherein adhesive secures the lead frame to the tower.

10. A lamp comprising:
an optically transmissive enclosure and a base defining a longitudinal axis of the lamp extending from the base to the free end of the enclosure;
a heat sink comprising a tower that is at least partially located in the enclosure, the tower extending along the longitudinal axis and comprising an outer periphery and a first end that extends to a center of the enclosure;
an LED assembly in the optically transmissive enclosure, the LED assembly comprising a flex circuit and a plurality of LEDs physically attached to the flex circuit, the flex circuit being thermally coupled to the tower and formed into a three-dimensional shape where the flex circuit wraps around the outer periphery of the tower such that the plurality of LEDs are disposed between the base and the first end of the tower.

11. The lamp of claim 10 wherein the flex circuit comprises a flexible conductive layer supported on a dielectric film.

12. The lamp of claim 11 wherein the plurality of LEDs are soldered to the conductive layer.

13. The lamp of claim 10 wherein a white cover layer covers an exposed surface of the flex circuit.

14. The lamp of claim 10 wherein the dielectric film has a thickness selected such that heat is transferred from the plurality of LEDs to the heat sink through the film.

15. The lamp of claim 10 wherein the flex circuit has a first free end and a second free end where the flex circuit is wrapped around the tower and the first free end is secured to the second free end.

16. The lamp of claim 10 wherein a mechanical connection secures the first free end and the second free end.

17. The lamp of claim 10 wherein the first free end and the second free end are heat staked to one another.

18. The lamp of claim 10 wherein the first free end supports a first LED and the second free end defines an aperture where the aperture receives the first LED.

Assignees

• Cree Inc

Inventors

• Hussell Christopher P
• Edmond John Adam
• Negley Gerald H
• Progl Curt
• Edmond Mark
• Athalye Praneet
• Swoboda Charles M
• Van De Ven Antony Paul
• Pickard Paul Kenneth
• Reier Bart P
• Lay James Michael
• Lopez Peter E
• Adams Ed

Classifications

• F21Y2107/30

  on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section · CPC title

• Y02B20/30

  Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED] · CPC title

• F21K9/238

  Arrangement or mounting of circuit elements integrated in the light source · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• F21V23/06

  the elements being coupling devices {, e.g. connectors} · CPC title