Measuring method of surface roughness of polishing pad

Patent metadata

Field	Value
Publication number	US-9393670-B2
Application number	US-201414463214-A
Country	US
Kind code	B2
Filing date	Aug 19, 2014
Priority date	Aug 22, 2013
Publication date	Jul 19, 2016
Grant date	Jul 19, 2016

Abstract

There is disclosed a measuring method of a surface roughness of a polishing pad which can measure a surface roughness index of the polishing pad showing a strong relationship with polishing performance. A method for measuring a surface roughness of a polishing pad includes acquiring an image of a surface of a polishing pad by using a laser microscope, selecting only a region which has a height larger than an average height from the acquired image, and calculating a surface roughness from only the selected region.

First claim

What is claimed is:

1. A method for measuring a surface roughness of a polishing pad, comprising:
acquiring an image of a surface of a polishing pad by using a laser microscope;
selecting only a region which has a height of the polishing pad larger than an average height calculated from the acquired image; and
calculating a surface roughness from only the selected region.

2. The method for measuring a surface roughness of a polishing pad according to claim 1 , wherein in the selecting the region, the region having an area of 500 μm 2 or less is selected.

3. The method for measuring a surface roughness of a polishing pad according to claim 1 , wherein in the acquiring the image, an area of the acquired image is 100000 μm 2 or less.

4. The method for measuring a surface roughness of a polishing pad according to claim 1 , wherein in the selecting the region, only the plural regions which have a height larger than the average height are selected from the acquired image.

5. The method for measuring a surface roughness of a polishing pad according to claim 4 , wherein in the determining the surface roughness, surface roughnesses respectively determined from calculation regions at a plurality of locations are averaged to thereby determine the surface roughness.

6. The method for measuring a surface roughness of a polishing pad according to claim 1 , wherein the calculated surface roughness is at least one of arithmetical mean deviation of the roughness profile (Ra), root mean square deviation of the roughness profile (Rq), maximum profile valley depth of the roughness profile (Ry), maximum profile peak height of the roughness profile (Rp), and maximum height of the roughness profile (Rz).

7. The method for measuring a surface roughness of a polishing pad according to claim 1 , wherein the calculated surface roughness is at least one of arithmetical mean deviation of the roughness profile (Ra) and root mean square deviation of the roughness profile (Rq).

8. The method for measuring a surface roughness of a polishing pad according to claim 1 , wherein in the selecting the region, the region is selected from a region which falls within top 30% of all the heights.

9. The method for measuring a surface roughness of a polishing pad according to claim 1 , wherein when a plane which is formed on reference points set by the laser microscope is assumed to be a reference plane, the height of the polishing pad is defined as a relative height from the reference plane to the surface of the polishing pad.

10. A CMP method comprising:
predicting polishing performance of CMP based on a surface roughness of a polishing pad which is measured by a method for measuring a surface roughness of a polishing pad;
the method for measuring a surface roughness of a polishing pad, comprising:
acquiring an image of a surface of the polishing pad by using a laser microscope;
selecting only a region which has a height of the polishing pad larger than an average height calculated from the acquired image; and
calculating the surface roughness from only the selected region.

11. The CMP method according to claim 10 , wherein at least one of polishing conditions and dressing conditions is adjusted based on the predicted polishing performance.

12. The CMP method according to claim 10 , wherein at least one of a lifetime of the polishing pad and a lifetime of a dresser is predicted based on the predicted polishing performance.

13. The CMP method according to claim 10 , wherein polishing conditions are adjusted based on the predicted polishing performance, and a substrate is polished under the adjusted polishing conditions.

14. The CMP method according to claim 10 , wherein polishing conditions are adjusted on the basis of the predicted polishing performance, and then a substrate is polished under the adjusted polishing conditions.

15. The CMP method according to claim 10 , wherein when a plane which is formed on reference points set by the laser microscope is assumed to be a reference plane, the height of the polishing pad is defined as a relative height from the reference plane to the surface of the polishing pad.

16. A CMP method comprising:
selecting dressing conditions for a surface of a polishing pad so that a surface roughness of the polishing pad which is measured by a method for measuring a surface roughness of a polishing pad becomes equal to a preset surface roughness;
the method for measuring a surface roughness of a polishing pad, comprising:
acquiring an image of a surface of the polishing pad by using a laser microscope;
selecting only a region which has a height of the polishing pad larger than an average height calculated from the acquired image; and
calculating the surface roughness from only the selected region.

17. The CMP method according to claim 16 , wherein at least one of a type of a dresser, a load during dressing, and the number of revolutions during the dressing is selected as the dressing conditions.

18. The CMP method according to claim 16 , wherein the surface of the polishing pad is dressed under the selected dressing conditions, and then a substrate is polished by the dressed polishing pad.

19. The CMP method according to claim 16 , wherein when a plane which is formed on reference points set by the laser microscope is assumed to be a reference plane, the height of the polishing pad is defined as a relative height from the reference plane to the surface of the polishing pad.

20. An apparatus for measuring a surface roughness of a polishing pad, comprising:
a laser microscope configured to acquire an image of a surface of a polishing pad; and
an image processing unit configured to select only a region which has a height of the polishing pad larger than an average height calculated from the acquired image; and configured to calculate a surface roughness from only the selected region.

Assignees

• Ebara Corp

Inventors

• Matsuo Hisanori

Classifications

• G01B11/303

  using photoelectric detection means · CPC title

• B24B37/005

  Control means for lapping machines or devices · CPC title

• B24B49/12 Primary

  involving optical means · CPC title

• B24B53/017

  Devices or means for dressing, cleaning or otherwise conditioning lapping tools · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title