Multilayered heat-recoverable article, wire splice, wire harness, and method for producing adhesive for multilayered heat-recoverable article

US9393755B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9393755-B2
Application numberUS-201514890479-A
CountryUS
Kind codeB2
Filing dateMar 24, 2015
Priority dateMar 31, 2014
Publication dateJul 19, 2016
Grant dateJul 19, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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Abstract

Official abstract text for this publication.

An object of the present invention is to provide a multilayered heat-recoverable article in which an adhesive layer easily flows during heat shrinkage to ensure adhesiveness with an adherend and does not flow out from a base material layer after heat shrinkage, and a wire splice and a wire harness that include a tube formed by thermally shrinking such a multilayered heat-recoverable article. The multilayered heat-recoverable article ( 1 ) according to the present invention includes a cylindrical base material layer ( 10 ), and an adhesive layer ( 11 ) formed on an inner circumferential surface of the base material layer. The adhesive layer ( 11 ) is formed of a resin composition that contains a polyamide as a main component and that does not substantially contain an inorganic filler. The resin composition is cross-linked by irradiation with ionizing radiation. A shear viscosity of the adhesive layer ( 11 ) at 150° C. is 300 Pa·s or more at a shear rate of 0.01 s −1 and 200 Pa·s or less at a shear rate of 100 s −1 . The wire splice and the wire harness according to the present invention includes a tube formed by thermally shrinking the multilayered heat-recoverable article ( 1 ).

First claim

Opening claim text (preview).

The invention claimed is: 1. A multilayered heat-recoverable article comprising a cylindrical base material layer; and an adhesive layer formed on an inner circumferential surface of the base material layer, wherein the adhesive layer is formed of a resin composition that contains a polyamide as a main component and that does not substantially contain an inorganic filler, the resin composition is cross-linked by irradiation with ionizing radiation, and a shear viscosity of the adhesive layer at 150° C. is 300 Pa·s or more at a shear rate of 0.01 s −1 and 200 Pa·s or less at a shear rate of 100 s −1 . 2. The multilayered heat-recoverable article according to claim 1 , wherein the resin composition contains a very low-density polyethylene in an amount of 20% by mass or more. 3. The multilayered heat-recoverable article according to claim 1 , wherein the resin composition contains an ethylene copolymer in an amount of 20% by mass or more. 4. A wire splice comprising a plurality of wires each of which includes a conductor and an insulating layer formed on the outside of the conductor; and a tube adhering to a portion where the conductors of the wires are connected to each other, wherein the tube is formed by thermally shrinking the multilayered heat-recoverable according to claim 1 . 5. A wire harness comprising a plurality of wires each of which includes a conductor and an insulating layer formed on the outside of the conductor; and a tube adhering to the wires, wherein the tube is formed by thermally shrinking the multilayered heat-recoverable article according to claim 1 . 6. A method for producing an adhesive for a multilayered heat-recoverable article, the adhesive being formed of a resin composition that contains a polyamide as a main component and that does not substantially contain an inorganic filler, the method comprising: a step of irradiating the resin composition with ionizing radiation, wherein a dose of the ionizing radiation is controlled so that a shear viscosity of the adhesive at 150° C. is 300 Pa·s or more at a shear rate of 0.01 s −1 and 200 Pa·s or less at a shear rate of 100 s −1 . 7. The method for producing an adhesive for a multilayered heat-recoverable article according to claim 6 , wherein the dose of the ionizing radiation absorbed by the resin composition is 90 kJ/kg or more. 8. The method for producing an adhesive for a multilayered heat-recoverable article according to claim 6 , wherein the ionizing radiation is an electron beam.

Assignees

Inventors

Classifications

  • specially treated, e.g. irradiated · CPC title

  • Resin or rubber layer containing a blend of at least two different polymers · CPC title

  • Polyamides or polyesteramides · CPC title

  • using interposed adhesives or interposed materials with bonding properties · CPC title

  • comprising polyamides · CPC title

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What does patent US9393755B2 cover?
An object of the present invention is to provide a multilayered heat-recoverable article in which an adhesive layer easily flows during heat shrinkage to ensure adhesiveness with an adherend and does not flow out from a base material layer after heat shrinkage, and a wire splice and a wire harness that include a tube formed by thermally shrinking such a multilayered heat-recoverable article. Th…
Who is the assignee on this patent?
Sumitomo Electric Industries, Sumitomo Elec Fine Polymer Inc
What technology area does this patent fall under?
Primary CPC classification B32B1/08. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jul 19 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).